{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,7]],"date-time":"2026-05-07T02:39:47Z","timestamp":1778121587977,"version":"3.51.4"},"publisher-location":"New York, NY, USA","reference-count":108,"publisher":"ACM","funder":[{"name":"EPSRC pro2 Network+","award":["EP\/W020564\/1"],"award-info":[{"award-number":["EP\/W020564\/1"]}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2026,3,8]]},"DOI":"10.1145\/3731459.3773307","type":"proceedings-article","created":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T13:35:51Z","timestamp":1772890551000},"page":"1-19","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Printegrated Circuits: Personal Fabrication of 3D Printed Devices with Embedded PCBs"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9699-1288","authenticated-orcid":false,"given":"Oliver","family":"Child","sequence":"first","affiliation":[{"name":"Deparment of Computer Science, University of Bristol, Bristol, United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8261-1099","authenticated-orcid":false,"given":"Ollie","family":"Hanton","sequence":"additional","affiliation":[{"name":"Department of Computer Science, University of Bath, Bath, United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8477-4489","authenticated-orcid":false,"given":"Jack","family":"Dawson","sequence":"additional","affiliation":[{"name":"Department of Computer Science, University of Bath, Bath, United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9314-7762","authenticated-orcid":false,"given":"Steve","family":"Hodges","sequence":"additional","affiliation":[{"name":"School of Computing and Communications, Lancaster University, Lancaster, United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9374-3759","authenticated-orcid":false,"given":"Mike","family":"Fraser","sequence":"additional","affiliation":[{"name":"Deparment of Computer Science, University of Bristol, Bristol, United Kingdom"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2026,3,7]]},"reference":[{"key":"e_1_3_3_3_2_2","unstructured":"Voxel8.2019. https:\/\/www.voxel8.com\/. Last accessed September 2019. archiveurl: https:\/\/web.archive.org\/web\/20160112091937\/http:\/\/voxel8.co\/ archivedate=14 December 2016."},{"key":"e_1_3_3_3_3_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3581361"},{"key":"e_1_3_3_3_4_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491101.3519823"},{"key":"e_1_3_3_3_5_2","doi-asserted-by":"publisher","DOI":"10.1145\/3654777.3676468"},{"key":"e_1_3_3_3_6_2","doi-asserted-by":"publisher","DOI":"10.1145\/1517664.1517743"},{"key":"e_1_3_3_3_7_2","doi-asserted-by":"publisher","DOI":"10.1145\/3689050.3704427"},{"key":"e_1_3_3_3_8_2","unstructured":"Botfactory. 2025. BotFactory Inc. Last Accessed 2025. https:\/\/www.botfactory.co\/"},{"key":"e_1_3_3_3_9_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3581540"},{"key":"e_1_3_3_3_10_2","doi-asserted-by":"publisher","DOI":"10.1145\/2945078.2945093"},{"key":"e_1_3_3_3_11_2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-22701-6_25"},{"key":"e_1_3_3_3_12_2","doi-asserted-by":"publisher","DOI":"10.1145\/2858036.2858354"},{"key":"e_1_3_3_3_13_2","doi-asserted-by":"publisher","unstructured":"Jorge Ca\u00f1ada Hyeonseok Kim and Luis\u00a0Fernando Vel\u00e1squez-Garc\u00eda. 2024. Three-dimensional soft magnetic-cored solenoids via multi-material extrusion. Virtual and Physical Prototyping 19 1 (Dec. 2024) e2310046. 