{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T09:16:30Z","timestamp":1783674990037,"version":"3.55.0"},"publisher-location":"New York, NY, USA","reference-count":40,"publisher":"ACM","license":[{"start":{"date-parts":[[2026,5,19]],"date-time":"2026-05-19T00:00:00Z","timestamp":1779148800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100001665","name":"Agence Nationale de la Recherche","doi-asserted-by":"publisher","award":["10-AIRT-0005"],"award-info":[{"award-number":["10-AIRT-0005"]}],"id":[{"id":"10.13039\/501100001665","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["dl.acm.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2026,5,19]]},"DOI":"10.1145\/3801488.3806643","type":"proceedings-article","created":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T08:40:14Z","timestamp":1783672814000},"page":"1-9","update-policy":"https:\/\/doi.org\/10.1145\/crossmark-policy","source":"Crossref","is-referenced-by-count":0,"title":["Influence of Environmental Indicators Aggregation Methods for Eco-designing Integrated Circuits"],"prefix":"10.1145","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8267-2972","authenticated-orcid":false,"given":"Madeleine","family":"Abernot","sequence":"first","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, List, Grenoble, France"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7260-2786","authenticated-orcid":false,"given":"Romain","family":"Lemaire","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, List, Grenoble, France"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9799-423X","authenticated-orcid":false,"given":"Maxime","family":"P\u00e9ralta","sequence":"additional","affiliation":[{"name":"Univ. Grenoble Alpes, CEA, List, Grenoble, France"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"320","published-online":{"date-parts":[[2026,7,10]]},"reference":[{"key":"e_1_3_3_1_2_2","unstructured":"Madeleine Abernot Maxime P\u00e9ralta and Romain Lemaire. [n. d.]. Paper ressources and code. https:\/\/archive.softwareheritage.org\/swh:1:dir:9709540d6245ae09305942c3596b2ae17bd245c8 (https:\/\/github.com\/appalca\/scw_2026_indicators_resources)."},{"key":"e_1_3_3_1_3_2","unstructured":"ADEME. 2021. R\u00e9f\u00e9rentiel m\u00e9thodologique d\u2019\u00e9valuation environnementale des services num\u00e9riques. https:\/\/librairie.ademe.fr\/industrie-et-production-durable\/6022-referentiel-par-categorie-de-produit-rcp-des-services-numeriques.html. Accessed: 2026-01-30."},{"key":"e_1_3_3_1_4_2","unstructured":"AFNOR. 2024. R\u00e9f\u00e9rentiel g\u00e9n\u00e9ral pour l\u2019IA frugal. Une AFNOR SPEC pour mesurer et r\u00e9duire l\u2019impact environnemental de l\u2019IA."},{"key":"e_1_3_3_1_5_2","volume-title":"The Global E-waste Monitor 2024","author":"Bald\u00e9 Cornelis\u00a0P.","year":"2024","unstructured":"Cornelis\u00a0P. Bald\u00e9, Ruediger Kuehr, Tales Yamamoto, and et al.2024. The Global E-waste Monitor 2024. Technical Report. https:\/\/ewastemonitor.info\/wp-content\/uploads\/2024\/12\/GEM_2024_EN_11_NOV-web.pdf"},{"key":"e_1_3_3_1_6_2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSST.2011.5936883"},{"key":"e_1_3_3_1_7_2","volume-title":"Empreinte environnementale du num\u00e9rique mondiale","author":"Bordage Fr\u00e9d\u00e9ric","year":"2019","unstructured":"Fr\u00e9d\u00e9ric Bordage, Fabien Abrikh, Anna\u00efg Antoine, Hugues Ferreboeuf, Julie Orgelet, Olivier Vergeynst, C\u00e9line Berthaut, Genevi\u00e8ve\u00a0Van Diest, Nicole Paul, La F\u00e9lixe, Bertrand Keller, and S\u00e9bastien Delorme. 