{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T13:46:47Z","timestamp":1774964807032,"version":"3.50.1"},"reference-count":37,"publisher":"Association for Computing Machinery (ACM)","issue":"2","license":[{"start":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T00:00:00Z","timestamp":1736467200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/501100001809","name":"Natural Science Foundation of China","doi-asserted-by":"crossref","award":["T2293704, and T2293700"],"award-info":[{"award-number":["T2293704, and T2293700"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"crossref"}]},{"name":"National Key Research and Development Program of China","award":["2023YFB4402204"],"award-info":[{"award-number":["2023YFB4402204"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2025,3,31]]},"abstract":"<jats:p>Through Silicon Vias (TSVs) are vulnerable to electromigration (EM) degradation due to their high local current densities, thereby reducing the reliability of 3D ICs with stack dies and TSVs. Due to the broad application of 3D ICs, it is necessary to analyze the electromigration reliability of TSVs. To overcome the weakness of traditional method for EM modeling of TSVs, we propose a physics-informed learning approach for transient analysis of electromigration modeling in TSV by solving the conventional mass balance equation. The proposed method allows simultaneous consideration of atomic depletion and accumulation, effective resistance degradation, electric current evolution, and stress distribution. In particular, we propose a customized neural network to simulate the EM process in TSV without the need for fine grid meshing and temporal iteration in traditional methods. Considering that the loss function of the proposed model is a combination of different loss terms, we propose a modified self-adaptive loss balanced method to automatically adjust the weights of multiple loss terms to enhance network performance. Given the prediction uncertainty due to data randomness or model architecture constraints, Gaussian probabilistic model is constructed to define the self-adaptive weights and update the dynamic weights per epoch built on maximum likelihood estimation. Compared with the finite element method, the proposed physics informed neural network method can lead to a speedup with less than 0.1% mean square error. Experimental results also show that the proposed model achieves excellent performance over other competing methods and high robustness under values of initial weights, different numbers of hidden layers and neurons per layer.<\/jats:p>\n          <jats:p\/>","DOI":"10.1145\/3706106","type":"journal-article","created":{"date-parts":[[2024,11,29]],"date-time":"2024-11-29T11:41:31Z","timestamp":1732880491000},"page":"1-22","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":3,"title":["Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration Analysis"],"prefix":"10.1145","volume":"30","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8658-0197","authenticated-orcid":false,"given":"Xiaoman","family":"Yang","sequence":"first","affiliation":[{"name":"Shanghai Jiaotong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7046-3455","authenticated-orcid":false,"given":"Haibao","family":"Chen","sequence":"additional","affiliation":[{"name":"Shanghai Jiaotong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-3731-5200","authenticated-orcid":false,"given":"Yuhan","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Michigan, Ann Arbor, United States"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5349-1825","authenticated-orcid":false,"given":"Tianshu","family":"Hou","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University, Shanghai China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-2986-9231","authenticated-orcid":false,"given":"Pengpeng","family":"Ren","sequence":"additional","affiliation":[{"name":"Shanghai Jiaotong University, Shanghai China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7514-0767","authenticated-orcid":false,"given":"Runsheng","family":"Wang","sequence":"additional","affiliation":[{"name":"Peking University, Beijing China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1138-804X","authenticated-orcid":false,"given":"Zhigang","family":"Ji","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University, Shanghai China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8146-4821","authenticated-orcid":false,"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"Peking University, Beijing China"}]}],"member":"320","published-online":{"date-parts":[[2025,1,10]]},"reference":[{"key":"e_1_3_1_2_2","doi-asserted-by":"publisher","DOI":"10.1145\/2856032"},{"issue":"4","key":"e_1_3_1_3_2","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1145\/2003695.2003708","article-title":"Clock tree synthesis for TSV-based 3D IC designs","volume":"16","author":"Kim Tak-Yung","year":"2011","unstructured":"Tak-Yung Kim and Taewhan Kim. 2011. Clock tree synthesis for TSV-based 3D IC designs. ACM Transactions on Design Automation of Electronic Systems 16, 4 (2011), 1\u201321.","journal-title":"ACM Transactions on Design Automation of Electronic Systems"},{"key":"e_1_3_1_4_2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2543260"},{"key":"e_1_3_1_5_2","first-page":"1221","volume-title":"Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging","author":"Chen Zhaohui","year":"2010","unstructured":"Zhaohui Chen, Zhicheng Lv, XueFang Wang, Yong Liu, and Sheng Liu. 2010. Modeling of electromigration of the through silicon via interconnects. In Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging. 1221\u20131225."