10.1080\/17452759.2024.2310046Publisher: Taylor & Francis _eprint: https:\/\/doi.org\/10.1080\/17452759.2024.2310046.","DOI":"10.1080\/17452759.2024.2310046"},{"key":"e_1_3_3_3_14_2","doi-asserted-by":"publisher","DOI":"10.1109\/CPEEE56777.2023.10217558"},{"key":"e_1_3_3_3_15_2","doi-asserted-by":"publisher","unstructured":"Jorge Ca\u00f1ada and Luis\u00a0Fernando Vel\u00e1squez-Garc\u00eda. 2024. Semiconductor-free monolithically 3D-printed logic gates and resettable fuses. Virtual and Physical Prototyping 19 1 (Dec. 2024) e2404157. 10.1080\/17452759.2024.2404157Publisher: Taylor & Francis _eprint: https:\/\/doi.org\/10.1080\/17452759.2024.2404157.","DOI":"10.1080\/17452759.2024.2404157"},{"key":"e_1_3_3_3_16_2","doi-asserted-by":"publisher","DOI":"10.1145\/2207676.2208371"},{"key":"e_1_3_3_3_17_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3173736"},{"key":"e_1_3_3_3_18_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807498"},{"key":"e_1_3_3_3_19_2","unstructured":"Context. 2024. 3d_printing. https:\/\/www.contextworld.com\/research-updates\/3d_printing"},{"key":"e_1_3_3_3_20_2","doi-asserted-by":"publisher","DOI":"10.1145\/2901790.2901891"},{"key":"e_1_3_3_3_21_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807507"},{"key":"e_1_3_3_3_22_2","unstructured":"Dragonfly. 2025. DragonFly IV | A new era in 3D electronics printing Last Accessed 2025. https:\/\/www.nano-di.com\/dragonfly-iv"},{"key":"e_1_3_3_3_23_2","doi-asserted-by":"publisher","DOI":"10.1145\/3689050.3704949"},{"key":"e_1_3_3_3_24_2","doi-asserted-by":"publisher","unstructured":"Chad Duty Jordan Failla Seokpum Kim Tyler Smith John Lindahl and Vlastimil Kunc. 2019. Z-Pinning approach for 3D printing mechanically isotropic materials. Additive Manufacturing 27 (May 2019) 175\u2013184. 10.1016\/j.addma.2019.03.007","DOI":"10.1016\/j.addma.2019.03.007"},{"key":"e_1_3_3_3_25_2","doi-asserted-by":"publisher","unstructured":"Patrick\u00a0F. Flowers Christopher Reyes Shengrong Ye Myung\u00a0Jun Kim and Benjamin\u00a0J. Wiley. 2017. 3D printing electronic components and circuits with conductive thermoplastic filament. Additive Manufacturing 18 (Dec. 2017) 156\u2013163. 10.1016\/j.addma.2017.10.002","DOI":"10.1016\/j.addma.2017.10.002"},{"key":"e_1_3_3_3_26_2","doi-asserted-by":"publisher","DOI":"10.1145\/3563657.3596106"},{"key":"e_1_3_3_3_27_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807476"},{"key":"e_1_3_3_3_28_2","unstructured":"Neil Gershenfeld. 2012. How to Make Almost Anything: The Digital Fabrication Revolution Essay. Foreign Affairs 91 6 (2012) [i]\u201357. https:\/\/heinonline.org\/HOL\/P?h=hein.journals\/fora91&i=1081"},{"key":"e_1_3_3_3_29_2","volume-title":"Fab: The Coming Revolution on Your Desktop\u2013from Personal Computers to Personal Fabrication","author":"Gershenfeld Neil\u00a0A.","year":"2005","unstructured":"Neil\u00a0A. Gershenfeld. 2005. Fab: The Coming Revolution on Your Desktop\u2013from Personal Computers to Personal Fabrication. Basic Books. Google-Books-ID: Oil3bH6fKBkC."},{"key":"e_1_3_3_3_30_2","doi-asserted-by":"publisher","DOI":"10.1145\/3472749.3474806"},{"key":"e_1_3_3_3_31_2","doi-asserted-by":"publisher","unstructured":"Jesse\u00a0T. Gonzalez and Scott\u00a0E. Hudson. 2022. Layer by Layer Patterned Valves Enable Programmable Soft Surfaces. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 6 1 (March 2022) 12:1\u201312:25. 