{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T16:34:24Z","timestamp":1779381264296,"version":"3.53.1"},"publisher-location":"New York, NY, USA","reference-count":20,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,10,27]],"date-time":"2024-10-27T00:00:00Z","timestamp":1729987200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100005089","name":"Beijing Municipal Natural Science Foundation","doi-asserted-by":"publisher","award":["Z230004"],"award-info":[{"award-number":["Z230004"]}],"id":[{"id":"10.13039\/501100005089","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["92373205"],"award-info":[{"award-number":["92373205"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shenzhen Science and Technology Program","award":["SGDX20230116093303006"],"award-info":[{"award-number":["SGDX20230116093303006"]}]},{"name":"Strategic Priority Research Program of Chinese Academy of Sciences","award":["XDB44000000"],"award-info":[{"award-number":["XDB44000000"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,10,27]]},"DOI":"10.1145\/3676536.3676713","type":"proceedings-article","created":{"date-parts":[[2025,4,9]],"date-time":"2025-04-09T13:21:20Z","timestamp":1744204880000},"page":"1-9","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":11,"title":["ARO: Autoregressive Operator Learning for Transferable and Multi-fidelity 3D-IC Thermal Analysis With Active Learning"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0005-6222-1778","authenticated-orcid":false,"given":"Mingyue","family":"Wang","sequence":"first","affiliation":[{"name":"Beihang University, Beijing, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2477-314X","authenticated-orcid":false,"given":"Yuanqing","family":"Cheng","sequence":"additional","affiliation":[{"name":"Beihang University, beijing, beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-0704-3298","authenticated-orcid":false,"given":"Weiheng","family":"Zeng","sequence":"additional","affiliation":[{"name":"Beihang University, beijing, beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-7846-7574","authenticated-orcid":false,"given":"Zhenjie","family":"Lu","sequence":"additional","affiliation":[{"name":"Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4063-4652","authenticated-orcid":false,"given":"Vasilis F","family":"Pavlidis","sequence":"additional","affiliation":[{"name":"Aristotle University of Thessaloniki, Thessaloniki, Greece"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3177-8478","authenticated-orcid":false,"given":"Wei","family":"Xing","sequence":"additional","affiliation":[{"name":"The University of Sheffield, Sheffield, Sheffield, United Kingdom"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2025,4,9]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382594"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3100343"},{"key":"e_1_3_2_1_3_1","volume-title":"A survey of chip-level thermal simulators. ACM Computing Surveys (CSUR), 52(2):1--35","author":"Sultan Hameedah","year":"2019","unstructured":"Hameedah Sultan, Anjali Chauhan, and Smruti R Sarangi. A survey of chip-level thermal simulators. ACM Computing Surveys (CSUR), 52(2):1--35, 2019."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"e_1_3_2_1_5_1","first-page":"1","volume-title":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","author":"Chen Liang","year":"2023","unstructured":"Liang Chen, Jincong Lu, Wentian Jin, and Sheldon X.-D. Tan. Fast full-chip parametric thermal analysis based on enhanced physics enforced neural networks. In 2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD), pages 1--8, 2023."},{"key":"e_1_3_2_1_6_1","first-page":"1","volume-title":"2020 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","author":"Jin Wentian","year":"2020","unstructured":"Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, and Sheldon X.-D. Tan. Fullchip thermal map estimation for commercial multi-core cpus with generative adversarial learning. In 2020 IEEE\/ACM International Conference On Computer Aided Design (ICCAD), pages 1--9, 2020."},{"key":"e_1_3_2_1_7_1","first-page":"1","volume-title":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","author":"Lu Jincong","year":"2023","unstructured":"Jincong Lu, Jinwei Zhang, and Sheldon X.-D. Tan. Real-time thermal map estimation for amd multi-core cpus using transformer. In 2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD), pages 1--7, 2023."