{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,19]],"date-time":"2026-04-19T05:37:32Z","timestamp":1776577052712,"version":"3.51.2"},"publisher-location":"New York, NY, USA","reference-count":81,"publisher":"ACM","content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2026,3,15]]},"DOI":"10.1145\/3764386.3779613","type":"proceedings-article","created":{"date-parts":[[2026,3,27]],"date-time":"2026-03-27T18:57:27Z","timestamp":1774637847000},"page":"226-235","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Invited: From Evolutionary Algorithms to Analog Design, Electromigration, 3D Integration, and Beyond: On Jens Lienig's Contributions to Advance Physical Design"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5093-2939","authenticated-orcid":false,"given":"Johann","family":"Knechtel","sequence":"first","affiliation":[{"name":"New York University Abu Dhabi, Abu Dhabi, United Arab Emirates"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7238-1506","authenticated-orcid":false,"given":"Susann","family":"Rothe","sequence":"additional","affiliation":[{"name":"Dresden University of Technology, Dresden, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6233-3204","authenticated-orcid":false,"given":"Robert","family":"Fischbach","sequence":"additional","affiliation":[{"name":"Dresden University of Technology, Dresden, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-7286-5283","authenticated-orcid":false,"given":"Matthias","family":"Thiele","sequence":"additional","affiliation":[{"name":"Dresden University of Technology, Dresden, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6429-0105","authenticated-orcid":false,"given":"Tilo","family":"Meister","sequence":"additional","affiliation":[{"name":"Dresden University of Technology, Dresden, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7081-4104","authenticated-orcid":false,"given":"Andreas","family":"Krinke","sequence":"additional","affiliation":[{"name":"Dresden University of Technology, Dresden, Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"320","published-online":{"date-parts":[[2026,3,27]]},"reference":[{"key":"e_1_3_2_1_1_1","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3326334"},{"key":"e_1_3_2_1_2_1","doi-asserted-by":"publisher","DOI":"10.1109\/JFLEX.2025.3594658"},{"key":"e_1_3_2_1_3_1","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872355"},{"key":"e_1_3_2_1_4_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2020.04.009"},{"key":"e_1_3_2_1_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC48104.2019.9058886"},{"key":"e_1_3_2_1_6_1","volume-title":"Proc. ACM Int. Symp. Phys. Des. (ISPD)","author":"Fischbach R.","year":"1916","unstructured":"R. Fischbach, J. Knechtel, and J. Lienig. 2013. Utilizing 2D and 3D rectilinear blocks for efficient IP reuse and floorplanning of 3D-integrated systems. In Proc. ACM Int. Symp. Phys. Des. (ISPD) (Stateline, Nevada, USA). 11-16. doi:10.1145\/ 2451916.2451921"},{"key":"e_1_3_2_1_7_1","doi-asserted-by":"publisher","DOI":"10.1145\/1572471.1572485"},{"key":"e_1_3_2_1_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751476"},{"key":"e_1_3_2_1_9_1","volume-title":"Proc. 18th ITI Symp. 435-443","author":"Fraulob S.","unstructured":"S. Fraulob, M. Thiele, S. Marth, and J. Gundermann. 2015. Wear and Aging Simulation of Electrical-Mechanical Systems. In Proc. 18th ITI Symp. 435-443."},{"key":"e_1_3_2_1_10_1","unstructured":"GlobalFoundries PDK Authors. 2022. GF180 PDK. https:\/\/github.com\/google\/ gf180mcu-pdk"},{"key":"e_1_3_2_1_11_1","doi-asserted-by":"publisher","DOI":"10.3384\/ecp17132541"},{"key":"e_1_3_2_1_12_1","volume-title":"Proc. Asia Commun. Photonics Conf. (ACP).","author":"He M.","unstructured":"M. He, M. Thiele, A. Shetewy, J. Lienig, and K. Jamshidi. 