10.1145\/3517251","DOI":"10.1145\/3517251"},{"key":"e_1_3_3_3_32_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586183.3606740"},{"key":"e_1_3_3_3_33_2","doi-asserted-by":"publisher","DOI":"10.1145\/2984511.2984513"},{"key":"e_1_3_3_3_34_2","doi-asserted-by":"publisher","unstructured":"Tobias Grosse-Puppendahl Christian Holz Gabe Cohn Raphael Wimmer Oskar Bechtold Steve Hodges Matthew Reynolds and Joshua Smith. 2017. Finding Common Ground: A Survey of Capacitive Sensing in Human-Computer Interaction. 10.1145\/3025453.3025808","DOI":"10.1145\/3025453.3025808"},{"key":"e_1_3_3_3_35_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642708"},{"key":"e_1_3_3_3_36_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376543"},{"key":"e_1_3_3_3_37_2","volume-title":"Proceedings of TEI 2025","author":"Hartley Kobi","year":"2025","unstructured":"Kobi Hartley, Aron Eggens, James Hahn, , Steve Hodges, Andrew Scott, Joe Finney, Charly Olivier, Mannu Lambrichts, Lorraine Underwood, and Jan Hollinshead. 2025. MakeDevice: Easing the path from hardware prototyping toolkits to manufacturable devices. In Proceedings of TEI 2025."},{"key":"e_1_3_3_3_38_2","doi-asserted-by":"publisher","DOI":"10.1145\/3569009.3573106"},{"key":"e_1_3_3_3_39_2","doi-asserted-by":"publisher","unstructured":"Liang He Jarrid\u00a0A. Wittkopf Ji\u00a0Won Jun Kris Erickson and Rafael\u00a0Tico Ballagas. 2022. ModElec: A Design Tool for Prototyping Physical Computing Devices Using Conductive 3D Printing. Proceedings of the ACM on Interactive Mobile Wearable and Ubiquitous Technologies 5 4 (Dec. 2022) 159:1\u2013159:20. 10.1145\/3495000","DOI":"10.1145\/3495000"},{"key":"e_1_3_3_3_40_2","doi-asserted-by":"publisher","DOI":"10.1145\/3746027.3758124"},{"key":"e_1_3_3_3_41_2","doi-asserted-by":"publisher","unstructured":"Steve Hodges and Nicholas Chen. 2019. Long Tail Hardware: Turning Device Concepts Into Viable Low Volume Products. IEEE Pervasive Computing 18 4 (Oct. 2019) 51\u201359. 10.1109\/MPRV.2019.2947966Conference Name: IEEE Pervasive Computing.","DOI":"10.1109\/MPRV.2019.2947966"},{"key":"e_1_3_3_3_42_2","doi-asserted-by":"publisher","unstructured":"Steve Hodges Nicolas Villar James Scott and Albrecht Schmidt. 2012. A New Era for Ubicomp Development. IEEE Pervasive Computing 11 1 (Jan. 2012) 5\u20139. 10.1109\/MPRV.2012.1Conference Name: IEEE Pervasive Computing.","DOI":"10.1109\/MPRV.2012.1"},{"key":"e_1_3_3_3_43_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491101.3519782"},{"key":"e_1_3_3_3_44_2","doi-asserted-by":"publisher","unstructured":"Freddie Hong Borut Lampret Connor Myant Steve Hodges and David Boyle. 2023. 5-axis multi-material 3D printing of curved electrical traces. Additive Manufacturing 70 (May 2023) 103546. 10.1016\/j.addma.2023.103546","DOI":"10.1016\/j.addma.2023.103546"},{"key":"e_1_3_3_3_45_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445469"},{"key":"e_1_3_3_3_46_2","doi-asserted-by":"publisher","DOI":"10.1145\/2559206.2581137"},{"key":"e_1_3_3_3_47_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3174095"},{"key":"e_1_3_3_3_48_2","doi-asserted-by":"publisher","DOI":"10.1145\/3332167.3356895"},{"key":"e_1_3_3_3_49_2","doi-asserted-by":"publisher","unstructured":"Vikram Iyer Justin Chan and Shyamnath Gollakota. 2017. 3D printing wireless connected objects. ACM Trans. Graph. 36 6 (Nov. 2017) 242:1\u2013242:13. 10.1145\/3130800.3130822","DOI":"10.1145\/3130800.3130822"},{"key":"e_1_3_3_3_50_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICRA.2017.7989642"},{"key":"e_1_3_3_3_51_2","doi-asserted-by":"publisher","unstructured":"Kunihiro Kato Kaori Ikematsu and Yoshihiro Kawahara. 