{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,23]],"date-time":"2025-08-23T00:40:07Z","timestamp":1755909607432,"version":"3.44.0"},"publisher-location":"New York, NY, USA","reference-count":8,"publisher":"ACM","license":[{"start":{"date-parts":[[2025,3,16]],"date-time":"2025-03-16T00:00:00Z","timestamp":1742083200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2025,3,16]]},"DOI":"10.1145\/3698364.3711693","type":"proceedings-article","created":{"date-parts":[[2025,3,13]],"date-time":"2025-03-13T18:22:31Z","timestamp":1741890151000},"page":"231-232","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Invited: Automation and Optimization of Heterogeneous Multi-Die Systems"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0005-1031-0701","authenticated-orcid":false,"given":"Henry","family":"Sheng","sequence":"first","affiliation":[{"name":"Synopsys, Inc, Sunnyvale, CA, USA"}]}],"member":"320","published-online":{"date-parts":[[2025,3,16]]},"reference":[{"volume-title":"ISPD 2024","author":"Chang Y.","key":"e_1_3_2_1_1_1","unstructured":"Y. Chang, ''Physical Design Challenges in Modern Heterogeneous Integration'', ISPD 2024"},{"volume-title":"DAC 2023","author":"Zhu L.","key":"e_1_3_2_1_2_1","unstructured":"L. Zhu and SK Lim, ''Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps'', DAC 2023"},{"key":"e_1_3_2_1_3_1","unstructured":"Moore ''Expect a Wave of Wafer-Scale Computers'' https:\/\/spectrum.ieee.org\/tsmc-advanced-packaging"},{"volume-title":"IITC 2020","author":"Kagawa","key":"e_1_3_2_1_4_1","unstructured":"Kagawa et al, ''Impacts of Misalignment on 1\u03bcm Pitch Cu-Cu Hybrid Bonding'' IITC 2020"},{"volume-title":"How We'll Reach a 1 Trillion Transistor GPU","author":"Liu Mark","key":"e_1_3_2_1_5_1","unstructured":"Mark Liu, Philip Wong, ''How We'll Reach a 1 Trillion Transistor GPU'', IEEE Spectrum"},{"volume-title":"ISSCC 2024","author":"Zhang Kevin","key":"e_1_3_2_1_6_1","unstructured":"Kevin Zhang, ''Semiconductor Industry: Present & Future'', ISSCC 2024"},{"key":"e_1_3_2_1_7_1","volume-title":"IEDM","author":"Fusilier M.","year":"2024","unstructured":"M. Fusilier, ''Advancing AI with Energy-Efficient Architectures: Innovations in Fab Process, Packaging, and System Integration'', IEDM 2024."},{"key":"e_1_3_2_1_8_1","volume-title":"Power, Timing, and Stress Effects''","author":"V. Moroz","year":"2024","unstructured":"V. Moroz et al, ''3DIC System-Technology Co-Optimization with a Focus on the Interplay of Thermal, Power, Timing, and Stress Effects'', 2024 Symposium on VLSI Technology and Circuits"}],"event":{"name":"ISPD '25: International Symposium on Physical Design","sponsor":["SIGDA ACM Special Interest Group on Design Automation"],"location":"Austin TX USA","acronym":"ISPD '25"},"container-title":["Proceedings of the 2025 International Symposium on Physical Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3698364.3711693","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3698364.3711693","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,23]],"date-time":"2025-08-23T00:04:49Z","timestamp":1755907489000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3698364.3711693"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,3,16]]},"references-count":8,"alternative-id":["10.1145\/3698364.3711693","10.1145\/3698364"],"URL":"https:\/\/doi.org\/10.1145\/3698364.3711693","relation":{},"subject":[],"published":{"date-parts":[[2025,3,16]]},"assertion":[{"value":"2025-03-16","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}