{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T18:01:00Z","timestamp":1775066460086,"version":"3.50.1"},"publisher-location":"New York, NY, USA","reference-count":65,"publisher":"ACM","content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2025,9,8]]},"DOI":"10.1145\/3718958.3750510","type":"proceedings-article","created":{"date-parts":[[2025,8,27]],"date-time":"2025-08-27T16:54:11Z","timestamp":1756313651000},"page":"234-247","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":4,"title":["Mosaic: Breaking the Optics versus Copper Trade-off with a Wide-and-Slow Architecture and MicroLEDs"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1523-8674","authenticated-orcid":false,"given":"Kaoutar","family":"Benyahya","sequence":"first","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1292-1507","authenticated-orcid":false,"given":"Ariel Gomez","family":"Diaz","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4277-1802","authenticated-orcid":false,"given":"Junyi","family":"Liu","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1660-1129","authenticated-orcid":false,"given":"Vassily","family":"Lyutsarev","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4222-3678","authenticated-orcid":false,"given":"Marianna","family":"Pantouvaki","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3788-6269","authenticated-orcid":false,"given":"Kai","family":"Shi","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5891-6212","authenticated-orcid":false,"given":"Shawn Yohanes","family":"Siew","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1573-3314","authenticated-orcid":false,"given":"Hitesh","family":"Ballani","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-8591-2864","authenticated-orcid":false,"given":"Thomas","family":"Burridge","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-6444-9149","authenticated-orcid":false,"given":"Daniel","family":"Cletheroe","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-4236-4503","authenticated-orcid":false,"given":"Thomas","family":"Karagiannis","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-5019-1019","authenticated-orcid":false,"given":"Brian","family":"Robertson","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-5936-6895","authenticated-orcid":false,"given":"Ant","family":"Rowstron","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-9236-4938","authenticated-orcid":false,"given":"Mengyang","family":"Yang","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1939-5690","authenticated-orcid":false,"given":"Paolo","family":"Costa","sequence":"additional","affiliation":[{"name":"Microsoft Research, Cambridge, United Kingdom"}]}],"member":"320","published-online":{"date-parts":[[2025,8,27]]},"reference":[{"key":"e_1_3_2_1_1_1","unstructured":"AMD. 2017. ECC v2.0 LogiCORE IP Product Guide (PG092). https:\/\/docs.amd.com\/v\/u\/en-US\/pg092-ecc"},{"key":"e_1_3_2_1_2_1","unstructured":"Arista Networks 2025. 10M Compatible 800G QSFP-DD Active Optical Cable. https:\/\/www.fs.com\/uk\/products\/229643.html?attribute=102708&id=3721202"},{"key":"e_1_3_2_1_3_1","volume-title":"MicroLED Smartwatch Displays","author":"MicroLED Industry Association","year":"2023","unstructured":"MicroLED Industry Association. 2023. MicroLED Smartwatch Displays in 2023, LED Cost Analysis. https:\/\/www.microledassociation.com\/wp-content\/uploads\/2023\/01\/MicroLED-smartwatch-whitepaper-2023-01.pdf."},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"crossref","unstructured":"N. Bamiedakis X. Li J. J. D. McKendry E. Xie R. Ferreira E. Gu M. D. Dawson R. V. Penty and I. H. White. 