2020. CAPath: 3D-Printed Interfaces with Conductive Points in Grid Layout to Extend Capacitive Touch Inputs. Proc. ACM Hum.-Comput. Interact. 4 ISS (Nov. 2020) 193:1\u2013193:17. 10.1145\/3427321","DOI":"10.1145\/3427321"},{"key":"e_1_3_3_3_52_2","doi-asserted-by":"publisher","DOI":"10.1145\/2984751.2985700"},{"key":"e_1_3_3_3_53_2","doi-asserted-by":"publisher","DOI":"10.1145\/2493432.2493486"},{"key":"e_1_3_3_3_54_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376761"},{"key":"e_1_3_3_3_55_2","doi-asserted-by":"publisher","DOI":"10.1145\/1891903.1891931"},{"key":"e_1_3_3_3_56_2","doi-asserted-by":"publisher","unstructured":"Mannu Lambrichts Raf Ramakers Steve Hodges Sven Coppers and James Devine. 2021. A Survey and Taxonomy of Electronics Toolkits for Interactive and Ubiquitous Device Prototyping. Proceedings of the ACM on Interactive Mobile Wearable and Ubiquitous Technologies 5 2 (June 2021) 70:1\u201370:24. 10.1145\/3463523","DOI":"10.1145\/3463523"},{"key":"e_1_3_3_3_57_2","doi-asserted-by":"publisher","unstructured":"Simon\u00a0J. Leigh Robert\u00a0J. Bradley Christopher\u00a0P. Purssell Duncan\u00a0R. Billson and David\u00a0A. Hutchins. 2012. A Simple Low-Cost Conductive Composite Material for 3D Printing of Electronic Sensors. PLOS ONE 7 11 (Nov. 2012) e49365. 10.1371\/journal.pone.0049365Publisher: Public Library of Science.","DOI":"10.1371\/journal.pone.0049365"},{"key":"e_1_3_3_3_58_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3714282"},{"key":"e_1_3_3_3_59_2","doi-asserted-by":"publisher","DOI":"10.1145\/3654777.3676398"},{"key":"e_1_3_3_3_60_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376189"},{"key":"e_1_3_3_3_61_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642537"},{"key":"e_1_3_3_3_62_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445692"},{"key":"e_1_3_3_3_63_2","doi-asserted-by":"publisher","DOI":"10.1145\/2858036.2858447"},{"key":"e_1_3_3_3_64_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3174015"},{"key":"e_1_3_3_3_65_2","unstructured":"Optomec. [n. d.]. Optomec - 3D PRINTING SOLUTIONS FOR AN ADDITIVE MANUFACTURING WORLD. https:\/\/optomec.com\/"},{"key":"e_1_3_3_3_66_2","volume-title":"Open Circuits: The Inner Beauty of Electronic Components","author":"Oskay Windell","year":"2022","unstructured":"Windell Oskay and Eric Schlaepfer. 2022. Open Circuits: The Inner Beauty of Electronic Components. No Starch Press. Google-Books-ID: StOQEAAAQBAJ."},{"key":"e_1_3_3_3_67_2","doi-asserted-by":"publisher","unstructured":"Gianpaolo Palma Narges Pourjafarian J\u00fcrgen Steimle and Paolo Cignoni. 2024. Capacitive Touch Sensing on General 3D Surfaces. ACM Trans. Graph. 43 4 (July 2024) 103:1\u2013103:20. 10.1145\/3658185","DOI":"10.1145\/3658185"},{"key":"e_1_3_3_3_68_2","doi-asserted-by":"publisher","DOI":"10.1145\/2984511.2984523"},{"key":"e_1_3_3_3_69_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491102.3502074"},{"key":"e_1_3_3_3_70_2","unstructured":"Protopasta. [n. d.]. 3D Printing a Multi-Material Conductive Touch-Sensitive 3D Printed Controller for Makey Makey With a Single Extruder 3D Printer. https:\/\/www.instructables.com\/Single-Extruder-Multi-Material\/"},{"key":"e_1_3_3_3_71_2","doi-asserted-by":"publisher","DOI":"10.1145\/2771839.2771873"},{"key":"e_1_3_3_3_72_2","doi-asserted-by":"publisher","DOI":"10.1145\/3623263.3623361"},{"key":"e_1_3_3_3_73_2","volume-title":"Proceedings of TEI 2012 Works in Progress","author":"Sarik John","year":"2012","unstructured":"John Sarik, Alex Butler, Nicolas Villar, James Scott, and Steve Hodges. 