{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,14]],"date-time":"2026-07-14T04:34:31Z","timestamp":1784003671102,"version":"3.55.0"},"publisher-location":"New York, NY, USA","reference-count":76,"publisher":"ACM","license":[{"start":{"date-parts":[[2025,9,27]],"date-time":"2025-09-27T00:00:00Z","timestamp":1758931200000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/www.acm.org\/publications\/policies\/copyright_policy#Background"}],"funder":[{"DOI":"10.13039\/100000001","name":"NSF (National Science Foundation)","doi-asserted-by":"publisher","award":["CNS-2324861,CNS-2430327"],"award-info":[{"award-number":["CNS-2324861,CNS-2430327"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2025,9,28]]},"DOI":"10.1145\/3746059.3747604","type":"proceedings-article","created":{"date-parts":[[2025,9,27]],"date-time":"2025-09-27T07:49:12Z","timestamp":1758959352000},"page":"1-17","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":9,"title":["DissolvPCB: Fully Recyclable 3D-Printed Electronics Using Liquid Metal Conductors and PVA Substrates"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0733-5746","authenticated-orcid":false,"given":"Zeyu","family":"Yan","sequence":"first","affiliation":[{"name":"Computer Science, University Of Maryland, College Park, College Park, Maryland, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-3404-7050","authenticated-orcid":false,"given":"Su Hwan","family":"Hong","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering, University of Maryland, College Park, College Park, Maryland, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1680-085X","authenticated-orcid":false,"given":"Josiah","family":"Hester","sequence":"additional","affiliation":[{"name":"School of Interactive Computing, Georgia Institute of Technology, Atlanta, Georgia, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2398-2348","authenticated-orcid":false,"given":"Tingyu","family":"Cheng","sequence":"additional","affiliation":[{"name":"Computer Science and Engineering, University of Notre Dame, Notre Dame, Indiana, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2749-4835","authenticated-orcid":false,"given":"Huaishu","family":"Peng","sequence":"additional","affiliation":[{"name":"Computer Science, University of Maryland, College Park, College Park, Maryland, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2025,9,27]]},"reference":[{"key":"e_1_3_3_3_2_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491101.3519823"},{"key":"e_1_3_3_3_3_2","unstructured":"Cornelis\u00a0P. Bald\u00e9 Ruediger Kuehr Tales Yamamoto Rosie McDonald Elena D\u2019Angelo Shahana Althaf Garam Bel Otmar Deubzer Elena Fernandez-Cubillo Vanessa Forti Vanessa Gray Sunil Herat Shunichi Honda Giulia Iattoni Deepali\u00a0S. Khetriwal Vittoria Luda\u00a0di Cortemiglia Yuliya Lobuntsova Innocent Nnorom No\u00e9mie Pralat and Michelle Wagner. 2024. Global E-waste Monitor 2024."},{"key":"e_1_3_3_3_4_2","doi-asserted-by":"publisher","DOI":"10.1145\/3490149.3501308"},{"key":"e_1_3_3_3_5_2","doi-asserted-by":"publisher","DOI":"10.1145\/3569009.3572805"},{"key":"e_1_3_3_3_6_2","doi-asserted-by":"publisher","unstructured":"Kurki\u00a0N. Bharath Puttegowda Madhu Thyavihalli G.\u00a0Y. Gowda Akarsh Verma Mavinkere\u00a0R. Sanjay and Suchart Siengchin. 2020. A novel approach for development of printed circuit board from biofiber based composites. Polymer Composites 41 11 (2020) 4550\u20134558. 10.1002\/pc.25732","DOI":"10.1002\/pc.25732"},{"key":"e_1_3_3_3_7_2","doi-asserted-by":"publisher","unstructured":"Agni\u00a0K. Biswal Peter Hong Zhihan Zhang Yiwen Zheng Surabhit Gupta Dhriti Nepal Vikram Iyer and Aniruddh Vashisth. 