{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T15:52:48Z","timestamp":1781884368263,"version":"3.54.5"},"reference-count":56,"publisher":"Association for Computing Machinery (ACM)","issue":"5","license":[{"start":{"date-parts":[[2024,8,14]],"date-time":"2024-08-14T00:00:00Z","timestamp":1723593600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation's","doi-asserted-by":"crossref","award":["CSR-2308530, CNS-1955353, IIS-1845922"],"award-info":[{"award-number":["CSR-2308530, CNS-1955353, IIS-1845922"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Embed. Comput. Syst."],"published-print":{"date-parts":[[2024,9,30]]},"abstract":"<jats:p>\n            Resistive random-access memory (ReRAM)-based processing-in-memory (PIM) architectures are used extensively to accelerate inferencing\/training with convolutional neural networks (CNNs). Three-dimensional (3D) integration is an enabling technology to integrate many PIM cores on a single chip. In this work, we propose the design of a\n            <jats:underline>t<\/jats:underline>\n            hermally\n            <jats:underline>e<\/jats:underline>\n            fficient data\n            <jats:underline>flo<\/jats:underline>\n            w-aware monolithic 3D (M3D)\n            <jats:underline>N<\/jats:underline>\n            oC architecture referred to as\n            <jats:italic>TEFLON<\/jats:italic>\n            to accelerate CNN inferencing without creating any thermal bottlenecks.\n            <jats:italic>TEFLON<\/jats:italic>\n            reduces the Energy-Delay-Product (EDP) by 42%, 46%, and 45% on an average compared to a conventional 3D mesh NoC for systems with 36-, 64-, and 100-PIM cores, respectively.\n            <jats:italic>TEFLON<\/jats:italic>\n            reduces the peak chip temperature by 25\n            <jats:italic>K<\/jats:italic>\n            and improves the inference accuracy by up to 11% compared to sole performance-optimized SFC-based counterpart for inferencing with diverse deep CNN models using CIFAR-10\/100 datasets on a 3D system with 100-PIM cores.\n          <\/jats:p>","DOI":"10.1145\/3665279","type":"journal-article","created":{"date-parts":[[2024,5,16]],"date-time":"2024-05-16T12:09:17Z","timestamp":1715861357000},"page":"1-23","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":8,"title":["TEFLON: Thermally Efficient Dataflow-aware 3D NoC for Accelerating CNN Inferencing on Manycore PIM Architectures"],"prefix":"10.1145","volume":"23","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9517-1280","authenticated-orcid":false,"given":"Gaurav","family":"Narang","sequence":"first","affiliation":[{"name":"Washington State University, Pullman, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8170-1161","authenticated-orcid":false,"given":"Chukwufumnanya","family":"Ogbogu","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3848-5301","authenticated-orcid":false,"given":"Janardhan Rao","family":"Doppa","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5930-8531","authenticated-orcid":false,"given":"Partha Pratim","family":"Pande","sequence":"additional","affiliation":[{"name":"Washington State University, Pullman, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2024,8,14]]},"reference":[{"key":"e_1_3_1_2_2","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218505"},{"key":"e_1_3_1_3_2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3220195"},{"key":"e_1_3_1_4_2","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116338"},{"key":"e_1_3_1_5_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3184464"},{"key":"e_1_3_1_6_2","doi-asserted-by":"publisher","DOI":"10.1145\/3195970.3196116"},{"key":"e_1_3_1_7_2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310400"},{"key":"e_1_3_1_8_2","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001140"},{"key":"e_1_3_1_9_2","first-page":"1","volume-title":"IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED\u201919)","author":"Liu X.","year":"2019","unstructured":"X. Liu, M. Zhou, T. Rosing, and J. Zhao. 2019. HR 3 AM: A heat resilient design for RRAM-based neuromorphic computing. In IEEE\/ACM International Symposium on Low Power Electronics and Design (ISLPED\u201919). 1\u20136."},{"key":"e_1_3_1_10_2","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001139"},{"key":"e_1_3_1_11_2","doi-asserted-by":"publisher","DOI":"10.1145\/3460233"},{"key":"e_1_3_1_12_2","doi-asserted-by":"publisher","DOI":"10.1145\/3564290"},{"key":"e_1_3_1_13_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3013194"},{"key":"e_1_3_1_14_2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3108628"},{"key":"e_1_3_1_15_2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9372091"},{"key":"e_1_3_1_16_2","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2016.7804405"},{"key":"e_1_3_1_17_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2018.8617955"},{"key":"e_1_3_1_18_2","doi-asserted-by":"publisher","DOI":"10.1145\/3195970.3196128"},{"key":"e_1_3_1_19_2","doi-asserted-by":"publisher","DOI":"10.23919\/DATE54114.2022.9774678"},{"key":"e_1_3_1_20_2","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2020.3015509"},{"key":"e_1_3_1_21_2","doi-asserted-by":"publisher","DOI":"10.1145\/3608098"},{"key":"e_1_3_1_22_2","volume-title":"Space-filling Curves","author":"Sagan H.","year":"2012","unstructured":"H. Sagan. 2012. Space-filling Curves. Springer Science & Business Media."