{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,23]],"date-time":"2025-10-23T18:02:40Z","timestamp":1761242560126,"version":"build-2065373602"},"reference-count":17,"publisher":"IBM","issue":"5\/6","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IBM J. Res. & Dev."],"published-print":{"date-parts":[[2020,9]]},"DOI":"10.1147\/jrd.2020.3008100","type":"journal-article","created":{"date-parts":[[2020,9,4]],"date-time":"2020-09-04T16:43:47Z","timestamp":1599237827000},"page":"16:1-16:10","source":"Crossref","is-referenced-by-count":6,"title":["IBM z15: Improved data center density and energy efficiency, new system packaging, and modeling"],"prefix":"10.1147","volume":"64","author":[{"given":"W. P.","family":"Kostenko","sequence":"first","affiliation":[]},{"given":"J. G.","family":"Torok","sequence":"additional","affiliation":[]},{"given":"D. W.","family":"Demetriou","sequence":"additional","affiliation":[]}],"member":"3082","reference":[{"year":"0","key":"ref10"},{"year":"0","key":"ref11"},{"year":"0","key":"ref12"},{"year":"2019","key":"ref13","article-title":"Top 10 strategic technology trends for 2020"},{"year":"0","key":"ref14"},{"journal-title":"Thermal Guidelines for Data Processing Environments","year":"0","key":"ref15"},{"key":"ref16","doi-asserted-by":"crossref","first-page":"14:1","DOI":"10.1147\/JRD.2015.2446031","article-title":"Mechanical packaging, power and cooling design for the IBM z13","volume":"59","author":"torok","year":"2015","journal-title":"IBM J Res Dev"},{"year":"0","key":"ref17"},{"year":"2019","key":"ref4","article-title":"Annual data center survey results"},{"year":"2019","key":"ref3","article-title":"Large supply pipeline sets state for market growth in 2019—North American Data Center Report H1"},{"year":"2019","key":"ref6","article-title":"State of the industry – data center cooling report"},{"year":"2018","key":"ref5","article-title":"Data center structured cabling market research report—Forecast to 2023"},{"year":"0","key":"ref8"},{"journal-title":"Advancing DCIM with IT Equipment Integration","year":"2019","author":"ashrae","key":"ref7"},{"year":"2018","key":"ref2","article-title":"Data center real estate review"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2018.2803438"},{"year":"0","key":"ref9"}],"container-title":["IBM Journal of Research and Development"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/5288520\/9177188\/09138729.pdf?arnumber=9138729","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,23]],"date-time":"2025-10-23T17:57:55Z","timestamp":1761242275000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9138729\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,9]]},"references-count":17,"journal-issue":{"issue":"5\/6"},"URL":"https:\/\/doi.org\/10.1147\/jrd.2020.3008100","relation":{},"ISSN":["0018-8646","0018-8646"],"issn-type":[{"type":"print","value":"0018-8646"},{"type":"electronic","value":"0018-8646"}],"subject":[],"published":{"date-parts":[[2020,9]]}}}