2025. Flexible and Stretchable Vitrimers for Sustainable Electronics. ACS Applied Materials & Interfaces 17 6 (2025) 9736\u20139747. 10.1021\/acsami.4c16995","DOI":"10.1021\/acsami.4c16995"},{"key":"e_1_3_3_3_8_2","doi-asserted-by":"publisher","DOI":"10.1145\/1240624.1240705"},{"key":"e_1_3_3_3_9_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544549.3583927"},{"key":"e_1_3_3_3_10_2","doi-asserted-by":"crossref","unstructured":"Siqi Chen Hao Yang Kui Huang Xiaolong Ge Hanpeng Yao Junxiang Tang Junxue Ren Shixue Ren and Yanli Ma. 2021. Quantitative study on solubility parameters and related thermodynamic parameters of PVA with different alcoholysis degrees. Polymers 13 21 (2021) 3778.","DOI":"10.3390\/polym13213778"},{"key":"e_1_3_3_3_11_2","doi-asserted-by":"publisher","unstructured":"Tingyu Cheng Koya Narumi Youngwook Do Yang Zhang Tung\u00a0D. Ta Takuya Sasatani Eric Markvicka Yoshihiro Kawahara Lining Yao Gregory\u00a0D. Abowd and HyunJoo Oh. 2020. Silver Tape: Inkjet-Printed Circuits Peeled-and-Transferred on Versatile Substrates. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 4 1 Article 6 (mar 2020) 17\u00a0pages. 10.1145\/3381013","DOI":"10.1145\/3381013"},{"key":"e_1_3_3_3_12_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3580811"},{"key":"e_1_3_3_3_13_2","unstructured":"Tingyu Cheng Zhihan Zhang Han Huang Yingting Gao Wei Sun Gregory\u00a0D Abowd HyunJoo Oh and Josiah Hester. 2024. Recy-ctronics: Designing Fully Recyclable Electronics With Varied Form Factors. arXiv preprint arXiv:https:\/\/arXiv.org\/abs\/2406.09611 (2024)."},{"key":"e_1_3_3_3_14_2","doi-asserted-by":"crossref","unstructured":"Jirang Cui and Eric Forssberg. 2003. Mechanical recycling of waste electric and electronic equipment: a review. Journal of hazardous materials 99 3 (2003) 243\u2013263.","DOI":"10.1016\/S0304-3894(03)00061-X"},{"key":"e_1_3_3_3_15_2","doi-asserted-by":"publisher","unstructured":"Himani Deshpande Haruki Takahashi and Jeeeun Kim. 2024. Unmake to Remake: Materiality-Driven Rapid Prototyping. ACM Trans. Comput.-Hum. Interact. 31 6 Article 78 (Dec. 2024) 31\u00a0pages. 10.1145\/3685270","DOI":"10.1145\/3685270"},{"key":"e_1_3_3_3_16_2","doi-asserted-by":"crossref","unstructured":"Michael\u00a0D. Dickey. 2017. Stretchable and Soft Electronics Using Liquid Metals. Advanced Materials 29 27 (2017) 1606425.","DOI":"10.1002\/adma.201606425"},{"key":"e_1_3_3_3_17_2","doi-asserted-by":"crossref","unstructured":"Michael\u00a0D Dickey Ryan\u00a0C Chiechi Ryan\u00a0J Larsen Emily\u00a0A Weiss David\u00a0A Weitz and George\u00a0M Whitesides. 2008. Eutectic gallium-indium (EGaIn): a liquid metal alloy for the formation of stable structures in microchannels at room temperature. Advanced functional materials 18 7 (2008) 1097\u20131104.","DOI":"10.1002\/adfm.200701216"},{"key":"e_1_3_3_3_18_2","unstructured":"ecoinvent Association. [n.d.]. ecoinvent v3.10: Life Cycle Inventory (LCI) Database. https:\/\/ecoinvent.org\/ecoinvent-v3-10\/. Accessed: April 06 2025."},{"key":"e_1_3_3_3_19_2","unstructured":"electronicsworkshops. 2024. MX1508 motor driver module. https:\/\/hackaday.io\/project\/197831-mx1508-motor-driver-module. Accessed: July 09 2025."},{"key":"e_1_3_3_3_20_2","unstructured":"Elmer\u2019s. [n.d.]. Liquid School Glue. https:\/\/www.elmers.com\/glue\/liquid-school-glue\/. Accessed: April 06 2025."},{"key":"e_1_3_3_3_21_2","doi-asserted-by":"crossref","unstructured":"Andrew Fassler and Carmel Majidi. 2015. Liquid-phase metal inclusions for a conductive polymer composite. Adv. Mater 27 11 (2015) 1928\u20131932.","DOI":"10.1002\/adma.201405256"},{"key":"e_1_3_3_3_22_2","unstructured":"Filabot. 