},{"key":"e_1_3_1_23_2","doi-asserted-by":"publisher","DOI":"10.1109\/83.499920"},{"key":"e_1_3_1_24_2","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPSW.2015.71"},{"key":"e_1_3_1_25_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICPP.2013.26"},{"key":"e_1_3_1_26_2","doi-asserted-by":"publisher","DOI":"10.1109\/BIBM.2009.71"},{"key":"e_1_3_1_27_2","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6641\/ac1052"},{"key":"e_1_3_1_28_2","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415665"},{"key":"e_1_3_1_29_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643444"},{"key":"e_1_3_1_30_2","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2017.55"},{"key":"e_1_3_1_31_2","volume-title":"ACM\/IEEE 48th Annual International Symposium on Computer Architecture (ISCA'21)","unstructured":"G. Yuan, P. Behnam, Z. Li, A. Shafiee, S. Lin, X. Ma, H. Liu, X. Qian, M. Bojnordi, Y. Wang, and C. Ding. 2021. Forms: Fine-grained polarized reram-based in-situ computation for mixed-signal dnn accelerator. In ACM\/IEEE 48th Annual International Symposium on Computer Architecture (ISCA'21). IEEE, 265--278. https:\/\/ieeexplore.ieee.org\/abstract\/document\/9499856"},{"key":"e_1_3_1_32_2","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415665"},{"key":"e_1_3_1_33_2","doi-asserted-by":"publisher","DOI":"10.1145\/3375699"},{"key":"e_1_3_1_34_2","doi-asserted-by":"crossref","unstructured":"S. Naffziger K. Lepak M. Paraschou and M. Subramony. 2020. AMD Chiplet Architecture for High-Performance Server and Desktop Products (2020). 44\u201345.","DOI":"10.1109\/ISSCC19947.2020.9063103"},{"key":"e_1_3_1_35_2","doi-asserted-by":"publisher","DOI":"10.1145\/3476999"},{"key":"e_1_3_1_36_2","doi-asserted-by":"publisher","DOI":"10.1145\/3307650.3322237"},{"key":"e_1_3_1_37_2","doi-asserted-by":"publisher","DOI":"10.1109\/TEVC.2007.900837"},{"key":"e_1_3_1_38_2","doi-asserted-by":"publisher","DOI":"10.1038\/s44172-023-00074-3"},{"key":"e_1_3_1_39_2","unstructured":"Y. Qin Z. Yan W. Wen X. S. Hu and Y. Shi. 2023. Negative feedback training: A novel concept to improve robustness of NVCiM DNN accelerators. arXiv preprint arXiv:2305.14561."},{"key":"e_1_3_1_40_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2160265"},{"key":"e_1_3_1_41_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382591"},{"key":"e_1_3_1_42_2","volume-title":"Hotspot 6.0: Validation, Acceleration and Extension","author":"Zhang R.","unstructured":"R. Zhang, M. Stan, and K. Skadron. Hotspot 6.0: Validation, Acceleration and Extension. Technical Report. University of Virginia."},{"key":"e_1_3_1_43_2","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED58423.2023.10244258"},{"key":"e_1_3_1_44_2","unstructured":"J. Frankle and M. Carbin. 2018. The lottery ticket hypothesis: Finding sparse trainable neural networks. arXiv preprint arXiv:1803.03635."},{"key":"e_1_3_1_45_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2011.2107214"},{"key":"e_1_3_1_46_2","doi-asserted-by":"publisher","DOI":"10.1109\/IEMCON.2016.7746316"},{"key":"e_1_3_1_47_2","doi-asserted-by":"publisher","DOI":"10.1145\/290179.290180"},{"key":"e_1_3_1_48_2","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317870"},{"key":"e_1_3_1_49_2","doi-asserted-by":"publisher","DOI":"10.1145\/3005348"},{"key":"e_1_3_1_50_2","unstructured":"C. Laurent C. Ballas T. George N. Ballas and P. Vincent. 2020. Revisiting loss modelling for unstructured pruning. arXiv preprint arXiv:2006.12279."},{"key":"e_1_3_1_51_2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993491"},{"key":"e_1_3_1_52_2","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2013.6557149"},{"key":"e_1_3_1_53_2","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116293"},{"key":"e_1_3_1_54_2","doi-asserted-by":"publisher","DOI":"10.1145\/3307650.3322233"},{"key":"e_1_3_1_55_2","doi-asserted-by":"publisher","DOI":"10.1149\/2162-8777\/ac9c91"},{"key":"e_1_3_1_56_2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2961505"},{"key":"e_1_3_1_57_2","first-page":"1","article-title":"Electrical characterization of read window in ReRAM arrays under different SET\/RESET cycling conditions","author":"Zambelli C.","year":"2014","unstructured":"C. Zambelli, A. Grossi, P. Olivo, D. Walczyk, J. Dabrowski, B. Tillack, T. Schroeder, R. Kraemer, V. Stikanov, and C. Walczyk. 2014. Electrical characterization of read window in ReRAM arrays under different SET\/RESET cycling conditions. IEEE 6th International Memory Workshop (IMW\u201914). 1\u20134.","journal-title":"IEEE 6th International Memory Workshop (IMW\u201914)"}],"container-title":["ACM Transactions on Embedded Computing Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3665279","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3665279","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T00:58:34Z","timestamp":1750294714000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3665279"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,14]]},"references-count":56,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2024,9,30]]}},"alternative-id":["10.1145\/3665279"],"URL":"https:\/\/doi.org\/10.1145\/3665279","relation":{},"ISSN":["1539-9087","1558-3465"],"issn-type":[{"value":"1539-9087","type":"print"},{"value":"1558-3465","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,8,14]]},"assertion":[{"value":"2023-12-18","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-05-07","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-08-14","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}