{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T05:06:11Z","timestamp":1750309571777,"version":"3.41.0"},"reference-count":28,"publisher":"Association for Computing Machinery (ACM)","issue":"2","license":[{"start":{"date-parts":[[2025,2,7]],"date-time":"2025-02-07T00:00:00Z","timestamp":1738886400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"name":"National Science and Technology Council, Taiwan"}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2025,3,31]]},"abstract":"<jats:p>Directed self-assembly (DSA) of block copolymers can generate tiny and dense layout features, holding great potential for patterning vias and contacts at advanced nodes. Existing studies mainly focused on guiding template design for cylindrical DSA, but by leveraging self-aligned via process, lamellar DSA can form vias to be immune to placement errors and free of a uniform pitch between vias, which cylindrical DSA suffers from. The state-of-the-art guiding template design for lamellar DSA can handle only single-row templates, thus limiting the flexibility of via grouping. Therefore, in this article, we explore further and propose a novel and general multi-row guiding template design approach. Experimental results show that our approach outperforms the state-of-the-art work on both mask conflicts and short guiding templates, and requires much less computation time.<\/jats:p>","DOI":"10.1145\/3711851","type":"journal-article","created":{"date-parts":[[2025,1,9]],"date-time":"2025-01-09T11:40:47Z","timestamp":1736422847000},"page":"1-17","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Multi-Row Guiding Template Design for Lamellar Directed Self-Assembly with Self-Aligned Via Process"],"prefix":"10.1145","volume":"30","author":[{"given":"Yi-Ting","family":"Lin","sequence":"first","affiliation":[{"name":"National Taiwan University, Taipei, Taiwan"}]},{"given":"Kang-Ting","family":"Fan","sequence":"additional","affiliation":[{"name":"National Taiwan University, Taipei Taiwan"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4554-3442","authenticated-orcid":false,"given":"Iris Hui-Ru","family":"Jiang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Graduate Institute of Electronics Engineering, National Taiwan University, Taipei Taiwan"}]}],"member":"320","published-online":{"date-parts":[[2025,2,7]]},"reference":[{"key":"e_1_3_1_2_2","unstructured":"IEEE. 2022. The International Roadmap for Devices and Systems: 2022 Edition Lithography. Retrieved from https:\/\/irds.ieee.org\/editions\/2023."},{"key":"e_1_3_1_3_2","unstructured":"IEEE. 2023. The International Roadmap for Devices and Systems: 2023 Update Lithography & Patterning. Retrieved from https:\/\/irds.ieee.org\/editions\/2023."},{"key":"e_1_3_1_4_2","doi-asserted-by":"crossref","unstructured":"Yasmine Badr Andres Torres and Puneet Gupta. 2017. Mask assignment and DSA grouping for DSA-MP hybrid lithography for Sub-7 nm contact\/via holes. IEEE Trans. Comput.-Aided Design Integr. Circ. Syst. 36 6 (2017) 913\u2013926.","DOI":"10.1109\/TCAD.2016.2614262"},{"key":"e_1_3_1_5_2","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2744868"},{"key":"e_1_3_1_6_2","first-page":"94270P:1\u20138","volume-title":"SPIE Design-Process-Technology Co-optimization for Manufacturability IX","author":"Badr Yasmine","year":"2015","unstructured":"Yasmine Badr, J. Andres Torres, Yuansheng Ma, Joydeep Mitra, and Puneet Gupta. 2015. Incorporating DSA in multipatterning semiconductor manufacturing technologies. In SPIE Design-Process-Technology Co-optimization for Manufacturability IX, Vol. 9427. 94270P:1\u20138."},{"key":"e_1_3_1_7_2","doi-asserted-by":"publisher","DOI":"10.1145\/2717764.2723572"},{"key":"e_1_3_1_8_2","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247804"},{"key":"e_1_3_1_9_2","doi-asserted-by":"crossref","unstructured":"Yu Chen and Shisheng Xiong. 