{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,23]],"date-time":"2026-04-23T07:56:35Z","timestamp":1776930995509,"version":"3.51.2"},"publisher-location":"New York, NY, USA","reference-count":60,"publisher":"ACM","content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2026,4,13]]},"DOI":"10.1145\/3772318.3792784","type":"proceedings-article","created":{"date-parts":[[2026,4,13]],"date-time":"2026-04-13T04:12:28Z","timestamp":1776053548000},"page":"1-17","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["LiqMetCraft: A Toolkit for Creating Papercraft with Embedded Electronics By Directly Cutting and Folding Liquid-Metal-Dyed Paper-like Fabric"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0009-0004-6196-2999","authenticated-orcid":false,"given":"Qi","family":"Zhang","sequence":"first","affiliation":[{"name":"School of Creative Media, City University of Hong Kong, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-0749-3675","authenticated-orcid":false,"given":"Shuwen","family":"Jiang","sequence":"additional","affiliation":[{"name":"School of Creative Media, City University of Hong Kong, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0939-4177","authenticated-orcid":false,"given":"Zeshui","family":"Li","sequence":"additional","affiliation":[{"name":"MEI Lab, School of Creative Media, Hong Kong, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-2049-5876","authenticated-orcid":false,"given":"Yong","family":"Lyu","sequence":"additional","affiliation":[{"name":"Hong Kong Productivity Council, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-6326-4471","authenticated-orcid":false,"given":"Tiande","family":"Mo","sequence":"additional","affiliation":[{"name":"Hong Kong Productivity Council, Hong Kong, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6740-4921","authenticated-orcid":false,"given":"Kening","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Creative Media, City University of Hong Kong, HongKong, China"}]}],"member":"320","published-online":{"date-parts":[[2026,4,13]]},"reference":[{"key":"e_1_3_3_3_2_2","doi-asserted-by":"publisher","DOI":"10.1145\/365024.365031"},{"key":"e_1_3_3_3_3_2","doi-asserted-by":"publisher","unstructured":"Niels\u00a0Christian Buch Carlos Tejada Daniel Ashbrook and Valkyrie Savage. 2024. LaCir: A multilayered laser-cuttable material to co-fabricate circuitry and structural components. Proceedings of the CHI Conference on Human Factors in Computing Systems 1\u201310. 10.1145\/3613904.3642888","DOI":"10.1145\/3613904.3642888"},{"key":"e_1_3_3_3_4_2","doi-asserted-by":"crossref","unstructured":"Leah Buechley and Michael Eisenberg. 2009. Fabric PCBs electronic sequins and socket buttons: techniques for e-textile craft. Personal and ubiquitous computing 13 2 (2009) 133\u2013150.","DOI":"10.1007\/s00779-007-0181-0"},{"key":"e_1_3_3_3_5_2","doi-asserted-by":"publisher","DOI":"10.1145\/1357054.1357123"},{"key":"e_1_3_3_3_6_2","doi-asserted-by":"publisher","DOI":"10.1145\/1858171.1858206"},{"key":"e_1_3_3_3_7_2","first-page":"243","volume-title":"UIST","author":"Chadalavada Perumal\u00a0Varun","year":"2015","unstructured":"Perumal\u00a0Varun Chadalavada and Daniel Wigdor. 2015. Printem: Instant Printed Circuit Boards with Standard Office Printers & Inks.. In UIST. 243\u2013251."