2015. Micro-LED-based guided-wave optical links for visible light communications. In ICTON.","DOI":"10.1109\/ICTON.2015.7193686"},{"key":"e_1_3_2_1_5_1","volume-title":"Demystifying Parallel and Distributed Deep Learning: An In-depth Concurrency Analysis. Comput. Surveys 52, 4","author":"Ben-Nun Tal","year":"2019","unstructured":"Tal Ben-Nun and Torsten Hoefler. 2019. Demystifying Parallel and Distributed Deep Learning: An In-depth Concurrency Analysis. Comput. Surveys 52, 4 (2019)."},{"key":"e_1_3_2_1_6_1","unstructured":"Broadcom 2025. Broadcom Extends 200G\/lane DSP PHY Leadership for Next-Generation AI Infrastructure. https:\/\/www.broadcom.com\/company\/news\/product-releases\/62986"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"crossref","unstructured":"Burcu Canakci Junyi Liu Xingbo Wu Nathanael Cheriere Paolo Costa Sergey Legtchenko Dushyanth Narayanan and Ant Rowstron. 2025. Good things come in small packages: Should we build AI clusters with Lite-GPUs?. In HotOS.","DOI":"10.1145\/3713082.3730390"},{"key":"e_1_3_2_1_8_1","unstructured":"Reza Chaji. 2024. Why MicroLED is Poised to Revolutionize Wearable Technology. https:\/\/www.microled-info.com\/why-microled-poised-revolutionize-wearable-technology."},{"key":"e_1_3_2_1_9_1","first-page":"11","volume":"5","author":"Cheng Qixiang","year":"2018","unstructured":"Qixiang Cheng, Chen Sun, Mark T. Wade, Yunsup Lee, Mark J. Byrd, Jason S. Orcutt, Rajeev J. Ram, Vladimir Stojanovi\u0107, and Milos Popovi\u0107. 2018. Recent Advances in Optical Technologies for Data Centers: A Review. Optica 5, 11 (2018).","journal-title":"Review. Optica"},{"key":"e_1_3_2_1_10_1","doi-asserted-by":"crossref","unstructured":"Inho Cho Keon Jang and Dongsu Han. 2017. Credit-Scheduled Delay-Bounded Congestion Control for Datacenters. In SIGCOMM.","DOI":"10.1145\/3098822.3098840"},{"key":"e_1_3_2_1_11_1","volume-title":"Dawson","author":"Ferreira Ricardo X. G.","year":"2016","unstructured":"Ricardo X. G. Ferreira, Enyuan Xie, Jonathan J. D. McKendry, Sujan Rajbhandari, Hyunchae Chun, Grahame Faulkner, Scott Watson, Anthony E. Kelly, Erdan Gu, Richard V. Penty, Ian H. White, Dominic C. O'Brien, and Martin D. Dawson. 2016. High Bandwidth GaN-Based Micro-LEDs for Multi-Gb\/s Visible Light Communications. IEEE Photonics Technology Letters 28, 19 (2016)."},{"key":"e_1_3_2_1_12_1","unstructured":"FS.com 2022. Top of Rack and End of Row: What's the Difference? https:\/\/www.fs.com\/blog\/top-of-rack-and-end-of-row-whats-the-difference-2934.html"},{"key":"e_1_3_2_1_13_1","unstructured":"Peter X. Gao Akshay Narayan Sagar Karandikar Jo\u00e3o Carreira Sangjin Han Rachit Agarwal Sylvia Ratnasamy and Scott Shenker. 2016. Network Requirements for Resource Disaggregation. In OSDI."},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2024.3373763"},{"key":"e_1_3_2_1_15_1","unstructured":"Gregory Haley. 2023. Nanoimprint Finally Finds Its Footing. https:\/\/semiengineering.com\/nanoimprint-finds-its-footing-in-photonics\/."},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"crossref","unstructured":"Mark Handley Costin Raiciu Alexandru Agache Andrei Voinescu Andrew W. Moore Gianni Antichi and Marcin W\u00f3jcik. 2017. Re-architecting Datacenter Networks and Stacks for Low Latency and High Performance. In SIGCOMM.","DOI":"10.1145\/3098822.3098825"},{"key":"e_1_3_2_1_17_1","unstructured":"Reece Hayden and Paul Schell. 