2020. Directed self-assembly of block copolymers for sub-10 nm fabrication. Int. J. Extreme Manufact. 2 3 (2020) 032006.","DOI":"10.1088\/2631-7990\/aba3ae"},{"key":"e_1_3_1_10_2","first-page":"97770L:1\u20139","volume-title":"SPIE Alternative Lithographic Technologies VIII","author":"Chi Cheng","year":"2016","unstructured":"Cheng Chi, Chi-Chun Liu, Luciana Meli, Kristin Schmidt, Yongan Xu, Ekmini Anuja DeSilva, Martha Sanchez, Richard Farrell, Hongyun Cottle, Daiji Kawamuraet al.2016. DSA via hole shrink for advanced node applications. In SPIE Alternative Lithographic Technologies VIII, Vol. 9777. 97770L:1\u20139."},{"key":"e_1_3_1_11_2","volume-title":"Proceedings of the ACM\/IEEE Design Automation Conference (DAC\u201923)","author":"Chiang Charles","year":"2023","unstructured":"Charles Chiang. 2023. Lightning talk\u2014Lithography and advanced technologies work together to deliver the foundry\u2019s needs. In Proceedings of the ACM\/IEEE Design Automation Conference (DAC\u201923)."},{"key":"e_1_3_1_12_2","doi-asserted-by":"crossref","unstructured":"S. B. Darling. 2007. Directing the self-assembly of block copolymers. Progr. Polymer Sci. 32 10 (2007) 1152\u20131204.","DOI":"10.1016\/j.progpolymsci.2007.05.004"},{"key":"e_1_3_1_13_2","unstructured":"Gurobi Optimization LLC. 2022. Gurobi Optimizer Reference Manual. Retrieved from https:\/\/www.gurobi.com."},{"key":"e_1_3_1_14_2","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2016.7427992"},{"key":"e_1_3_1_15_2","doi-asserted-by":"crossref","unstructured":"Jian Kuang Junjie Ye and Evangeline F. Y. Young. 2018. STOMA: Simultaneous template optimization and mask assignment for directed self-assembly lithography with multiple patterning. IEEE Trans. Computer-Aided Design Integr. Circ. Syst. 37 6 (2018) 1251\u20131264.","DOI":"10.1109\/TCAD.2017.2748022"},{"key":"e_1_3_1_16_2","doi-asserted-by":"crossref","unstructured":"Kafai Lai Chi-Chun Liu Hsinyu Tsai Yongan Xu Cheng Chi Ananthan Raghunathan Parul Dhagat Lin Hu Oseo Park Sunggon Jung et\u00a0al. 2017. Design technology co-optimization assessment for directed self-assembly-based lithography: Design for directed self-assembly or directed self-assembly for design? J. Micro\/Nanolithogr. MEMS MOEMS 16 1 (2017) 013502\u2013013502.","DOI":"10.1117\/1.JMM.16.1.013502"},{"key":"e_1_3_1_17_2","doi-asserted-by":"crossref","unstructured":"Kafai Lai Chi-Chun Liu Hsinyu Tsai Yongan Xu Cheng Chi Ananthan Raghunathan Parul Dhagat Lin Hu Oseo Park Sunggon Junget al.2017. Design technology co-optimization assessment for directed self-assembly-based lithography: Design for directed self-assembly or directed self-assembly for design? SPIE J. Micro\/Nanolithogr. MEMS MOEMS 16 1 (2017) 013502:1\u201313.","DOI":"10.1117\/1.JMM.16.1.013502"},{"key":"e_1_3_1_18_2","doi-asserted-by":"crossref","unstructured":"Yi-Ting Lin and Iris Hui-Ru Jiang. 2021. Novel guiding template and mask assignment for DSA-MP hybrid lithography using multiple BCP materials. IEEE Trans. Computer-Aided Design Integr. Circ. Syst. 40 9 (2021) 1909\u20131919.","DOI":"10.1109\/TCAD.2020.3033745"},{"key":"e_1_3_1_19_2","first-page":"74","volume-title":"Design-Process-Technology Co-optimization for Manufacturability XI","author":"Ma Yuansheng","year":"2017","unstructured":"Yuansheng Ma, Jongwook Kye, Gurdaman S Khaira, Le Hong, James Word, Yuyang Sun, Joydeep Mitra, J. Andres Torres, Germain Fenger, and Harry J. Levinson. 2017. Design technology co-optimization (DTCO) study on self-aligned-Via (SAV) with lamella DSA for sub-7 nm technology. In Design-Process-Technology Co-optimization for Manufacturability XI, Vol. 10148. SPIE, 74\u201385."