},{"key":"e_1_3_3_3_8_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376655"},{"key":"e_1_3_3_3_9_2","doi-asserted-by":"publisher","DOI":"10.1145\/3374920.3374946"},{"key":"e_1_3_3_3_10_2","doi-asserted-by":"crossref","unstructured":"Tingyu Cheng Koya Narumi Youngwook Do Yang Zhang Tung\u00a0D. Ta Takuya Sasatani Eric Markvicka Yoshihiro Kawahara Lining Yao Gregory\u00a0D. Abowd and HyunJoo Oh. 2020. Silver Tape: Inkjet-Printed Circuits Peeled-and-Transferred on Versatile Substrates. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. Article 6 (March 2020) 17\u00a0pages.","DOI":"10.1145\/3381013"},{"key":"e_1_3_3_3_11_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3581125"},{"key":"e_1_3_3_3_12_2","doi-asserted-by":"crossref","unstructured":"Victoria Clarke and Virginia Braun. 2017. Thematic analysis. The journal of positive psychology 12 3 (2017) 297\u2013298.","DOI":"10.1080\/17439760.2016.1262613"},{"key":"e_1_3_3_3_13_2","doi-asserted-by":"publisher","DOI":"10.1145\/1520340.1520525"},{"key":"e_1_3_3_3_14_2","doi-asserted-by":"publisher","DOI":"10.1145\/2901790.2901891"},{"key":"e_1_3_3_3_15_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3713599"},{"key":"e_1_3_3_3_16_2","doi-asserted-by":"publisher","unstructured":"Shuyue Feng Tung\u00a0D. Ta Shichao Huang Xiaolong Li Kazuki Koyama Guanyun Wang Cheng Yao Yoshihiro Kawahara and Koya Narumi. 2024. Rapid Fabrication of Haptic and Electric Input Interfaces using 4D Printed Origami. Extended Abstracts of the CHI Conference on Human Factors in Computing Systems 1\u20137. 10.1145\/3613905.3651022","DOI":"10.1145\/3613905.3651022"},{"key":"e_1_3_3_3_17_2","doi-asserted-by":"publisher","DOI":"10.1145\/3544548.3581002"},{"key":"e_1_3_3_3_18_2","doi-asserted-by":"publisher","DOI":"10.1145\/2556288.2557173"},{"key":"e_1_3_3_3_19_2","doi-asserted-by":"publisher","DOI":"10.1145\/3290605.3300929"},{"key":"e_1_3_3_3_20_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491102.3501844"},{"key":"e_1_3_3_3_21_2","doi-asserted-by":"publisher","DOI":"10.1145\/2908805.2913018"},{"key":"e_1_3_3_3_22_2","doi-asserted-by":"crossref","unstructured":"PS Karthik Surya\u00a0Prakash Singh et\u00a0al. 2015. Conductive silver inks and their applications in printed and flexible electronics. Rsc Advances 5 95 (2015) 77760\u201377790.","DOI":"10.1039\/C5RA12013F"},{"key":"e_1_3_3_3_23_2","doi-asserted-by":"publisher","DOI":"10.1145\/3490149.3502253"},{"key":"e_1_3_3_3_24_2","doi-asserted-by":"publisher","DOI":"10.1145\/3332165.3347892"},{"key":"e_1_3_3_3_25_2","doi-asserted-by":"publisher","DOI":"10.1145\/3472749.3474802"},{"key":"e_1_3_3_3_26_2","doi-asserted-by":"publisher","DOI":"10.1145\/3024969.3025071"},{"key":"e_1_3_3_3_27_2","unstructured":"Robert\u00a0J Lang. 1989. Origami: complexity increasing. Engineering & Science 52 2 (1989) 16\u201323."},{"key":"e_1_3_3_3_28_2","doi-asserted-by":"crossref","unstructured":"Simok Lee Syed\u00a0Ahmed Jaseem Nurit Atar Meixiang Wang Jeong\u00a0Yong Kim Mohammadreza Zare Sooyoung Kim Michael\u00a0D Bartlett Jae-Woong Jeong and Michael\u00a0D Dickey. 