2025. Performance Analysis of Silicon Microring Resonators using Newtonian Cooling and Non- Fourier Heat Conduction Models. In Proc. Asia Commun. Photonics Conf. (ACP)."},{"key":"e_1_3_2_1_13_1","doi-asserted-by":"publisher","DOI":"10.1515\/bmt-2017-0120"},{"key":"e_1_3_2_1_14_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-28522-6_29"},{"key":"e_1_3_2_1_15_1","unstructured":"IHP PDK authors. 2023. IHP Open Source PDK. https:\/\/github.com\/IHP-GmbH\/ IHP-Open-PDK\/"},{"key":"e_1_3_2_1_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2002.998314"},{"key":"e_1_3_2_1_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2003.819899"},{"key":"e_1_3_2_1_18_1","doi-asserted-by":"publisher","DOI":"10.1145\/1514932.1514952"},{"key":"e_1_3_2_1_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2010.5450505"},{"key":"e_1_3_2_1_20_1","doi-asserted-by":"publisher","DOI":"10.1145\/996566.996618"},{"key":"e_1_3_2_1_21_1","doi-asserted-by":"publisher","unstructured":"A. B. Kahng J. Lienig I. L. Markov and J. Hu. 2022. VLSI Physical Design: From Graph Partitioning to Timing Closure (2nd ed.). Springer. doi:10.1007\/978-3-030- 96415-3","DOI":"10.1007\/978-3-030-"},{"key":"e_1_3_2_1_22_1","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872335"},{"key":"e_1_3_2_1_23_1","doi-asserted-by":"publisher","DOI":"10.1145\/3149817"},{"key":"e_1_3_2_1_24_1","doi-asserted-by":"publisher","DOI":"10.1145\/1960397.1960417"},{"key":"e_1_3_2_1_25_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2174640"},{"key":"e_1_3_2_1_26_1","doi-asserted-by":"publisher","DOI":"10.1145\/2429384.2429538"},{"key":"e_1_3_2_1_27_1","doi-asserted-by":"publisher","DOI":"10.2197\/ipsjtsldm.10.45"},{"key":"e_1_3_2_1_28_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742866"},{"key":"e_1_3_2_1_29_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2432141"},{"key":"e_1_3_2_1_30_1","unstructured":"M. K\u00f6fferlein and contributors. 2023. KLayout. https:\/\/www.klayout.de\/"},{"key":"e_1_3_2_1_31_1","volume-title":"Grundlagen der Konstruktion","author":"Krause W.","unstructured":"W. Krause. 2018. Grundlagen der Konstruktion (10th ed.). Carl Hanser Verlag, M\u00fcnchen.","edition":"10"},{"key":"e_1_3_2_1_32_1","volume-title":"Konstruktionselemente der Feinmechanik","author":"Krause W.","unstructured":"W. Krause. 2018. Konstruktionselemente der Feinmechanik (4th ed.). Carl Hanser Verlag, M\u00fcnchen.","edition":"4"},{"key":"e_1_3_2_1_33_1","doi-asserted-by":"publisher","DOI":"10.1145\/3626184.3635289"},{"key":"e_1_3_2_1_34_1","doi-asserted-by":"publisher","DOI":"10.1109\/DDECS.2019.8724669"},{"key":"e_1_3_2_1_35_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2013.6815410"},{"key":"e_1_3_2_1_36_1","unstructured":"A. Krinke G. Jerke and J. Lienig. 2015. Constraint Propagation Methods for Robust IC Design. In ZuE 2015; 8. GMM\/ITG\/GI-Symposium Reliability by Design. 1-8."},{"key":"e_1_3_2_1_37_1","doi-asserted-by":"publisher","DOI":"10.1109\/ECCTD"},{"key":"e_1_3_2_1_38_1","doi-asserted-by":"publisher","DOI":"10.1109\/ECCTD.2013.6662319"},{"key":"e_1_3_2_1_39_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021"},{"key":"e_1_3_2_1_40_1","volume-title":"Ein Verdrahtungssystem f\u00fcr den rechnergest\u00fctzten Layoutentwurf von Multichiptr\u00e4gern. Number 119 in Fortschritt-Berichte VDI","author":"Lienig J.","unstructured":"J. Lienig. 1991. Ein Verdrahtungssystem f\u00fcr den rechnergest\u00fctzten Layoutentwurf von Multichiptr\u00e4gern. Number 119 in Fortschritt-Berichte VDI. VDI-Verlag, D\u00fcsseldorf."},{"key":"e_1_3_2_1_41_1","volume-title":"Anwendung evolution\u00e4rer Algorithmen f\u00fcr den rechnergest\u00fctzten Entwurf des Schaltungslayouts. Number 228 in Fortschritt-Berichte VDI","author":"Lienig J.","unstructured":"J. Lienig. 