2019. Empreinte environnementale du num\u00e9rique mondiale. synth\u00e8se. GreenIT. https:\/\/www.greenit.fr\/wp-content\/uploads\/2019\/10\/2019-10-GREENIT-etude_EENM-synthese-accessible.VF_.pdf"},{"key":"e_1_3_3_1_8_2","unstructured":"Codde. [n. d.]. NegaOctet database. https:\/\/codde.fr\/nos-marques\/negaoctet\/base-de-donnees. Accessed: 2026-01-30."},{"key":"e_1_3_3_1_9_2","doi-asserted-by":"publisher","unstructured":"Eleonora Crenna Michela Secchi Lorenzo Benini and Serenella Sala. 2019. Global environmental impacts: data sources and methodological choices for calculating normalization factors for LCA. The International Journal of Life Cycle Assessment 24 10 (Oct. 2019) 1851\u20131877. 10.1007\/s11367-019-01604-y","DOI":"10.1007\/s11367-019-01604-y"},{"key":"e_1_3_3_1_10_2","doi-asserted-by":"publisher","unstructured":"J.A. Cunningham. 1990. The use and evaluation of yield models in integrated circuit manufacturing. IEEE Transactions on Semiconductor Manufacturing 3 2 (May 1990) 60\u201371. 10.1109\/66.53188","DOI":"10.1109\/66.53188"},{"key":"e_1_3_3_1_11_2","doi-asserted-by":"publisher","unstructured":"Mattia Damiani Nicola Ferrara and Fulvio Ardente. 2022. Understanding Product Environmental Footprint and Organisation Environmental Footprint methods. 10.2760\/11564ISBN: 9789276572145 ISSN: 1831-9424.","DOI":"10.2760\/11564"},{"key":"e_1_3_3_1_12_2","unstructured":"Ecoinvent. [n. d.]. EcoQuery. https:\/\/ecoquery.ecoinvent.org\/. Accessed: 2026-01-30."},{"key":"e_1_3_3_1_13_2","doi-asserted-by":"publisher","DOI":"10.1145\/3620665.3640415"},{"key":"e_1_3_3_1_14_2","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA61900.2025.00098"},{"key":"e_1_3_3_1_15_2","unstructured":"ESOS. [n. d.]. ESOS course on LCA of electronic products. https:\/\/esos.insa-rennes.fr\/formations\/distribution-open-source-des-supports-2025-de-la-formation-acv-de-produits-electroniques. Accessed: 2026-01-30."},{"key":"e_1_3_3_1_16_2","doi-asserted-by":"publisher","DOI":"10.2760\/798894"},{"key":"e_1_3_3_1_17_2","doi-asserted-by":"publisher","unstructured":"Rolf Frischknecht Peter Fantke Laura Tsch\u00fcmperlin Monia Niero Assumpci\u00f3 Ant\u00f3n Jane Bare Anne-Marie Boulay Francesco Cherubini Michael\u00a0Z. Hauschild Andrew Henderson Annie Levasseur Thomas\u00a0E. McKone Ottar Michelsen Lloren\u00e7\u00a0Mil\u00e0 i Canals Stephan Pfister Brad Ridoutt Ralph\u00a0K. Rosenbaum Francesca Verones Bruce Vigon and Olivier Jolliet. 2016. Global guidance on environmental life cycle impact assessment indicators: progress and case study. The International Journal of Life Cycle Assessment 21 3 (March 2016) 429\u2013442. 10.1007\/s11367-015-1025-1","DOI":"10.1007\/s11367-015-1025-1"},{"key":"e_1_3_3_1_18_2","unstructured":"Fuse. [n. d.]. Wikichip. https:\/\/en.wikichip.org\/. Accessed: 2026-02-03."