2025. Connecting the dots: Sintering of liquid metal particles for soft and stretchable conductors. Chemical Reviews 125 6 (2025) 3551\u20133585.","DOI":"10.1021\/acs.chemrev.4c00850"},{"key":"e_1_3_3_3_29_2","doi-asserted-by":"publisher","DOI":"10.1145\/3654777.3676398"},{"key":"e_1_3_3_3_30_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642205"},{"key":"e_1_3_3_3_31_2","doi-asserted-by":"crossref","unstructured":"Lijuan Liu Jiahao Guo Chao Zhang Zhangzhi Wang Pinqi Zhu Tuo Fang Junwu Wang Cheng Yao and Fangtian Ying. 2021. Electropaper: Design and fabrication of paper-based electronic interfaces for the water environment. Electronics 10 5 (2021) 604.","DOI":"10.3390\/electronics10050604"},{"key":"e_1_3_3_3_32_2","doi-asserted-by":"publisher","DOI":"10.1145\/2642918.2647421"},{"key":"e_1_3_3_3_33_2","doi-asserted-by":"publisher","unstructured":"David\u00a0A. Mellis Sam Jacoby Leah Buechley Hannah Perner-Wilson and Jie Qi. 2013. Microcontrollers as material: crafting circuits with paper conductive ink electronic components and an \"untoolkit\". Proceedings of the 7th International Conference on Tangible Embedded and Embodied Interaction. 10.1145\/2460625.2460638","DOI":"10.1145\/2460625.2460638"},{"key":"e_1_3_3_3_34_2","doi-asserted-by":"publisher","DOI":"10.1145\/2702613.2732876"},{"key":"e_1_3_3_3_35_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3174015"},{"key":"e_1_3_3_3_36_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807494"},{"key":"e_1_3_3_3_37_2","doi-asserted-by":"publisher","DOI":"10.1145\/2642918.2647413"},{"key":"e_1_3_3_3_38_2","doi-asserted-by":"publisher","DOI":"10.1145\/3491102.3502074"},{"key":"e_1_3_3_3_39_2","doi-asserted-by":"publisher","DOI":"10.1145\/1709886.1709909"},{"key":"e_1_3_3_3_40_2","doi-asserted-by":"publisher","DOI":"10.1145\/2207676.2207783"},{"key":"e_1_3_3_3_41_2","doi-asserted-by":"publisher","DOI":"10.1145\/2556288.2557391"},{"key":"e_1_3_3_3_42_2","doi-asserted-by":"crossref","unstructured":"Gabriel Saada Michael Layani Avi Chernevousky and Shlomo Magdassi. 2017. Hydroprinting conductive patterns onto 3D structures. Advanced Materials Technologies 2 5 (2017) 1600289.","DOI":"10.1002\/admt.201770020"},{"key":"e_1_3_3_3_43_2","doi-asserted-by":"publisher","DOI":"10.1145\/2501988.2501992"},{"key":"e_1_3_3_3_44_2","doi-asserted-by":"publisher","DOI":"10.1145\/2807442.2807503"},{"key":"e_1_3_3_3_45_2","doi-asserted-by":"publisher","unstructured":"Martin Schmitz Jan Riemann Florian M\u00fcller Steffen Kreis and Max M\u00fchlh\u00e4user. 2021. Oh Snap! A Fabrication Pipeline to Magnetically Connect Conventional and 3D-Printed Electronics. Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems. 10.1145\/3411764.3445641","DOI":"10.1145\/3411764.3445641"},{"key":"e_1_3_3_3_46_2","doi-asserted-by":"crossref","unstructured":"Adam\u00a0C Siegel Scott\u00a0T Phillips Michael\u00a0D Dickey Nanshu Lu Zhigang Suo and George\u00a0M Whitesides. 2010. Foldable printed circuit boards on paper substrates. Advanced Functional Materials 20 1 (2010) 28\u201335.","DOI":"10.1002\/adfm.200901363"},{"key":"e_1_3_3_3_47_2","doi-asserted-by":"publisher","DOI":"10.1145\/3313831.3376136"},{"key":"e_1_3_3_3_48_2","first-page":"1","volume-title":"Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems","author":"Wang Guanyun","year":"2018","unstructured":"Guanyun Wang, Tingyu Cheng, Youngwook Do, Humphrey Yang, Ye Tao, Jianzhe Gu, Byoungkwon An, and Lining Yao. 2018. Printed paper actuator: A low-cost reversible actuation and sensing method for shape changing interfaces. In Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems. 1\u201312."