1996. Anwendung evolution\u00e4rer Algorithmen f\u00fcr den rechnergest\u00fctzten Entwurf des Schaltungslayouts. Number 228 in Fortschritt-Berichte VDI. VDIVerlag, D\u00fcsseldorf."},{"key":"e_1_3_2_1_42_1","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.1996.542012"},{"key":"e_1_3_2_1_43_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICVD.1997.567993"},{"key":"e_1_3_2_1_44_1","doi-asserted-by":"publisher","DOI":"10.1109\/4235.585891"},{"key":"e_1_3_2_1_45_1","doi-asserted-by":"publisher","DOI":"10.1145\/1123008.1123017"},{"key":"e_1_3_2_1_46_1","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451925"},{"key":"e_1_3_2_1_47_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-662-49815-6"},{"key":"e_1_3_2_1_48_1","doi-asserted-by":"publisher","unstructured":"J. Lienig and H. Brandt. 1994. An Evolutionary Algorithm for the Routing of Multi-Chip Modules. In Parallel Problem Solving from Nature (LNCS Vol. 866). 588-597. doi:10.1007\/3-540-58484-6_300","DOI":"10.1007\/3-540-58484-6_300"},{"key":"e_1_3_2_1_49_1","doi-asserted-by":"publisher","unstructured":"J. Lienig and H. Br\u00fcmmer. 2017. Fundamentals of Electronic Systems Design. Springer. doi:10.1007\/978-3-319-55840-0","DOI":"10.1007\/978-3-319-55840-0"},{"key":"e_1_3_2_1_50_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-662-68708-6"},{"key":"e_1_3_2_1_51_1","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-61723-X_1054"},{"key":"e_1_3_2_1_52_1","doi-asserted-by":"publisher","unstructured":"J. Lienig and M. Dietrich (Eds.). 2012. Entwurf integrierter 3D-Systeme der Elektronik. Springer Vieweg Berlin Heidelberg. doi:10.1007\/978-3-642-30572-6","DOI":"10.1007\/978-3-642-30572-6"},{"key":"e_1_3_2_1_53_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2003.1195125"},{"key":"e_1_3_2_1_54_1","doi-asserted-by":"publisher","unstructured":"J. Lienig S. Rothe and M. Thiele. 2025. Fundamentals of Electromigration-Aware Integrated Circuit Design (2nd ed.). Springer Cham Switzerland. doi:10.1007\/978- 3-031-80023-8","DOI":"10.1007\/978-"},{"key":"e_1_3_2_1_55_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643447"},{"key":"e_1_3_2_1_56_1","doi-asserted-by":"publisher","unstructured":"J. Lienig and J. Scheible. 2020. Fundamentals of Layout Design for Electronic Circuits. Springer. doi:10.1007\/978-3-030-39284-0","DOI":"10.1007\/978-3-030-39284-0"},{"key":"e_1_3_2_1_57_1","doi-asserted-by":"publisher","unstructured":"J. Lienig and J. Scheible. 2023. Grundlagen des Layoutentwurfs elektronischer Schaltungen. Springer Vieweg Cham. doi:10.1007\/978-3-031-15768-4","DOI":"10.1007\/978-3-031-15768-4"},{"key":"e_1_3_2_1_58_1","doi-asserted-by":"publisher","DOI":"10.1145\/3177540.3177560"},{"key":"e_1_3_2_1_59_1","first-page":"199","article-title":"GASBOR: A Genetic Algorithm for Switchbox Routing in Integrated Circuits. In Proc. AI'94","author":"Lienig J.","year":"1994","unstructured":"J. Lienig and K. Thulasiraman. 1994. GASBOR: A Genetic Algorithm for Switchbox Routing in Integrated Circuits. In Proc. AI'94 Worksh. Evol. Comput. Armidale, 199-212.","journal-title":"Worksh. Evol. Comput. Armidale"},{"key":"e_1_3_2_1_60_1","doi-asserted-by":"publisher","DOI":"10.1142\/S021812669600025X"},{"key":"e_1_3_2_1_61_1","unstructured":"Magic authors. 2020. Magic. http:\/\/opencircuitdesign.com\/magic\/"},{"issue":"3","key":"e_1_3_2_1_62_1","first-page":"1","article-title":"Island (Migration) Models: Evolutionary Algorithms Based on Punctuated Equilibria. In Handbook of Evolutionary Computation. Oxford University Press, New York","volume":"6","author":"Martin W. N.","year":"1997","unstructured":"W. N. Martin, J. Lienig, and J. P. Cohoon. 