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Embedded non-volatile memories (eNVMs) address these requirements by offering faster access to stored data at an improved computational throughput and efficiency. Furthermore, these technologies offer numerous appealing features, including limited area-energy-runtime budget and data retention capabilities. Among these, the data retention feature of eNVMs has garnered particular interest within the semiconductor community. Although this property allows eNVMs to retain data even in the absence of a continuous power supply, it also introduces some vulnerabilities, prompting security concerns. These concerns have sparked increased interest in examining the broader security implications associated with eNVM technologies. This article examines the security aspects of eNVMs by discussing the reasons for vulnerabilities in specific memories from an architectural point of view. Additionally, this article extensively reviews eNVM-based security primitives, such as physically unclonable functions and true random number generators, as well as techniques like logic obfuscation. This article also explores a broad spectrum of security threats to eNVMs, including physical attacks such as side-channel attacks, fault injection, and probing, as well as logical threats like information leakage, denial-of-service, and thermal attacks. Finally, this article presents a study of publication trends in the eNVM domain since the early 2000s, reflecting the rising momentum and research activity in this field.<\/jats:p>","DOI":"10.1145\/3799251","type":"journal-article","created":{"date-parts":[[2026,2,26]],"date-time":"2026-02-26T14:02:42Z","timestamp":1772114562000},"page":"1-26","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":2,"title":["Understanding the Security Landscape of Embedded Non-Volatile Memories: A Comprehensive Survey"],"prefix":"10.1145","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0009-0007-3840-857X","authenticated-orcid":false,"given":"Zakia Tamanna","family":"Tisha","sequence":"first","affiliation":[{"name":"Auburn University, Auburn, Alabama, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4819-8728","authenticated-orcid":false,"given":"Ujjwal","family":"Guin","sequence":"additional","affiliation":[{"name":"Auburn University, Auburn, Alabama, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2026,4,27]]},"reference":[{"key":"e_1_3_1_2_2","doi-asserted-by":"publisher","DOI":"10.1109\/INTMAG.2018.8508549"},{"key":"e_1_3_1_3_2","volume-title":"Proceedings of the IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE)","author":"Ahmed Md Shoaib","year":"2024","unstructured":"Md Shoaib Ahmed and Biplab Ray. 2024. 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