},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247998"},{"key":"e_1_3_2_1_9_1","volume-title":"Proceedings of the 36th International Conference on Neural Information Processing Systems, NIPS '22. Curran Associates Inc.","author":"Wang Yuxin","year":"2024","unstructured":"Yuxin Wang, Zheng Xing, and Wei W. Xing. Gar: generalized autoregression for multi-fidelity fusion. In Proceedings of the 36th International Conference on Neural Information Processing Systems, NIPS '22. Curran Associates Inc., 2024."},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2023.106354"},{"key":"e_1_3_2_1_11_1","volume-title":"Multifidelity prediction of fluid flow and temperature field based on transfer learning using fourier neural operator. arXiv preprint arXiv:2304.06972","author":"Lyu Yanfang","year":"2023","unstructured":"Yanfang Lyu, Xiaoyu Zhao, Zhiqiang Gong, Xiao Kang, and Wen Yao. Multifidelity prediction of fluid flow and temperature field based on transfer learning using fourier neural operator. arXiv preprint arXiv:2304.06972, 2023."},{"key":"e_1_3_2_1_12_1","first-page":"2440","volume-title":"International Conference on Artificial Intelligence and Statistics","author":"Li Shibo","year":"2024","unstructured":"Shibo Li, Xin Yu, Wei Xing, Robert Kirby, Akil Narayan, and Shandian Zhe. Multi-resolution active learning of fourier neural operators. In International Conference on Artificial Intelligence and Statistics, pages 2440--2448. PMLR, 2024."},{"key":"e_1_3_2_1_13_1","volume-title":"Fourier neural operator for parametric partial differential equations. arXiv preprint arXiv:2010.08895","author":"Li Zongyi","year":"2020","unstructured":"Zongyi Li, Nikola Kovachki, Kamyar Azizzadenesheli, Burigede Liu, Kaushik Bhattacharya, Andrew Stuart, and Anima Anandkumar. Fourier neural operator for parametric partial differential equations. arXiv preprint arXiv:2010.08895, 2020."},{"key":"e_1_3_2_1_14_1","volume-title":"Multi-fidelity wavelet neural operator with application to uncertainty quantification","author":"Thakur Akshay","year":"2023","unstructured":"Akshay Thakur, Tapas Tripura, and Souvik Chakraborty. Multi-fidelity wavelet neural operator with application to uncertainty quantification, 2023."},{"key":"e_1_3_2_1_15_1","first-page":"1050","volume-title":"international conference on machine learning","author":"Gal Yarin","year":"2016","unstructured":"Yarin Gal and Zoubin Ghahramani. Dropout as a bayesian approximation: Representing model uncertainty in deep learning. In international conference on machine learning, pages 1050--1059. PMLR, 2016."},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/40.755465"},{"key":"e_1_3_2_1_17_1","first-page":"A006","volume-title":"International Electronic Packaging Technical Conference and Exhibition","volume":"59322","author":"Ren Zongqing","unstructured":"Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, and Jaeho Lee. Thermal analysis of 3d ics with tsvs placement optimization. In International Electronic Packaging Technical Conference and Exhibition, volume 59322, page V001T01A006. American Society of Mechanical Engineers, 2019."},{"issue":"12","key":"e_1_3_2_1_18_1","first-page":"3123","article-title":"The mta: An advanced and versatile thermal simulator for integrated systems","volume":"37","author":"Ladenheim Scott","year":"2018","unstructured":"Scott Ladenheim, Yi-Chung Chen, Milan Mihajlovi\u0107, and Vasilis F. Pavlidis. The mta: An advanced and versatile thermal simulator for integrated systems. IEEE TCAD, 37(12):3123--3136, 2018.","journal-title":"IEEE TCAD"},{"key":"e_1_3_2_1_19_1","volume-title":"Introduction to comsol multiphysics. COMSOL Multiphysics","author":"Multiphysics","year":"2018","unstructured":"Multiphysics C. Introduction to comsol multiphysics. COMSOL Multiphysics, Burlington, MA, accessed Feb, 9(2018):32, 1998."},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"}],"event":{"name":"ICCAD '24: 43rd IEEE\/ACM International Conference on Computer-Aided Design","location":"Newark Liberty International Airport Marriott New York NY USA","acronym":"ICCAD '24","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS","IEEE CEDA","IEEE EDS"]},"container-title":["Proceedings of the 43rd IEEE\/ACM International Conference on Computer-Aided Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3676536.3676713","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3676536.3676713","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T23:43:57Z","timestamp":1750290237000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3676536.3676713"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,27]]},"references-count":20,"alternative-id":["10.1145\/3676536.3676713","10.1145\/3676536"],"URL":"https:\/\/doi.org\/10.1145\/3676536.3676713","relation":{},"subject":[],"published":{"date-parts":[[2024,10,27]]},"assertion":[{"value":"2025-04-09","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}