},{"key":"e_1_3_1_6_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.07.024"},{"key":"e_1_3_1_7_2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898698"},{"key":"e_1_3_1_8_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691144"},{"key":"e_1_3_1_9_2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2811417"},{"key":"e_1_3_1_10_2","doi-asserted-by":"publisher","DOI":"10.1038\/s42254-021-00314-5"},{"key":"e_1_3_1_11_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2018.10.045"},{"key":"e_1_3_1_12_2","doi-asserted-by":"publisher","DOI":"10.1145\/3567424"},{"key":"e_1_3_1_13_2","first-page":"1","article-title":"Automatic differentiation in machine learning: A survey","volume":"18","author":"Baydin Atilim Gunes","year":"2018","unstructured":"Atilim Gunes Baydin, Barak A. Pearlmutter, Alexey Andreyevich Radul, and Jeffrey Mark Siskind. 2018. Automatic differentiation in machine learning: A survey. Journal of Machine Learning Research 18, 1 (2018), 1\u201343.","journal-title":"Journal of Machine Learning Research"},{"key":"e_1_3_1_14_2","doi-asserted-by":"publisher","DOI":"10.1137\/19M1274067"},{"key":"e_1_3_1_15_2","doi-asserted-by":"publisher","DOI":"10.1190\/segam2021-3584127.1"},{"key":"e_1_3_1_16_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2020.109951"},{"key":"e_1_3_1_17_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2021.104232"},{"key":"e_1_3_1_18_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3166103"},{"key":"e_1_3_1_19_2","doi-asserted-by":"publisher","DOI":"10.1145\/3508352.3549371"},{"key":"e_1_3_1_20_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3176545"},{"key":"e_1_3_1_21_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323686"},{"key":"e_1_3_1_22_2","doi-asserted-by":"crossref","unstructured":"Levi McClenny and Ulisses Braga-Neto. 2023. Self-adaptive physics-informed neural networks. Journal of Computational Physics 474 2 (2023) 111722.","DOI":"10.1016\/j.jcp.2022.111722"},{"key":"e_1_3_1_23_2","doi-asserted-by":"publisher","DOI":"10.1609\/aaai.v35i9.16992"},{"key":"e_1_3_1_24_2","doi-asserted-by":"publisher","DOI":"10.1137\/20M1318043"},{"key":"e_1_3_1_25_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.cma.2021.113938"},{"key":"e_1_3_1_26_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2021.110768"},{"key":"e_1_3_1_27_2","first-page":"794","volume-title":"Proceedings of the International Conference on Machine Learning","author":"Chen Zhao","year":"2018","unstructured":"Zhao Chen, Vijay Badrinarayanan, Chen-Yu Lee, and Andrew Rabinovich. 2018. Gradnorm: Gradient normalization for adaptive loss balancing in deep multitask networks. In Proceedings of the International Conference on Machine Learning. PMLR, 794\u2013803."},{"key":"e_1_3_1_28_2","doi-asserted-by":"publisher","unstructured":"A. Ali Heydari Craig A. Thompson and Asif Mehmood. 2019. Softadapt: Techniques for adaptive loss weighting of neural networks with multi-part loss functions. arXiv:1912.12355. Retrieved from 10.48550\/arXiv.1912.12355","DOI":"10.48550\/arXiv.1912.12355"},{"key":"e_1_3_1_29_2","doi-asserted-by":"publisher","DOI":"10.1145\/2494536"},{"key":"e_1_3_1_30_2","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2012.2190605"},{"key":"e_1_3_1_31_2","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2009.2021661"},{"key":"e_1_3_1_32_2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2707119"},{"key":"e_1_3_1_33_2","doi-asserted-by":"publisher","DOI":"10.1145\/3399677"},{"key":"e_1_3_1_34_2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2716821"},{"key":"e_1_3_1_35_2","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228391"},{"key":"e_1_3_1_36_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2022.05.015"},{"key":"e_1_3_1_37_2","first-page":"7482","volume-title":"Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition","author":"Kendall Alex","year":"2018","unstructured":"Alex Kendall, Yarin Gal, and Roberto Cipolla. 2018. Multi-task learning using uncertainty to weigh losses for scene geometry and semantics. In Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition. 7482\u20137491."},{"key":"e_1_3_1_38_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2020.110085"}],"container-title":["ACM Transactions on Design Automation of Electronic Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3706106","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3706106","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:18:03Z","timestamp":1750295883000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3706106"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1,10]]},"references-count":37,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2025,3,31]]}},"alternative-id":["10.1145\/3706106"],"URL":"https:\/\/doi.org\/10.1145\/3706106","relation":{},"ISSN":["1084-4309","1557-7309"],"issn-type":[{"value":"1084-4309","type":"print"},{"value":"1557-7309","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1,10]]},"assertion":[{"value":"2024-07-02","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-11-14","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-01-10","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}