2012. Combining 3D printing and printable electronics. In Proceedings of TEI 2012 Works in Progress. https:\/\/www.microsoft.com\/en-us\/research\/wp-content\/uploads\/2016\/02\/07-sarik.done_.pdf"},{"key":"e_1_3_3_3_74_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807508"},{"key":"e_1_3_3_3_75_2","doi-asserted-by":"publisher","DOI":"10.1145\/2642918.2647374"},{"key":"e_1_3_3_3_76_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807503"},{"key":"e_1_3_3_3_77_2","doi-asserted-by":"publisher","DOI":"10.1145\/2851581.2892275"},{"key":"e_1_3_3_3_78_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445641"},{"key":"e_1_3_3_3_79_2","doi-asserted-by":"publisher","DOI":"10.1145\/3025453.3025663"},{"key":"e_1_3_3_3_80_2","doi-asserted-by":"publisher","DOI":"10.1145\/3290605.3300684"},{"key":"e_1_3_3_3_81_2","doi-asserted-by":"publisher","unstructured":"Corey Shemelya Fernando Cedillos Efrian Aguilera David Espalin Danny Muse Ryan Wicker and Eric MacDonald. 2015. Encapsulated Copper Wire and Copper Mesh Capacitive Sensing for 3-D Printing Applications. IEEE Sensors Journal 15 2 (Feb. 2015) 1280\u20131286. 10.1109\/JSEN.2014.2356973Conference Name: IEEE Sensors Journal.","DOI":"10.1109\/JSEN.2014.2356973"},{"key":"e_1_3_3_3_82_2","doi-asserted-by":"publisher","unstructured":"Yu Song Roy\u00a0A. Boekraad Lampros Roussos Adrie Kooijman Charlie C.\u00a0L. Wang and Jo\u00a0M.\u00a0P. Geraedts. 2017. 3D Printed Electronics: Opportunities and Challenges From Case Studies. American Society of Mechanical Engineers Digital Collection. 10.1115\/DETC2017-67503","DOI":"10.1115\/DETC2017-67503"},{"key":"e_1_3_3_3_83_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3713354"},{"key":"e_1_3_3_3_84_2","doi-asserted-by":"publisher","DOI":"10.1145\/3654777.3676427"},{"key":"e_1_3_3_3_85_2","doi-asserted-by":"publisher","DOI":"10.1145\/3290605.3300797"},{"key":"e_1_3_3_3_86_2","volume-title":"Electrical Conductivity in Polymer-Based Composites: Experiments, Modelling, and Applications","author":"Taherian Reza","year":"2018","unstructured":"Reza Taherian and Ayesha Kausar. 2018. Electrical Conductivity in Polymer-Based Composites: Experiments, Modelling, and Applications. William Andrew. Google-Books-ID: wuR8DwAAQBAJ."},{"key":"e_1_3_3_3_87_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3581334"},{"key":"e_1_3_3_3_88_2","doi-asserted-by":"publisher","DOI":"10.1145\/3461778.3462024"},{"key":"e_1_3_3_3_89_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445653"},{"key":"e_1_3_3_3_90_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586183.3606802"},{"key":"e_1_3_3_3_91_2","doi-asserted-by":"publisher","unstructured":"Nobuyuki Umetani and Ryan Schmidt. 2017. SurfCuit: Surface-Mounted Circuits on 3D Prints. IEEE Computer Graphics and Applications 37 3 (May 2017) 52\u201360. 10.1109\/MCG.2017.40Conference Name: IEEE Computer Graphics and Applications.","DOI":"10.1109\/MCG.2017.40"},{"key":"e_1_3_3_3_92_2","doi-asserted-by":"publisher","unstructured":"C\u00e9sar M.\u00a0A. Vasques Jo\u00e3o P.\u00a0R. Ferreira Fernando A.\u00a0V. Figueiredo and Jo\u00e3o C.\u00a0C. Abrantes. 2025. On the Electrical Resistivity Measurement Methods and Properties of Conductive 3D-Printing PLA Filaments. Engineering Proceedings 87 1 (2025) 26. 10.3390\/engproc2025087026Publisher: Multidisciplinary Digital Publishing Institute.","DOI":"10.3390\/engproc2025087026"},{"key":"e_1_3_3_3_93_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376425"},{"key":"e_1_3_3_3_94_2","unstructured":"Voltera. [n. d.]