2024. Filabot Original EX2. https:\/\/www.filabot.com\/collections\/filabot-core\/products\/filabot-original-ex2. Accessed: April 06 2025."},{"key":"e_1_3_3_3_23_2","unstructured":"FreeCAD Community. [n.d.]. FreeCAD: Open-Source Parametric 3D CAD Modeler. https:\/\/www.freecad.org\/. Accessed: April 06 2025."},{"key":"e_1_3_3_3_24_2","unstructured":"GreenDelta GmbH. [n.d.]. openLCA: Free and Open Source Life Cycle Assessment Software. https:\/\/www.openlca.org\/. Accessed: April 06 2025."},{"key":"e_1_3_3_3_25_2","doi-asserted-by":"publisher","DOI":"10.1145\/3290605.3300267"},{"key":"e_1_3_3_3_26_2","doi-asserted-by":"crossref","unstructured":"Vijay\u00a0Kumar Guna Geethapriya Murugesan Bhuvaneswari\u00a0Hulikal Basavarajaiah Manikandan Ilangovan Sharon Olivera Venkatesh Krishna and Narendra Reddy. 2016. Plant-based completely biodegradable printed circuit boards. IEEE Transactions on Electron Devices 63 12 (2016) 4893\u20134898.","DOI":"10.1109\/TED.2016.2619983"},{"key":"e_1_3_3_3_27_2","doi-asserted-by":"publisher","DOI":"10.1145\/3569009.3572798"},{"key":"e_1_3_3_3_28_2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-56475-3"},{"key":"e_1_3_3_3_29_2","doi-asserted-by":"publisher","unstructured":"Liang He Jarrid\u00a0A. Wittkopf Ji\u00a0Won Jun Kris Erickson and Rafael\u00a0Tico Ballagas. 2022. ModElec: A Design Tool for Prototyping Physical Computing Devices Using Conductive 3D Printing. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 5 4 Article 159 (Dec. 2022) 20\u00a0pages. 10.1145\/3495000","DOI":"10.1145\/3495000"},{"key":"e_1_3_3_3_30_2","doi-asserted-by":"crossref","unstructured":"Keith\u00a0D. Hillaire Michael\u00a0David Dickey and Karen\u00a0E. Daniels. 2020. Marangoni Fingering Instabilities in Oxidizing Liquid Metals. arXiv:https:\/\/arXiv.org\/abs\/FluidDynamics (2020). https:\/\/api.semanticscholar.org\/CorpusID:227054206","DOI":"10.1103\/APS.DFD.2019.GFM.V0068"},{"key":"e_1_3_3_3_31_2","doi-asserted-by":"publisher","unstructured":"Xian Huang Yuhao Liu Suk-Won Hwang Seung-Kyun Kang Dwipayan Patnaik Jonathan\u00a0Fajardo Cortes and John\u00a0A. Rogers. 2014. Biodegradable Materials for Multilayer Transient Printed Circuit Boards. Advanced Materials 26 43 (2014) 7371\u20137377. 10.1002\/adma.201403164","DOI":"10.1002\/adma.201403164"},{"key":"e_1_3_3_3_32_2","doi-asserted-by":"publisher","unstructured":"Suk-Won Hwang Hu Tao Dae-Hyeong Kim Huanyu Cheng Jun-Kyul Song Elliott Rill Mark\u00a0A. Brenckle Bruce Panilaitis Sang\u00a0Min Won Yun-Soung Kim Young\u00a0Min Song Ki\u00a0Jun Yu Abid Ameen Rui Li Yewang Su Miaomiao Yang David\u00a0L. Kaplan Mitchell\u00a0R. Zakin Marvin\u00a0J. Slepian Yonggang Huang Fiorenzo\u00a0G. Omenetto and John\u00a0A. Rogers. 2012. A Physically Transient Form of Silicon Electronics. Science 337 6102 (2012) 1640\u20131644. 10.1126\/science.1226325","DOI":"10.1126\/science.1226325"},{"key":"e_1_3_3_3_33_2","unstructured":"Deloitte Insights. 2025. 2025 Global Semiconductor Industry Outlook. https:\/\/www2.deloitte.com\/us\/en\/insights\/industry\/technology\/technology-media-telecom-outlooks\/semiconductor-industry-outlook.html. Accessed: April 06 2025."},{"key":"e_1_3_3_3_34_2","unstructured":"Institute of Environmental Sciences (CML) Leiden University. 2016. CML\u2011IA Characterisation Factors for Life Cycle Impact Assessment. https:\/\/www.universiteitleiden.nl\/en\/research\/research-output\/science\/cml-ia-characterisation-factors. Accessed: April 06 2025."},{"key":"e_1_3_3_3_35_2","unstructured":"International Electrotechnical Commission. 