2024. Opportunities and Challenges for Compute Express Link (CXL). Technical Report. ABI Research. https:\/\/computeexpresslink.org\/wp-content\/uploads\/2024\/11\/CR-CXL-101_FINAL.pdf"},{"key":"e_1_3_2_1_18_1","unstructured":"Congjie He Yeqi Huang Pei Mu Ziming Miao Jilong Xue Lingxiao Ma Fan Yang and Luo Mai. 2025. WaferLLM: A Wafer-Scale LLM Inference System. In OSDI."},{"key":"e_1_3_2_1_19_1","volume-title":"Patterson","author":"Hennessy John L.","year":"1990","unstructured":"John L. Hennessy and David A. Patterson. 1990. Computer Architecture: A Quantitative Approach. United States."},{"key":"e_1_3_2_1_20_1","unstructured":"HitechGlobal 2024. HTG-940: Xilinx Virtex UltraScale+ QUAD FMC+ Development Platform. https:\/\/www.hitechglobal.com\/Boards\/UltraScale+QuadFMC+.htm"},{"key":"e_1_3_2_1_21_1","volume-title":"Stupid!","author":"Hoefler Torsten","unstructured":"Torsten Hoefler. 2016. Network Topologies for Large-Scale Compute Centers: It's the Diameter, Stupid!. In IEEE High-Performance Interconnects (HOTI)."},{"key":"e_1_3_2_1_22_1","volume-title":"GTC","author":"Huang Jensen","year":"2024","unstructured":"Jensen Huang. 2024. GTC March 2024 Keynote. https:\/\/www.youtube.com\/live\/Y2F8yisiS6E?feature=shared&t=2867."},{"key":"e_1_3_2_1_23_1","unstructured":"IEEE 2022. IEEE 802.3ck-2022. https:\/\/standards.ieee.org\/ieee\/802.3ck\/7322\/"},{"key":"e_1_3_2_1_24_1","volume-title":"Cambridge University Press","author":"Iizuka Tetsuya","unstructured":"Tetsuya Iizuka. 2015. CMOS Technology Scaling and Its Implications. In Digitally-Assisted Analog and Analog-Assisted Digital IC Design, Xicheng Jiang (Ed.). Cambridge University Press, Cambridge, UK."},{"key":"e_1_3_2_1_25_1","unstructured":"Intel Corporation. 2021. Accelerating Innovation Through AIB. Technical Report. Intel Corporation. https:\/\/www.intel.com\/content\/dam\/www\/public\/us\/en\/documents\/white-papers\/accelerating-innovation-through-aib-whitepaper.pdf Accessed: 2024-02-02."},{"key":"e_1_3_2_1_26_1","doi-asserted-by":"crossref","unstructured":"Norman P. Jouppi George Kurian Sheng Li Peter Ma Rahul Nagarajan Lifeng Nai Nishant Patil Suvinay Subramanian Andy Swing Brian Towles Cliff Young Xiang Zhou Zongwei Zhou and David Patterson. 2023. TPU v4: An Optically Reconfigurable Supercomputer for Machine Learning with Hardware Support for Embeddings. In ISCA.","DOI":"10.1145\/3579371.3589350"},{"key":"e_1_3_2_1_27_1","unstructured":"Sarfraz Khan. 2025. AMD Instinct MI400 Spotted in Latest Patches Will Feature Up to 8 Chiplets on Dual Interposer Dies. Wccftech. https:\/\/wccftech.com\/amd-instinct-mi400-spotted-feature-up-to-8-chiplets-on-dual-interposer-dies\/"},{"key":"e_1_3_2_1_28_1","doi-asserted-by":"crossref","unstructured":"Mohammad Khani Manya Ghobadi Mohammad Alizadeh Zihuai Zhu Meir Glick Keren Bergman and Amin Vahdat. 2021. SiP-ML: High-Bandwidth Optical Network Interconnects for Machine Learning Training. In SIGCOMM.","DOI":"10.1145\/3452296.3472900"},{"key":"e_1_3_2_1_29_1","doi-asserted-by":"crossref","unstructured":"Sergey Legtchenko Ioan Stefanovici Richard Black Ant Rowstron Junyi Liu Paolo Costa Burcu Canakci Dushyanth Narayanan and Xingbo Wu. 2025. Storage Class Memory is Dead All Hail Managed-Retention Memory: Rethinking Memory for the AI Era. In HotOS.","DOI":"10.1145\/3713082.3730381"},{"key":"e_1_3_2_1_30_1","volume-title":"Toshio Sudo, Toshihiro Hosoi, Hiroaki Tsuyoshi, and Fujio Kuwako.","author":"Liew Elaine","year":"2014","unstructured":"Elaine Liew, Taka Aki Okubo, Toshio Sudo, Toshihiro Hosoi, Hiroaki Tsuyoshi, and Fujio Kuwako. 2014. Signal transmission loss due to copper surface roughness in high-frequency region. In IPC APEX EXPO."