. Voltera: Pioneering Prototyping Solutions for Additive Electronics. https:\/\/www.voltera.io\/"},{"key":"e_1_3_3_3_95_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445187"},{"key":"e_1_3_3_3_96_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586183.3606718"},{"key":"e_1_3_3_3_97_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3713692"},{"key":"e_1_3_3_3_98_2","unstructured":"Florens Wasserfall Daniel Ahlers Norman Hendrich and Jianwei Zhang. 2016. 3D-Printable Electronics - Integration of SMD Placement and Wiring into the Slicing Process for FDM Fabrication. (2016). https:\/\/hdl.handle.net\/2152\/89717 Publisher: University of Texas at Austin."},{"key":"e_1_3_3_3_99_2","doi-asserted-by":"publisher","unstructured":"Florens Wasserfall Norman Hendrich Daniel Ahlers and Jianwei Zhang. 2020. Topology-aware routing of 3D-printed circuits. Additive Manufacturing 36 (Dec. 2020) 101523. 10.1016\/j.addma.2020.101523","DOI":"10.1016\/j.addma.2020.101523"},{"key":"e_1_3_3_3_100_2","doi-asserted-by":"publisher","DOI":"10.1145\/2460625.2460659"},{"key":"e_1_3_3_3_101_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3714080"},{"key":"e_1_3_3_3_102_2","doi-asserted-by":"publisher","unstructured":"Zeyu Yan SuHwan Hong Josiah Hester Tingyu Cheng and Huaishu Peng. 2025. DissolvPCB: Fully Recyclable 3D-Printed Electronics with Liquid Metal Conductors and PVA Substrates. 10.1145\/3746059.3747604arXiv:https:\/\/arXiv.org\/abs\/2507.22193 [cs].","DOI":"10.1145\/3746059.3747604"},{"key":"e_1_3_3_3_103_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642765"},{"key":"e_1_3_3_3_104_2","doi-asserted-by":"publisher","DOI":"10.1145\/3526113.3545652"},{"key":"e_1_3_3_3_105_2","doi-asserted-by":"publisher","DOI":"10.1145\/2815585.2815731"},{"key":"e_1_3_3_3_106_2","doi-asserted-by":"publisher","DOI":"10.1145\/3025453.3025842"},{"key":"e_1_3_3_3_107_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376617"},{"key":"e_1_3_3_3_108_2","doi-asserted-by":"publisher","DOI":"10.1145\/3379337.3415898"},{"key":"e_1_3_3_3_109_2","doi-asserted-by":"publisher","unstructured":"Fabian Ziervogel Lukas Boxberger Andr\u00e9 Bucht and Welf-Guntram Drossel. 2021. Expansion of the Fused Filament Fabrication (FFF) Process Through Wire Embedding Automated Cutting and Electrical Contacting. IEEE Access 9 (2021) 43036\u201343049. 10.1109\/ACCESS.2021.3065873Conference Name: IEEE Access.","DOI":"10.1109\/ACCESS.2021.3065873"}],"event":{"name":"TEI '26: Twentieth International Conference on Tangible, Embedded, and Embodied Interaction","location":"Chicago IL USA","acronym":"TEI '26","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction"]},"container-title":["Proceedings of the Twentieth International Conference on Tangible, Embedded, and Embodied Interaction"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3731459.3773307","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,14]],"date-time":"2026-03-14T09:39:54Z","timestamp":1773481194000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3731459.3773307"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,3,7]]},"references-count":108,"alternative-id":["10.1145\/3731459.3773307","10.1145\/3731459"],"URL":"https:\/\/doi.org\/10.1145\/3731459.3773307","relation":{},"subject":[],"published":{"date-parts":[[2026,3,7]]},"assertion":[{"value":"2026-03-07","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}