},{"key":"e_1_3_3_3_49_2","doi-asserted-by":"crossref","unstructured":"Guanyun Wang Fang Qin Haolin Liu Ye Tao Yang Zhang Yongjie\u00a0Jessica Zhang and Lining Yao. 2020. MorphingCircuit: An integrated design simulation and fabrication workflow for self-morphing electronics. Proceedings of the ACM on Interactive Mobile Wearable and Ubiquitous Technologies 4 4 (2020) 1\u201326.","DOI":"10.1145\/3432232"},{"key":"e_1_3_3_3_50_2","doi-asserted-by":"publisher","DOI":"10.1145\/3266037.3271630"},{"key":"e_1_3_3_3_51_2","doi-asserted-by":"publisher","unstructured":"Junichi Yamaoka Mustafa\u00a0Doga Dogan Katarina Bulovic Kazuya Saito Yoshihiro Kawahara Yasuaki Kakehi and Stefanie Mueller. 2019. FoldTronics. Proceedings of the 2019 CHI Conference on Human Factors in Computing Systems. 10.1145\/3290605.3300858","DOI":"10.1145\/3290605.3300858"},{"key":"e_1_3_3_3_52_2","doi-asserted-by":"crossref","unstructured":"Jiayi Yang Praneshnandan Nithyanandam Shreyas Kanetkar Ki\u00a0Yoon Kwon Jinwoo Ma Sooik Im Ji-Hyun Oh Mohammad Shamsi Mike Wilkins Michael Daniele et\u00a0al. 2023. Liquid metal coated textiles with autonomous electrical healing and antibacterial properties. Advanced Materials Technologies 8 14 (2023) 2202183.","DOI":"10.1002\/admt.202202183"},{"key":"e_1_3_3_3_53_2","doi-asserted-by":"crossref","unstructured":"Baback Yazdani. 1999. Four models of design definition: sequential design centered concurrent and dynamic. Journal of Engineering Design 10 1 (1999) 25\u201337.","DOI":"10.1080\/095448299261407"},{"key":"e_1_3_3_3_54_2","doi-asserted-by":"publisher","DOI":"10.1145\/3706598.3714152"},{"key":"e_1_3_3_3_55_2","doi-asserted-by":"publisher","DOI":"10.1145\/3613904.3642571"},{"key":"e_1_3_3_3_56_2","doi-asserted-by":"publisher","DOI":"10.1145\/3173574.3173691"},{"key":"e_1_3_3_3_57_2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-66715-7_8"},{"key":"e_1_3_3_3_58_2","doi-asserted-by":"publisher","DOI":"10.1145\/3322276.3323689"},{"key":"e_1_3_3_3_59_2","doi-asserted-by":"publisher","DOI":"10.1145\/2037715.2037765"},{"key":"e_1_3_3_3_60_2","doi-asserted-by":"publisher","DOI":"10.1145\/2071423.2071497"},{"key":"e_1_3_3_3_61_2","doi-asserted-by":"publisher","DOI":"10.1145\/2470654.2470748"}],"event":{"name":"CHI 2026: CHI Conference on Human Factors in Computing Systems","location":"Barcelona Spain","acronym":"CHI '26","sponsor":["SIGCHI ACM Special Interest Group on Computer-Human Interaction"]},"container-title":["Proceedings of the 2026 CHI Conference on Human Factors in Computing Systems"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3772318.3792784","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,13]],"date-time":"2026-04-13T07:20:38Z","timestamp":1776064838000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3772318.3792784"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4,13]]},"references-count":60,"alternative-id":["10.1145\/3772318.3792784","10.1145\/3772318"],"URL":"https:\/\/doi.org\/10.1145\/3772318.3792784","relation":{},"subject":[],"published":{"date-parts":[[2026,4,13]]},"assertion":[{"value":"2026-04-13","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}