},{"key":"e_1_3_2_1_31_1","volume-title":"Liangyu Zhao, Vincent Liu, Miguel Castro, Srikanth Kandula, and Luke Marshall.","author":"Liu Xuting","year":"2024","unstructured":"Xuting Liu, Behnaz Arzani, Siva Kesava Reddy Kakarla, Liangyu Zhao, Vincent Liu, Miguel Castro, Srikanth Kandula, and Luke Marshall. 2024. Rethinking Machine Learning Collective Communication as a Multi-Commodity Flow Problem. In SIGCOMM."},{"key":"e_1_3_2_1_32_1","unstructured":"Marvell 2024. Industry's 1st 1.6T AEC DSP for Accelerated Infrastructure Copper Connections. https:\/\/www.marvell.com\/content\/dam\/marvell\/en\/company\/media-kit\/marvell-alaska-a-1-6t-dsp-for-aec-media-deck.pdf"},{"key":"e_1_3_2_1_33_1","volume-title":"Co-packaged datacenter optics: Opportunities and challenges. IET Optoelectronics 15, 2","author":"Minkenberg Cyriel","year":"2021","unstructured":"Cyriel Minkenberg, Rajagopal Krishnaswamy, Aaron Zilkie, and David Nelson. 2021. Co-packaged datacenter optics: Opportunities and challenges. IET Optoelectronics 15, 2 (2021)."},{"key":"e_1_3_2_1_34_1","doi-asserted-by":"publisher","DOI":"10.1145\/3230543.3230564"},{"key":"e_1_3_2_1_35_1","volume-title":"Nvidia Draws GPU System Roadmap Out To","author":"Morgan Timothy Prickett","year":"2028","unstructured":"Timothy Prickett Morgan. 2025. Nvidia Draws GPU System Roadmap Out To 2028. Technical Report. NextPlatform. https:\/\/www.nextplatform.com\/2025\/03\/19\/nvidia-draws-gpu-system-roadmap-out-to-2028\/"},{"key":"e_1_3_2_1_36_1","volume-title":"Chiplet Summit","author":"Mota Manuel","year":"2023","unstructured":"Manuel Mota. 2023. UCIe: An Open Standard Interface for Chiplet-Based Multi-Die Systems. In Chiplet Summit 2023. Synopsys."},{"key":"e_1_3_2_1_37_1","doi-asserted-by":"crossref","first-page":"12","DOI":"10.1109\/JLT.2023.3311363","volume":"42","author":"Nagarajan Radhakrishnan","year":"2024","unstructured":"Radhakrishnan Nagarajan, Agustin Martino, Damian A. Morero, Lenin Patra, Christian Lutkemeyer, and Mario A. Castrill\u00f3n. 2024. Recent Advances in Low-Power Digital Signal Processing Technologies for Data Center Applications. Journal of Lightwave Technology 42, 12 (2024).","journal-title":"Lightwave Technology"},{"key":"e_1_3_2_1_38_1","unstructured":"NVIDIA 2024. NVLink and NVLink Switch. https:\/\/www.nvidia.com\/en-us\/data-center\/nvlink\/"},{"key":"e_1_3_2_1_39_1","unstructured":"NVIDIA Corporation 2024. NVIDIA Blackwell Architecture. https:\/\/resources.nvidia.com\/en-us-blackwell-architecture"},{"key":"e_1_3_2_1_40_1","unstructured":"NVIDIA Corporation 2024. NVIDIA GB200 NVL72. https:\/\/nvdam.widen.net\/s\/wwnsxrhm2w\/blackwell-datasheet-3384703"},{"key":"e_1_3_2_1_41_1","unstructured":"NVIDIA\/Mellanox 2025. Compatible 1.6T OSFP Close Top InfiniBand XDR Passive Direct Attach Copper Twinax Cable. https:\/\/www.broadcom.com\/company\/news\/product-releases\/62491"},{"key":"e_1_3_2_1_42_1","unstructured":"The Open Compute Project (OCP). 2023. Bunch of Wires (BoW) PHY Specification. https:\/\/www.opencompute.org\/documents\/bow-specification-v2-0d-1-pdf."},{"key":"e_1_3_2_1_43_1","unstructured":"The Open Compute Project (OCP). 2023. OpenHBI Specification Version 1.0. https:\/\/www.opencompute.org\/documents\/odsa-openhbi-v1-0-spec-rc-final-1-pdf."},{"key":"e_1_3_2_1_44_1","volume-title":"Micro-Light Emitting Diode: From Chips to Applications. Laser & Photonics Reviews 14, 8","author":"Parbrook Peter J.","year":"2021","unstructured":"Peter J. Parbrook, Brian Corbett, Jung Han, Tae-Yeon Seong, and Hiroshi Amano. 2021. Micro-Light Emitting Diode: From Chips to Applications. Laser & Photonics Reviews 14, 8 (2021)."