1997. Island (Migration) Models: Evolutionary Algorithms Based on Punctuated Equilibria. In Handbook of Evolutionary Computation. Oxford University Press, New York, NY, C6.3:1-C6.3:16.","journal-title":"NY"},{"key":"e_1_3_2_1_63_1","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2008.4484778"},{"key":"e_1_3_2_1_64_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-12267-5_2"},{"key":"e_1_3_2_1_65_1","doi-asserted-by":"publisher","DOI":"10.1109\/SLIP.2011.6135430"},{"key":"e_1_3_2_1_66_1","volume-title":"Proc. IEEE Transp. Electrif. Conf. Expo Asia-Pac. (ITEC Asia-Pacific)","author":"N\u00e4ke P.","unstructured":"P. N\u00e4ke, F. Stein, A. Krinke, and J. Lienig. 2025. Efficient Architecture Evaluation and Generation of Automotive Wiring Harnesses. In Proc. IEEE Transp. Electrif. Conf. Expo Asia-Pac. (ITEC Asia-Pacific) (Singapore)."},{"key":"e_1_3_2_1_67_1","doi-asserted-by":"publisher","DOI":"10.1145\/1353629.1353663"},{"key":"e_1_3_2_1_68_1","unstructured":"OpenRoad Team. 2023. OpenROAD Website. https:\/\/theopenroadproject.org\/"},{"key":"e_1_3_2_1_69_1","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2018.8297375"},{"key":"e_1_3_2_1_70_1","unstructured":"Patents IFTE [n.d.]. Patents IFTE. https:\/\/www.ifte.de\/infos\/publikationen\/ patente\/index.html"},{"key":"e_1_3_2_1_71_1","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC48849.2020.9229731"},{"key":"e_1_3_2_1_72_1","doi-asserted-by":"publisher","DOI":"10.1145\/3569052.3571880"},{"key":"e_1_3_2_1_73_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2025.155909"},{"key":"e_1_3_2_1_74_1","doi-asserted-by":"publisher","DOI":"10.1145\/2717764.2717781"},{"key":"e_1_3_2_1_75_1","doi-asserted-by":"publisher","DOI":"10.1109\/ESARS.2012.6387387"},{"key":"e_1_3_2_1_76_1","unstructured":"SkyWater PDK Authors. 2020. SKY130 PDK. https:\/\/skywater-pdk.readthedocs. io\/"},{"key":"e_1_3_2_1_77_1","doi-asserted-by":"publisher","DOI":"10.3384\/ecp218765"},{"key":"e_1_3_2_1_78_1","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD65553.2025.11092117"},{"key":"e_1_3_2_1_79_1","first-page":"126","article-title":"Embedded Simulation via FMI for Wear and Tear Processes","author":"Walther S.","year":"2016","unstructured":"S. Walther, K. Todtermuschke, U. Schnabel, and M. Thiele. 2016. Embedded Simulation via FMI for Wear and Tear Processes. In Proc. ESI SimulationX User Forum. 126-132.","journal-title":"Proc. ESI SimulationX User Forum."},{"key":"e_1_3_2_1_80_1","doi-asserted-by":"publisher","unstructured":"K. Wichler and F. Reifegerste. 2025. Enhancing Spectral Resolution by Fusing Data from Multiple Commercial Sensors. J. Sci. Tech. Lighting advpub (2025) IEIJ240000668. doi:10.2150\/jstl.IEIJ240000668","DOI":"10.2150\/jstl.IEIJ240000668"},{"key":"e_1_3_2_1_81_1","volume-title":"Proc. IEEE Int. Conf. Phys. Assur. Insp. Electr. (PAINE).","author":"Yahyaei K.","unstructured":"K. Yahyaei, S. Rothe, M. V. D. Naina, A. Roy, M. S. M. Khan, O. Sinanoglu, J. Lienig, J. Knechtel, and N. Asadizanjani. 2025. Lurking in the Shadows: Challenges for X-Ray Inspection to Uncover Electromigration-Based Hardware Trojans in Advanced Packaging. In Proc. IEEE Int. Conf. Phys. Assur. Insp. Electr. (PAINE)."}],"event":{"name":"ISPD '26: International Symposium on Physical Design","location":"Bonn Germany","sponsor":["SIGDA ACM Special Interest Group on Design Automation"]},"container-title":["Proceedings of the 2026 International Symposium on Physical Design"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3764386.3779613","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,19]],"date-time":"2026-04-19T04:40:13Z","timestamp":1776573613000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3764386.3779613"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,3,15]]},"references-count":81,"alternative-id":["10.1145\/3764386.3779613","10.1145\/3764386"],"URL":"https:\/\/doi.org\/10.1145\/3764386.3779613","relation":{},"subject":[],"published":{"date-parts":[[2026,3,15]]},"assertion":[{"value":"2026-03-27","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}