2013. IEC 60529: Degrees of Protection Provided by Enclosures (IP Code). https:\/\/www.iec.ch\/ip-ratings"},{"key":"e_1_3_3_3_36_2","doi-asserted-by":"publisher","DOI":"10.1145\/3474349.3480191"},{"key":"e_1_3_3_3_37_2","unstructured":"Jiva Materials. [n.d.]. Jiva Materials. https:\/\/www.jivamaterials.com\/. Accessed: April 06 2025."},{"key":"e_1_3_3_3_38_2","doi-asserted-by":"publisher","DOI":"10.1145\/2493432.2493486"},{"key":"e_1_3_3_3_39_2","unstructured":"KiCad Project. [n.d.]. KiCad EDA: A Cross-Platform Open-Source Electronics Design Automation Suite. https:\/\/kicad.org\/. Accessed: April 06 2025."},{"key":"e_1_3_3_3_40_2","doi-asserted-by":"crossref","unstructured":"Peeranart Kiddee Ravi Naidu and Ming\u00a0H. Wong. 2013. Electronic waste management approaches: An overview. Waste Management 33 5 (2013) 1237\u20131250.","DOI":"10.1016\/j.wasman.2013.01.006"},{"key":"e_1_3_3_3_41_2","doi-asserted-by":"publisher","DOI":"10.1145\/1978942.1979292"},{"key":"e_1_3_3_3_42_2","doi-asserted-by":"publisher","DOI":"10.1145\/3526113.3545623"},{"key":"e_1_3_3_3_43_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642387"},{"key":"e_1_3_3_3_44_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586183.3606745"},{"key":"e_1_3_3_3_45_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3714095"},{"key":"e_1_3_3_3_46_2","doi-asserted-by":"publisher","unstructured":"Ange\u00a0A. Maurice Khang\u00a0Ngoc Dinh Nicolas\u00a0M. Charpentier Andrea Brambilla and Jean-Christophe\u00a0P. Gabriel. 2021. Dismantling of Printed Circuit Boards Enabling Electronic Components Sorting and Their Subsequent Treatment Open Improved Elemental Sustainability Opportunities. Sustainability 13 18 (2021). 10.3390\/su131810357","DOI":"10.3390\/su131810357"},{"key":"e_1_3_3_3_47_2","doi-asserted-by":"publisher","unstructured":"Farhang Momeni Seyed M.Mehdi Hassani.N Xun Liu and Jun Ni. 2017. A review of 4D printing. Materials & Design 122 (2017) 42\u201379. 10.1016\/j.matdes.2017.02.068","DOI":"10.1016\/j.matdes.2017.02.068"},{"key":"e_1_3_3_3_48_2","doi-asserted-by":"publisher","DOI":"10.1145\/2677199.2683582"},{"key":"e_1_3_3_3_49_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3173762"},{"key":"e_1_3_3_3_50_2","doi-asserted-by":"crossref","unstructured":"Y-L Park Sechang Ryu Barnab\u00e1s P\u00f3czos Kyeong-Sik Shin Bongsoo Lee Ung\u00a0B. Chu John\u00a0A. Rogers Sooyoung Shin Seon\u00a0Jeong Kim et\u00a0al. 2010. Hyperelastic Pressure Sensing with a Liquid-Embedded Elastomer. Journal of Micromechanics and Microengineering 20 12 (2010) 125029.","DOI":"10.1088\/0960-1317\/20\/12\/125029"},{"key":"e_1_3_3_3_51_2","doi-asserted-by":"publisher","DOI":"10.1145\/3746059.3747628"},{"key":"e_1_3_3_3_52_2","doi-asserted-by":"publisher","DOI":"10.1145\/3563657.3595983"},{"key":"e_1_3_3_3_53_2","doi-asserted-by":"publisher","DOI":"10.1145\/2642918.2647374"},{"key":"e_1_3_3_3_54_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613905.3636300"},{"key":"e_1_3_3_3_55_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491102.3502007"},{"key":"e_1_3_3_3_56_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445529"},{"key":"e_1_3_3_3_57_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3581110"},{"key":"e_1_3_3_3_58_2","doi-asserted-by":"crossref","unstructured":"Long Teng Li Li Jingxia Huang Shuai Li Renchao Hu Xuechang Zhou and Hong Wang. 2023. Fully Recyclable Liquid-Metal-Based Multi-Layer Thermally Triggered Transient Electronic Devices. Advanced Materials Technologies 8 4 (2023) 2201031.","DOI":"10.1002\/admt.202201031"},{"key":"e_1_3_3_3_59_2","doi-asserted-by":"crossref","unstructured":"Long