},{"key":"e_1_3_2_1_45_1","volume-title":"Jeremie Eliahou Ontiveros, and Daniel Nishball","author":"Patel Dylan","year":"2024","unstructured":"Dylan Patel, Wega Chu, Chaolien Tseng, Myron Xie, Jeremie Eliahou Ontiveros, and Daniel Nishball. 2024. GB200 Hardware Architecture - Component Supply Chain and BOM. SemiAnalysis. https:\/\/semianalysis.com\/2024\/07\/17\/gb200-hardware-architecture-and-component\/"},{"key":"e_1_3_2_1_46_1","unstructured":"Dylan Patel and Daniel Nishball. 2024. 100 000 H100 Clusters: Power Network Topology Ethernet vs InfiniBand Reliability Failures Checkpointing. Technical Report. SemiAnalysis. https:\/\/semianalysis.com\/2024\/06\/17\/100000-h100-clusters-power-network\/"},{"key":"e_1_3_2_1_47_1","unstructured":"Dylan Patel and Daniel Nishball. 2024. Nvidia's Optical Boogeyman - NVL72 Infiniband Scale Out 800G & 1.6T Ramp. Technical Report. SemiAnalysis. https:\/\/semianalysis.com\/2024\/03\/25\/nvidias-optical-boogeyman-nvl72-infiniband\/"},{"key":"e_1_3_2_1_48_1","unstructured":"Dylan Patel Daniel Nishball and Reyk Knuhtsen. 2024. Amazon's AI Self Sufficiency: Trainium2 Architecture & Networking. Technical Report. SemiAnalysis. https:\/\/semianalysis.com\/2024\/12\/03\/amazons-ai-self-sufficiency-trainium2-architecture-networking"},{"key":"e_1_3_2_1_49_1","unstructured":"Dylan Patel Myron Xie and Gerald Wong. 2023. AI Capacity Constraints - CoWoS and HBM Supply Chain. SemiAnalysis. https:\/\/semianalysis.com\/2023\/07\/05\/ai-capacity-constraints-cowos-and\/"},{"key":"e_1_3_2_1_50_1","volume-title":"Splitwise: Efficient generative LLM inference using phase splitting. In ISCA.","author":"Patel Pratyush","year":"2024","unstructured":"Pratyush Patel, Esha Choukse, Chaojie Zhang, Aashaka Shah, \u00cd\u00f1igo Goiri, Saeed Maleki, and Ricardo Bianchini. 2024. Splitwise: Efficient generative LLM inference using phase splitting. In ISCA."},{"key":"e_1_3_2_1_51_1","doi-asserted-by":"crossref","unstructured":"Bardia Pezeshki Farzad Khoeini Alex Tselikov Robert F. Kalman Cameron Danesh and Emad Afifi. 2022. LED-array based optical interconnects for chip-to-chip communications with integrated CMOS drivers detectors and circuitry. In Optical Interconnects.","DOI":"10.1117\/12.2614547"},{"key":"e_1_3_2_1_52_1","doi-asserted-by":"crossref","unstructured":"Bardia Pezeshki Suresh Rangarajan Alex Tselikov Emad Afifi Ivan Huang Jeff Pepper Sarah Zou Howard Rourke Rowan Pocock Alasdair Fikouras Farzad Khoeini Vahid Mirkhani Steve Novak and Rob Kalman. 2024. 304 channel MicroLED based CMOS transceiver IC with aggregate 1 Tbps and sub-pJ per bit capability. In OFC.","DOI":"10.1364\/OFC.2024.M3A.1"},{"key":"e_1_3_2_1_53_1","unstructured":"Timothy Prickett Morgan. 2024. We Can't Get Enough HBM Or Stack It Up High Enough. The Next Platform. https:\/\/www.nextplatform.com\/2024\/11\/06\/we-cant-get-enough-hbm-or-stack-it-up-high-enough\/"},{"key":"e_1_3_2_1_54_1","volume-title":"MSA 2017","year":"2017","unstructured":"QSFP-DD MSA 2017. Accelerating 400GbE Adoption with QSFP-DD. http:\/\/www.qsfp-dd.com\/wp-content\/uploads\/2017\/03\/QSFP-DD-whitepaper-15.pdf"},{"key":"e_1_3_2_1_55_1","doi-asserted-by":"publisher","DOI":"10.1002\/0470014180"},{"key":"e_1_3_2_1_56_1","unstructured":"Lei Shan. 2024. The Bunch of Wires (BoW) - An Open-Source Physical Interface Enabling Chiplet Architectures. Technical Report. Ampere Computing. https:\/\/eps.ieee.org\/images\/files\/TC_The_Bunch_of_Wires_rev3.pdf"},{"key":"e_1_3_2_1_57_1","unstructured":"Debendra Das Sharma. 