{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T19:23:12Z","timestamp":1770751392323,"version":"3.50.0"},"reference-count":12,"publisher":"Association for Computing Machinery (ACM)","issue":"3","content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":["ACM Trans. Des. Autom. Electron. Syst."],"published-print":{"date-parts":[[2026,5,31]]},"abstract":"<jats:p>Inkjet-printed electronics is a low-cost option for large-scale production. To avoid manufacturing defects, recent research has considered design constraints, such as Laplace and proximity conflicts, decomposed the layouts into different layers, and printed them sequentially. The state-of-the-art work reduced the manufacturing time by optimizing the number of layers and drying time. In this work, we aim to enhance manufacturing efficiency from a new angle, concurrently optimizing the printing time and the layout decomposition of inkjet-printed electronics. We propose an integer linear programming formulation and a dynamic programming algorithm to determine layout decomposition and layer assignment and to estimate the total printing time by carefully considering printing characteristics and design constraints. Experimental results demonstrate significant reductions in overall printing time, leading to improved fabrication efficiency.<\/jats:p>","DOI":"10.1145\/3721132","type":"journal-article","created":{"date-parts":[[2025,2,27]],"date-time":"2025-02-27T09:45:11Z","timestamp":1740649511000},"page":"1-16","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Layout Decomposition and Printing Time Optimization for Inkjet-Printed Electronics"],"prefix":"10.1145","volume":"31","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0872-480X","authenticated-orcid":false,"given":"Yi-Ting","family":"Lin","sequence":"first","affiliation":[{"name":"National Taiwan University","place":["Taipei, Taiwan"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3036-058X","authenticated-orcid":false,"given":"Meng","family":"Lian","sequence":"additional","affiliation":[{"name":"Technical University of Munich","place":["Munchen, Germany"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9432-1929","authenticated-orcid":false,"given":"Hu","family":"Peng","sequence":"additional","affiliation":[{"name":"Technical University of Munich","place":["Munchen, Germany"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4438-3755","authenticated-orcid":false,"given":"Bernhard","family":"Wolfrum","sequence":"additional","affiliation":[{"name":"Technical University of Munich","place":["Munchen, Germany"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1032-8408","authenticated-orcid":false,"given":"Tsun-Ming","family":"Tseng","sequence":"additional","affiliation":[{"name":"Technical University of Munich","place":["Munchen, Germany"]}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4554-3442","authenticated-orcid":false,"given":"Iris Hui-Ru","family":"Jiang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Graduate Institute of Electronics Engineering, National Taiwan University","place":["Taipei, Taiwan"]}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2026,2,10]]},"reference":[{"key":"e_1_3_2_2_2","doi-asserted-by":"publisher","DOI":"10.3390\/ma13030704"},{"key":"e_1_3_2_3_2","doi-asserted-by":"publisher","DOI":"10.1039\/C6LC01064D"},{"key":"e_1_3_2_4_2","doi-asserted-by":"publisher","DOI":"10.1109\/TSSC.1968.300136"},{"key":"e_1_3_2_5_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681616"},{"key":"e_1_3_2_6_2","doi-asserted-by":"publisher","DOI":"10.3390\/electronics9101636"},{"key":"e_1_3_2_7_2","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488818"},{"key":"e_1_3_2_8_2","doi-asserted-by":"publisher","DOI":"10.1089\/soro.2013.0005"},{"key":"e_1_3_2_9_2","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/ab4c1c"},{"key":"e_1_3_2_10_2","doi-asserted-by":"publisher","DOI":"10.1126\/science.1182383"},{"key":"e_1_3_2_11_2","first-page":"17","volume-title":"34th European Solid-state Circuits Conference (ESSCIRC\u201908)","author":"Subramanian Vivek","year":"2008","unstructured":"Vivek Subramanian, Josephine B. Chang, Alejandro de la Fuente Vornbrock, Daniel C. Huang, Lakshmi Jagannathan, Frank Liao, Brian Mattis, Steven Molesa, David R. Redinger, Daniel Soltman et\u00a0al. 2008. Printed electronics for low-cost electronic systems: Technology status and application development. In 34th European Solid-state Circuits Conference (ESSCIRC\u201908). 17\u201324."},{"key":"e_1_3_2_12_2","doi-asserted-by":"publisher","DOI":"10.1039\/c2tc00255h"},{"key":"e_1_3_2_13_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643438"}],"container-title":["ACM Transactions on Design Automation of Electronic Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3721132","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T13:55:22Z","timestamp":1770731722000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3721132"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,2,10]]},"references-count":12,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2026,5,31]]}},"alternative-id":["10.1145\/3721132"],"URL":"https:\/\/doi.org\/10.1145\/3721132","relation":{},"ISSN":["1084-4309","1557-7309"],"issn-type":[{"value":"1084-4309","type":"print"},{"value":"1557-7309","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,2,10]]},"assertion":[{"value":"2024-08-30","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2025-02-17","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-02-10","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}