Teng Shichao Ye Stephan Handschuh-Wang Xiaohu Zhou Tiansheng Gan and Xuechang Zhou. 2019. Liquid metal-based transient circuits for flexible and recyclable electronics. Advanced Functional Materials 29 11 (2019) 1808739.","DOI":"10.1002\/adfm.201808739"},{"key":"e_1_3_3_3_60_2","doi-asserted-by":"publisher","DOI":"10.1145\/3430524.3440654"},{"key":"e_1_3_3_3_61_2","doi-asserted-by":"publisher","DOI":"10.1145\/3341162.3343808"},{"key":"e_1_3_3_3_62_2","doi-asserted-by":"publisher","DOI":"10.1145\/3341163.3346938"},{"key":"e_1_3_3_3_63_2","doi-asserted-by":"publisher","DOI":"10.1145\/3411764.3445187"},{"key":"e_1_3_3_3_64_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586183.3606718"},{"key":"e_1_3_3_3_65_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3174143"},{"key":"e_1_3_3_3_66_2","doi-asserted-by":"publisher","DOI":"10.1145\/3242587.3242625"},{"key":"e_1_3_3_3_67_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3714080"},{"key":"e_1_3_3_3_68_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376227"},{"key":"e_1_3_3_3_69_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586182.3617433"},{"key":"e_1_3_3_3_70_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3713665"},{"key":"e_1_3_3_3_71_2","doi-asserted-by":"publisher","DOI":"10.1145\/3586183.3606804"},{"key":"e_1_3_3_3_72_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642765"},{"key":"e_1_3_3_3_73_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3714276"},{"key":"e_1_3_3_3_74_2","doi-asserted-by":"crossref","unstructured":"Azamat Yedrissov Dmitriy Khrustalev Alexander Alekseev Anastassiya Khrustaleva and Anastassiya Vetrova. 2022. New composite material for biodegradable electronics. Materials Today: Proceedings 49 (2022) 2443\u20132448.","DOI":"10.1016\/j.matpr.2020.11.053"},{"key":"e_1_3_3_3_75_2","unstructured":"Firstname Zhang and Others. 2023. vPCB: Recyclable Vitrimer-Based Circuit Boards. ACM Transactions on Graphics XX X (2023) 1\u201310."},{"key":"e_1_3_3_3_76_2","doi-asserted-by":"publisher","unstructured":"Zhihan Zhang Agni\u00a0K Biswal Ankush Nandi Kali Frost Jake\u00a0A Smith Bichlien\u00a0H Nguyen Shwetak Patel Aniruddh Vashisth and Vikram Iyer. 2024. Recyclable vitrimer-based printed circuit boards for sustainable electronics. Nature Sustainability 7 5 (May 2024) 616\u2013627. 10.1038\/s41893-024-01333-7","DOI":"10.1038\/s41893-024-01333-7"},{"key":"e_1_3_3_3_77_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642718"}],"event":{"name":"UIST '25: The 38th Annual ACM Symposium on User Interface Software and Technology","location":"Busan Republic of Korea","acronym":"UIST '25","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction","SIGGRAPH ACM Special Interest Group on Computer Graphics and Interactive Techniques"]},"container-title":["Proceedings of the 38th Annual ACM Symposium on User Interface Software and Technology"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3746059.3747604","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3746059.3747604","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,27]],"date-time":"2025-09-27T22:08:13Z","timestamp":1759010893000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3746059.3747604"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9,27]]},"references-count":76,"alternative-id":["10.1145\/3746059.3747604","10.1145\/3746059"],"URL":"https:\/\/doi.org\/10.1145\/3746059.3747604","relation":{},"subject":[],"published":{"date-parts":[[2025,9,27]]},"assertion":[{"value":"2025-09-27","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}