{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,6]],"date-time":"2026-06-06T16:29:59Z","timestamp":1780763399638,"version":"3.54.1"},"publisher-location":"New York, NY, USA","reference-count":24,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,9,9]],"date-time":"2024-09-09T00:00:00Z","timestamp":1725840000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,9,9]]},"DOI":"10.1145\/3670474.3685972","type":"proceedings-article","created":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T06:22:27Z","timestamp":1725344547000},"page":"1-6","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["When Device Modeling Meets Machine Learning: Opportunities and Challenges (Invited)"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1472-7852","authenticated-orcid":false,"given":"Lining","family":"Zhang","sequence":"first","affiliation":[{"name":"School of Electronic and Computer Engineering, Peking University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9778-4184","authenticated-orcid":false,"given":"Baokang","family":"Peng","sequence":"additional","affiliation":[{"name":"School of Electronic and Computer Engineering, Peking University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4791-7310","authenticated-orcid":false,"given":"Yu","family":"Li","sequence":"additional","affiliation":[{"name":"School of Electronic and Computer Engineering, Peking University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5380-1985","authenticated-orcid":false,"given":"Hengyi","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Electronic and Computer Engineering, Peking University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1054-9550","authenticated-orcid":false,"given":"Wu","family":"Dai","sequence":"additional","affiliation":[{"name":"School of Electronic and Computer Engineering, Peking University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7514-0767","authenticated-orcid":false,"given":"Runsheng","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2024,9,9]]},"reference":[{"issue":"10","key":"e_1_3_2_1_1_1","first-page":"3162","article-title":"MLCAD: a survey of research in machine learning for CAD","volume":"41","author":"Rapp M.","year":"2022","unstructured":"M. Rapp, H. Armouch, Y. Lin, B. Yu, D. Z. Pan, M. Wolf, J. Henkel, \"MLCAD: a survey of research in machine learning for CAD,\" IEEE TCAD, vol. 41, no. 10, pp. 3162--3181, 2022.","journal-title":"IEEE TCAD"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415770"},{"key":"e_1_3_2_1_3_1","volume-title":"The dawn of AI-native EDA: promises and challenges of large circuit models,\" arXiv preprint, arXiv:2403.07257","author":"Chen L.","year":"2024","unstructured":"L. Chen, et al., \"The dawn of AI-native EDA: promises and challenges of large circuit models,\" arXiv preprint, arXiv:2403.07257, 2024."},{"key":"e_1_3_2_1_4_1","volume-title":"http:\/\/semikong.aitomatic.com\/, accessed on","year":"2024","unstructured":"Semikong, http:\/\/semikong.aitomatic.com\/, accessed on July, 2024"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1101(78)90264-2"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10825-017-0984-9"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.3048918"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3244901"},{"key":"e_1_3_2_1_9_1","first-page":"1","volume-title":"Proc. ICSICT","author":"Dai W.","year":"2022","unstructured":"W. Dai, et al., \"An Automatic Integration Network Approach for Generic Device Charge Modeling,\" in Proc. ICSICT, 2022, pp. 1--3."},{"key":"e_1_3_2_1_10_1","first-page":"65","article-title":"Enhancement and expansion of the neural network-based compact model using a binning method","volume":"12","author":"Choi J.","year":"2024","unstructured":"J. Choi, et al., \"Enhancement and expansion of the neural network-based compact model using a binning method,\" IEEE JEDS, vol, 12, pp. 65--73, 2024.","journal-title":"IEEE JEDS, vol"},{"key":"e_1_3_2_1_11_1","first-page":"1","volume-title":"Proc. ICSICT","author":"Li Y.","year":"2022","unstructured":"Y. Li, W. Dai, K. Geng, L. Zhang, R. Wang, R. Huang, \"An Automatic Parameter Extraction Method Based on Autoencoder for PIN Diode Model,\" in Proc. ICSICT, 2022, pp. 1--3."},{"key":"e_1_3_2_1_12_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3181536"},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2023.108766"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3278615"},{"key":"e_1_3_2_1_15_1","first-page":"2130","article-title":"Precise characterization of memristive systems by cooperative artificial neural networks","author":"Dobe\u0161 J.","year":"2012","unstructured":"J. Dobe\u0161, L. Posp\u00ed\u0161il and A. Yadav, \"Precise characterization of memristive systems by cooperative artificial neural networks,\" in Proc. SCIS-ISIS, 2012, pp. 2130--2133.","journal-title":"Proc. SCIS-ISIS"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.3047491"},{"issue":"3","key":"e_1_3_2_1_17_1","first-page":"834","article-title":"GEM: a generalized memristor device modeling framework based on neural network for transient circuit simulation","volume":"42","author":"Zhang Y.","year":"2023","unstructured":"Y. Zhang, et al., \"GEM: a generalized memristor device modeling framework based on neural network for transient circuit simulation,\" IEEE TCAD, vol. 42, no. 3, pp. 834--846, 2023.","journal-title":"IEEE TCAD"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2023.3290681"},{"key":"e_1_3_2_1_19_1","first-page":"1","volume-title":"SWW","author":"Zhang Z.","year":"2019","unstructured":"Z. Zhang, et al., \"New-Generation Design-Technology Co-Optimization (DTCO): Mechaine-Learning Assisted Modeling Framework,\" in Proc. SWW, 2019, pp. 1--2."},{"key":"e_1_3_2_1_20_1","first-page":"423","volume-title":"Proc. ISEDA","author":"Dai W.","year":"2023","unstructured":"W. Dai, et al., \"Benchmarking Artificial Neural Network Models for Design Technology Co-optimization,\" in Proc. ISEDA, 2023, pp. 423--427."},{"issue":"12","key":"e_1_3_2_1_21_1","first-page":"5156","article-title":"Statistical compact modeling with artificial neural networks","volume":"42","author":"Dai W.","year":"2023","unstructured":"W. Dai, et al., \"Statistical compact modeling with artificial neural networks,\" IEEE TCAD, vol. 42, no. 12, pp. 5156--5160, 2023.","journal-title":"IEEE TCAD"},{"key":"e_1_3_2_1_22_1","unstructured":"C. Park H. Cho J. Lee \"Enhancing interpretability of neural compact mdoels: towards reliable device modeling \" IEEE JEDS early access."},{"key":"e_1_3_2_1_23_1","first-page":"1","volume-title":"ISEDA","author":"Liu H.","year":"2024","unstructured":"H. Liu, et al., \"A neural network-based framework for accelerated device-circuit electrothermal co-simulations in GAAFETs,\" in Proc. ISEDA, 2024, pp. 1--5."},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3327973"}],"event":{"name":"MLCAD '24: 2024 ACM\/IEEE International Symposium on Machine Learning for CAD","location":"Salt Lake City UT USA","acronym":"MLCAD '24","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CEDA"]},"container-title":["Proceedings of the 2024 ACM\/IEEE International Symposium on Machine Learning for CAD"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3670474.3685972","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3670474.3685972","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,22]],"date-time":"2025-08-22T23:44:10Z","timestamp":1755906250000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3670474.3685972"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,9]]},"references-count":24,"alternative-id":["10.1145\/3670474.3685972","10.1145\/3670474"],"URL":"https:\/\/doi.org\/10.1145\/3670474.3685972","relation":{},"subject":[],"published":{"date-parts":[[2024,9,9]]},"assertion":[{"value":"2024-09-09","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}