},{"key":"e_1_3_1_20_2","first-page":"101480B:1\u201312","volume-title":"SPIE Design-Process-Technology Co-optimization for Manufacturability XI","author":"Ma Yuansheng","year":"2017","unstructured":"Yuansheng Ma, Jongwook Kye, Gurdaman S. Khaira, Le Hong, James Word, Yuyang Sun, Joydeep Mitra, J. Andres Torres, Germain Fenger, and Harry J. Levinson. 2017. Design technology co-optimization (DTCO) study on self-aligned-via (SAV) with Lamella DSA for sub-7 nm technology. In SPIE Design-Process-Technology Co-optimization for Manufacturability XI, Vol. 10148. 101480B:1\u201312."},{"key":"e_1_3_1_21_2","first-page":"PC124970C","volume-title":"Novel Patterning Technologies 2023","author":"Nealey Paul F.","year":"2023","unstructured":"Paul F. Nealey. 2023. Design, synthesis, and demonstration of multifunctional block copolymers for directed self-assembly applications with varying resolution and density multiplication of features. In Novel Patterning Technologies 2023. SPIE, PC124970C."},{"key":"e_1_3_1_22_2","unstructured":"Hyo Seon Annelies Delabie and Silvia Armini. 2020. Building Patterns from the Bottom: A Complementary Approach to Lithography. Retrieved from https:\/\/www.imec-int.com\/en\/articles\/building-patterns-from-the-bottom-a-complementary-approach-to-lithography."},{"key":"e_1_3_1_23_2","doi-asserted-by":"publisher","DOI":"10.1145\/3400302.3415706"},{"key":"e_1_3_1_24_2","doi-asserted-by":"crossref","unstructured":"Julie Van Bel Lander Verstraete Hyo Seon Suh Philippe Bezard Alain Moussa Andreia Santos YoungJun Her and Stefan De Gendt. 2024. Rectification of extreme ultraviolet lithography patterns by directed self-assembly: A roughness and defectivity study. J. Micro\/Nanopattern. Mater. Metrol. 23 4 (2024) 043001\u2013043001.","DOI":"10.1117\/1.JMM.23.4.043001"},{"key":"e_1_3_1_25_2","first-page":"155","volume-title":"Novel Patterning Technologies 2023","author":"Bel Julie Van","year":"2023","unstructured":"Julie Van Bel, Lander Verstraete, Hyo Seon Suh, Stefan De Gendt, Philippe Bezard, Jelle Vandereyken, Waikin Li, Matteo Beggiato, Amir-Hossein Tamaddon, Christophe Beral et\u00a0al. 2023. EUV lithography line-space pattern rectification using block copolymer directed self-assembly: A roughness and defectivity study. In Novel Patterning Technologies 2023, Vol. 12497. SPIE, 155\u2013163."},{"key":"e_1_3_1_26_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203784"},{"key":"e_1_3_1_27_2","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247724"},{"key":"e_1_3_1_28_2","doi-asserted-by":"crossref","unstructured":"Yunfeng Yang Wai-Shing Luk Hai Zhou David Z. Pan Dian Zhou Changhao Yan and Xuan Zeng. 2017. An effective layout decomposition method for DSA with multiple patterning in contact-hole generation. ACM Trans. Design Autom. Electr. Syst. 23 1 (Sep.2017) 11:1\u201327.","DOI":"10.1145\/3131847"},{"key":"e_1_3_1_29_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105297"}],"container-title":["ACM Transactions on Design Automation of Electronic Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3711851","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3711851","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,19]],"date-time":"2025-06-19T01:19:15Z","timestamp":1750295955000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3711851"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,2,7]]},"references-count":28,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2025,3,31]]}},"alternative-id":["10.1145\/3711851"],"URL":"https:\/\/doi.org\/10.1145\/3711851","relation":{},"ISSN":["1084-4309","1557-7309"],"issn-type":[{"type":"print","value":"1084-4309"},{"type":"electronic","value":"1557-7309"}],"subject":[],"published":{"date-parts":[[2025,2,7]]},"assertion":[{"value":"2024-08-30","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-12-30","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-02-07","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}