{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,19]],"date-time":"2025-11-19T07:01:16Z","timestamp":1763535676789,"version":"3.37.3"},"reference-count":12,"publisher":"IBM","issue":"3\/4","funder":[{"DOI":"10.13039\/100000015","name":"U.S. Department of Energy","doi-asserted-by":"publisher","award":["B604142"],"award-info":[{"award-number":["B604142"]}],"id":[{"id":"10.13039\/100000015","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IBM J. Res. & Dev."],"published-print":{"date-parts":[[2020,5,1]]},"DOI":"10.1147\/jrd.2019.2958902","type":"journal-article","created":{"date-parts":[[2019,12,10]],"date-time":"2019-12-10T21:25:17Z","timestamp":1576013117000},"page":"5:1-5:12","source":"Crossref","is-referenced-by-count":2,"title":["Summit and Sierra supercomputer cooling solutions"],"prefix":"10.1147","volume":"64","author":[{"given":"S.","family":"Tian","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T.","family":"Takken","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"V.","family":"Mahaney","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Marroquin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Schultz","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Hoffmeyer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Y.","family":"Yao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.","family":"Oconnell","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A.","family":"Yuksel","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.","family":"Coteus","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"3082","reference":[{"year":"0","key":"ref4"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2012.6188852"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2017.7992478"},{"key":"ref6","first-page":"1313","article-title":"A single flexible cold plate cools multiple devices","author":"tian","year":"2019","journal-title":"Proc 10th Intersoc Thermal Thermomech Phenomena Electron Syst Conf"},{"article-title":"GPU cooling solutions for HPC systems","year":"2017","author":"hoffmeyer","key":"ref11"},{"year":"0","key":"ref5"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2019-6444"},{"article-title":"Chip on wafer on substrate (CoWoS)","year":"2012","author":"payne","key":"ref8"},{"year":"2017","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1115\/1.4006140"},{"article-title":"Thermal interface material structures","year":"2019","author":"hoffmeyer","key":"ref9"},{"journal-title":"Comput Sci Res Dev","article-title":"Blue Gene\/Q: By co-design","year":"2013","key":"ref1"}],"container-title":["IBM Journal of Research and Development"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/5288520\/9093089\/8930295-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5288520\/9093089\/08930295.pdf?arnumber=8930295","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,3]],"date-time":"2022-05-03T20:05:03Z","timestamp":1651608303000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8930295\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,5,1]]},"references-count":12,"journal-issue":{"issue":"3\/4"},"URL":"https:\/\/doi.org\/10.1147\/jrd.2019.2958902","relation":{},"ISSN":["0018-8646","0018-8646"],"issn-type":[{"type":"print","value":"0018-8646"},{"type":"electronic","value":"0018-8646"}],"subject":[],"published":{"date-parts":[[2020,5,1]]}}}