},{"key":"e_1_3_3_1_19_2","doi-asserted-by":"publisher","DOI":"10.23919\/DATE64628.2025.10993243"},{"key":"e_1_3_3_1_20_2","doi-asserted-by":"publisher","DOI":"10.1145\/3470496.3527408"},{"key":"e_1_3_3_1_21_2","unstructured":"HiSilicon. [n. d.]. Kirin 980. https:\/\/www.hisilicon.com\/en\/products\/kirin\/kirin-flagship-chips\/kirin-960. Accessed: 2026-02-03."},{"key":"e_1_3_3_1_22_2","unstructured":"Intel. [n. d.]. Atom x7z8700. https:\/\/www.intel.com\/content\/dam\/www\/public\/us\/en\/documents\/datasheets\/atom-z36xxx-z37xxx-datasheet-vol-1.pdf. Accessed: 2026-02-03."},{"key":"e_1_3_3_1_23_2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691120"},{"key":"e_1_3_3_1_24_2","doi-asserted-by":"publisher","unstructured":"Donald Kline Nikolas Parshook Xiaoyu Ge Erik Brunvand Rami Melhem Panos\u00a0K. Chrysanthis and Alex\u00a0K. Jones. 2019. GreenChip: A tool for evaluating holistic sustainability of modern computing systems. Sustainable Computing: Informatics and Systems 22 (2019) 322\u2013332. 10.1016\/j.suscom.2017.10.001","DOI":"10.1016\/j.suscom.2017.10.001"},{"key":"e_1_3_3_1_25_2","doi-asserted-by":"publisher","DOI":"10.1109\/IGCC.2017.8323572"},{"key":"e_1_3_3_1_26_2","doi-asserted-by":"publisher","unstructured":"Chien-Hung Kuo Allen\u00a0H. Hu Lance\u00a0Hongwei Hung Kuei-Tzu Yang and Chen-Hua Wu. 2020. Life cycle impact assessment of semiconductor packaging technologies with emphasis on ball grid array. Journal of Cleaner Production 276 (Dec. 2020) 124301. 10.1016\/j.jclepro.2020.124301","DOI":"10.1016\/j.jclepro.2020.124301"},{"key":"e_1_3_3_1_27_2","volume-title":"ISO 14044 Environmental Management: Life Cycle Assessment ; Requirements and Guidelines","author":"Ireland National Standards\u00a0Authority of","year":"2006","unstructured":"National Standards\u00a0Authority of Ireland and International\u00a0Organization for Standardization. 2006. ISO 14044 Environmental Management: Life Cycle Assessment ; Requirements and Guidelines. https:\/\/books.google.fr\/books?id=ETHPxQEACAAJ"},{"key":"e_1_3_3_1_28_2","unstructured":"Passmark. [n. d.]. CPU benchmark. https:\/\/www.cpubenchmark.net\/. Accessed: 2026-02-03."},{"key":"e_1_3_3_1_29_2","doi-asserted-by":"publisher","unstructured":"Thibault Pirson and David Bol. 2021. Assessing the embodied carbon footprint of IoT edge devices with a bottom-up life-cycle approach. Journal of Cleaner Production 322 (2021) 128966. 10.1016\/j.jclepro.2021.128966","DOI":"10.1016\/j.jclepro.2021.128966"},{"key":"e_1_3_3_1_30_2","doi-asserted-by":"publisher","unstructured":"Thibault Pirson Thibault\u00a0P. Delhaye Alex\u00a0G. Pip Gr\u00e9goire Le\u00a0Brun Jean-Pierre Raskin and David Bol. 2023. The Environmental Footprint of IC Production: Review Analysis and Lessons From Historical Trends. IEEE Transactions on Semiconductor Manufacturing 36 1 (2023) 56\u201367. 10.1109\/TSM.2022.3228311","DOI":"10.1109\/TSM.2022.3228311"},{"key":"e_1_3_3_1_31_2","doi-asserted-by":"publisher","unstructured":"Massimo Pizzol Alexis Laurent Serenella Sala Bo Weidema Francesca Verones and Christoph Koffler. 2017. Normalisation and weighting in life cycle assessment: quo vadis? The International Journal of Life Cycle Assessment 22 6 (June 2017) 853\u2013866. 