{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,28]],"date-time":"2026-03-28T08:48:15Z","timestamp":1774687695904,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":8,"publisher":"ACM","license":[{"start":{"date-parts":[[2024,10,27]],"date-time":"2024-10-27T00:00:00Z","timestamp":1729987200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2024,10,27]]},"DOI":"10.1145\/3676536.3676817","type":"proceedings-article","created":{"date-parts":[[2025,4,9]],"date-time":"2025-04-09T13:21:20Z","timestamp":1744204880000},"page":"1-9","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":1,"title":["AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-8885-4337","authenticated-orcid":false,"given":"Seungmin","family":"Woo","sequence":"first","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2897-7142","authenticated-orcid":false,"given":"Pruek","family":"Vanna-iampikul","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Burapha University, Chonburi, Thailand"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2267-5282","authenticated-orcid":false,"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[{"name":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA"}]}],"member":"320","published-online":{"date-parts":[[2025,4,9]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247949"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3015494"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3368075"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323675"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1145\/3583781.3590233"},{"key":"e_1_3_2_1_6_1","doi-asserted-by":"publisher","DOI":"10.1145\/2954679.2872414"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248841"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED58423.2023.10244484"}],"event":{"name":"ICCAD '24: 43rd IEEE\/ACM International Conference on Computer-Aided Design","location":"Newark Liberty International Airport Marriott New York NY USA","acronym":"ICCAD '24","sponsor":["SIGDA ACM Special Interest Group on Design Automation","IEEE CAS","IEEE CEDA","IEEE EDS"]},"container-title":["Proceedings of the 43rd IEEE\/ACM International Conference on Computer-Aided Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3676536.3676817","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3676536.3676817","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:18:44Z","timestamp":1750295924000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3676536.3676817"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,27]]},"references-count":8,"alternative-id":["10.1145\/3676536.3676817","10.1145\/3676536"],"URL":"https:\/\/doi.org\/10.1145\/3676536.3676817","relation":{},"subject":[],"published":{"date-parts":[[2024,10,27]]},"assertion":[{"value":"2025-04-09","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}