2022. The History of PCI IO Technology: 30 Years of PCI-SIG Innovation. Webinar. https:\/\/pcisig.com\/sites\/default\/files\/files\/30%20Years%20of%20PCI-SIG%20Innovation%20Webinar_Final%20Slides.pdf"},{"key":"e_1_3_2_1_58_1","unstructured":"Anton Shilov. 2025. TSMC mulls massive 1000W-class multi-chiplet processors with 40X the performance of standard models. Tom's Hardware. https:\/\/www.tomshardware.com\/tech-industry\/tsmc-mulls-massive-1000w-class-multi-chiplet-processors-with-40x-the-performance-of-standard-models"},{"key":"e_1_3_2_1_59_1","unstructured":"Priyank Shukla. 2022. Short-Reach Interconnects for the Emerging Multi-Die System Era. In Solid-State Circuits Chapter. Synopsys. https:\/\/www.ieeetoronto.ca\/wp-content\/uploads\/2022\/12\/Short-Reach-Interconnect-for-the-Emerging-Multi-Die-System-Era.pdf."},{"key":"e_1_3_2_1_60_1","volume-title":"DAM: Differentiated Access Memory Systems and Applications. Technical Report. Stanford. https:\/\/dam.stanford.edu\/assets\/Stanford_DAM_2_Pages_2024.pdf","year":"2024","unstructured":"Stanford. 2024. DAM: Differentiated Access Memory Systems and Applications. Technical Report. Stanford. https:\/\/dam.stanford.edu\/assets\/Stanford_DAM_2_Pages_2024.pdf"},{"key":"e_1_3_2_1_61_1","unstructured":"The Information 2024. Nvidia Customers Worry About Snag With New AI Chip Servers. https:\/\/www.theinformation.com\/articles\/nvidia-customers-worry-about-snag-with-new-ai-chip-servers."},{"key":"e_1_3_2_1_62_1","volume-title":"Cisco Demonstrates Co-packaged Optics (CPO) System at OFC","author":"Torza Anthony","year":"2023","unstructured":"Anthony Torza. 2023. Cisco Demonstrates Co-packaged Optics (CPO) System at OFC 2023. https:\/\/blogs.cisco.com\/sp\/cisco-demonstrates-co-packaged-optics-cpo-system-at-ofc-2023."},{"key":"e_1_3_2_1_63_1","volume-title":"Frlan, and Steve Sekel","author":"Tracy Nathan","year":"2020","unstructured":"Nathan Tracy, Gary Nicholl, Cathy Liu, Mike Li, Ed Frlan, and Steve Sekel. 2020. 112 Gbps Electrical Interfaces - An OIF Update on CEI-112G. In OFC."},{"key":"e_1_3_2_1_64_1","unstructured":"Amin Vahdat. 2020. Coming of Age in the Fifth Epoch of Distributed Computing: The Power of Sustained Exponential Growth. https:\/\/www.youtube.com\/watch?v=27zuReojDVw&t=16s."},{"key":"e_1_3_2_1_65_1","volume-title":"green and blue InGaN micro-LEDs for display application: temperature and current density effects. Opt","author":"Wang Zhou","year":"2022","unstructured":"Zhou Wang, Shijie Zhu, Xinyi Shan, Zexing Yuan, Zeyuan Qian, Xinyi Lu, Yi Fu, Kui Tu, Hui Guan, Xugao Cui, and Pengfei Tian. 2022. Red, green and blue InGaN micro-LEDs for display application: temperature and current density effects. Opt. Express 30, 20 (2022)."}],"event":{"name":"SIGCOMM '25: ACM SIGCOMM 2025 Conference","location":"S\u00e3o Francisco Convent Coimbra Portugal","acronym":"SIGCOMM '25","sponsor":["SIGCOMM ACM Special Interest Group on Data Communication"]},"container-title":["Proceedings of the ACM SIGCOMM 2025 Conference"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3718958.3750510","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,27]],"date-time":"2025-08-27T16:58:04Z","timestamp":1756313884000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3718958.3750510"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,8,27]]},"references-count":65,"alternative-id":["10.1145\/3718958.3750510","10.1145\/3718958"],"URL":"https:\/\/doi.org\/10.1145\/3718958.3750510","relation":{},"subject":[],"published":{"date-parts":[[2025,8,27]]},"assertion":[{"value":"2025-08-27","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}