10.1007\/s11367-016-1199-1","DOI":"10.1007\/s11367-016-1199-1"},{"key":"e_1_3_3_1_32_2","doi-asserted-by":"publisher","DOI":"10.1109\/SusTech67720.2026.11536563"},{"key":"e_1_3_3_1_33_2","doi-asserted-by":"publisher","DOI":"10.1109\/SusTech67720.2026.11536276"},{"key":"e_1_3_3_1_34_2","unstructured":"Qualcomm. [n. d.]. Snapdragon 845. https:\/\/www.qualcomm.com\/processors\/application-processors\/products\/sdm845. Accessed: 2026-02-03."},{"key":"e_1_3_3_1_35_2","doi-asserted-by":"publisher","unstructured":"Serenella Sala Alessandro Cerutti and Rana Pant. 2017. Development of a weighting approach for the Environmental Footprint. 10.2760\/945290ISBN: 9789279680410 9789279680427 ISSN: 1018-5593 1831-9424.","DOI":"10.2760\/945290"},{"key":"e_1_3_3_1_36_2","doi-asserted-by":"publisher","unstructured":"Serenella Sala Eleonora Crenna Michela Secchi and Rana Pant. 2017. Global normalisation factors for the Environmental Footprint and Life Cycle Assessment. 10.2760\/88930","DOI":"10.2760\/88930"},{"key":"e_1_3_3_1_37_2","doi-asserted-by":"publisher","unstructured":"Ian Schneider Hui Xu Stephan Benecke David Patterson Keguo Huang Parthasarathy Ranganathan and Cooper Elsworth. 2025. Life-Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends. 10.48550\/arXiv.2502.01671arXiv:https:\/\/arXiv.org\/abs\/2502.01671 [cs].","DOI":"10.48550\/arXiv.2502.01671"},{"key":"e_1_3_3_1_38_2","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA57654.2024.00058"},{"key":"e_1_3_3_1_39_2","doi-asserted-by":"publisher","unstructured":"Aur\u00e9lie Villard Alan Lelah and Daniel Brissaud. 2015. Drawing a chip environmental profile: environmental indicators for the semiconductor industry. Journal of Cleaner Production 86 (Jan. 2015) 98\u2013109. 10.1016\/j.jclepro.2014.08.061","DOI":"10.1016\/j.jclepro.2014.08.061"},{"key":"e_1_3_3_1_40_2","unstructured":"Wikipedia. [n. d.]. Wikipedia - Standard wafer sizes. https:\/\/en.wikipedia.org\/wiki\/Wafer_%28electronics%29#Standard_wafer_sizes. Accessed: 2026-02-03."},{"key":"e_1_3_3_1_41_2","doi-asserted-by":"publisher","unstructured":"Eric\u00a0D. Williams Robert\u00a0U. Ayres and Miriam Heller. 2002. The 1.7 Kilogram Microchip: Energy and Material Use in the Production of Semiconductor Devices. Environmental Science & Technology 36 24 (2002) 5504\u20135510. 10.1021\/es025643o","DOI":"10.1021\/es025643o"}],"event":{"name":"CF '26 Companion: 23rd ACM International Conference on Computing Frontiers","location":"Catania Italy","acronym":"CF '26 Companion","sponsor":["SIGMICRO ACM Special Interest Group on Microarchitectural Research and Processing"]},"container-title":["Proceedings of the 23rd ACM International Conference on Computing Frontiers: Workshops and Special Sessions"],"original-title":[],"link":[{"URL":"https:\/\/dl.acm.org\/doi\/pdf\/10.1145\/3801488.3806643","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T08:41:24Z","timestamp":1783672884000},"score":1,"resource":{"primary":{"URL":"https:\/\/dl.acm.org\/doi\/10.1145\/3801488.3806643"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,19]]},"references-count":40,"alternative-id":["10.1145\/3801488.3806643","10.1145\/3801488"],"URL":"https:\/\/doi.org\/10.1145\/3801488.3806643","relation":{},"subject":[],"published":{"date-parts":[[2026,5,19]]},"assertion":[{"value":"2026-07-10","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}