{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,6]],"date-time":"2026-04-06T13:02:52Z","timestamp":1775480572876,"version":"3.50.1"},"reference-count":0,"publisher":"The Electrochemical Society","issue":"9","license":[{"start":{"date-parts":[[2000,9,1]],"date-time":"2000-09-01T00:00:00Z","timestamp":967766400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/iopscience.iop.org\/page\/copyright"},{"start":{"date-parts":[[2000,9,1]],"date-time":"2000-09-01T00:00:00Z","timestamp":967766400000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/iopscience.iop.org\/info\/page\/text-and-data-mining"}],"content-domain":{"domain":["iopscience.iop.org"],"crossmark-restriction":false},"short-container-title":["J. Electrochem. Soc."],"published-print":{"date-parts":[[2000,9,1]]},"abstract":"<jats:p>Galvanostatic electrodeposition was used to produce Ni\u2010Cu alloys and <jats:inline-formula>\n                     <mml:math xmlns:mml=\"http:\/\/www.w3.org\/1998\/Math\/MathML\" display=\"inline\" id=\"ML1\" overflow=\"scroll\">\n                        <mml:msub>\n                           <mml:mi mathvariant=\"normal\">Ni<\/mml:mi>\n                           <mml:mrow>\n                              <mml:mn>81<\/mml:mn>\n                           <\/mml:mrow>\n                        <\/mml:msub>\n                        <mml:msub>\n                           <mml:mi mathvariant=\"normal\">Cu<\/mml:mi>\n                           <mml:mrow>\n                              <mml:mn>19<\/mml:mn>\n                           <\/mml:mrow>\n                        <\/mml:msub>\n                        <mml:mo>\/<\/mml:mo>\n                        <mml:mi mathvariant=\"normal\">Cu<\/mml:mi>\n                     <\/mml:math>\n                     <jats:inline-graphic xmlns:xlink=\"http:\/\/www.w3.org\/1999\/xlink\" xlink:href=\"jes_147_9_3311ieqn1.jpg\" xlink:type=\"simple\"\/>\n                  <\/jats:inline-formula> multilayers by direct current (dc) plating and two\u2010pulse plating, respectively, from a sulfate\/citrate electrolyte. For the dc\u2010plated Ni\u2010Cu alloys, the deposition rate and the alloy composition were established as a function of the deposition current density, from which the appropriate deposition parameters for the constituent sublayers of the multilayers could be established. By measuring the resistivity at room temperature in magnetic fields up to H = 7 kOe, anisotropic magnetoresistance (AMR) was found for <jats:inline-formula>\n                     <mml:math xmlns:mml=\"http:\/\/www.w3.org\/1998\/Math\/MathML\" display=\"inline\" id=\"ML2\" overflow=\"scroll\">\n                        <mml:msub>\n                           <mml:mi mathvariant=\"normal\">Ni<\/mml:mi>\n                           <mml:mrow>\n                              <mml:mn>81<\/mml:mn>\n                           <\/mml:mrow>\n                        <\/mml:msub>\n                        <mml:msub>\n                           <mml:mi mathvariant=\"normal\">Cu<\/mml:mi>\n                           <mml:mrow>\n                              <mml:mn>19<\/mml:mn>\n                           <\/mml:mrow>\n                        <\/mml:msub>\n                     <\/mml:math>\n                     <jats:inline-graphic xmlns:xlink=\"http:\/\/www.w3.org\/1999\/xlink\" xlink:href=\"jes_147_9_3311ieqn2.jpg\" xlink:type=\"simple\"\/>\n                  <\/jats:inline-formula> electrodeposits, whereas both giant magnetoresistance (GMR) and AMR contributions were observed for most <jats:inline-formula>\n                     <mml:math xmlns:mml=\"http:\/\/www.w3.org\/1998\/Math\/MathML\" display=\"inline\" id=\"ML3\" overflow=\"scroll\">\n                        <mml:msub>\n                           <mml:mi mathvariant=\"normal\">Ni<\/mml:mi>\n                           <mml:mrow>\n                              <mml:mn>81<\/mml:mn>\n                           <\/mml:mrow>\n                        <\/mml:msub>\n                        <mml:msub>\n                           <mml:mi mathvariant=\"normal\">Cu<\/mml:mi>\n                           <mml:mrow>\n                              <mml:mn>19<\/mml:mn>\n                           <\/mml:mrow>\n                        <\/mml:msub>\n                        <mml:mo>\/<\/mml:mo>\n                        <mml:mi mathvariant=\"normal\">Cu<\/mml:mi>\n                     <\/mml:math>\n                     <jats:inline-graphic xmlns:xlink=\"http:\/\/www.w3.org\/1999\/xlink\" xlink:href=\"jes_147_9_3311ieqn3.jpg\" xlink:type=\"simple\"\/>\n                  <\/jats:inline-formula> multilayers. Finally, Ni\u2010Cu alloys were also prepared by conventional pulse plating, varying the length of the deposition pulse (on\u2010time) with constant separation (off\u2010time) between the pulses. Clear evidence of a GMR contribution also appeared in these pulse plated Ni\u2010Cu alloys which may be explained by the formation of a Cu enriched layer between the ferromagnetic layers deposited during the cathodic pulses. A quartz crystal microbalance experiment confirmed that an exchange reaction takes place during the off\u2010time. These findings provide useful information on the formation mechanism of multilayers by the two\u2010pulse plating technique. \u00a9 2000 The Electrochemical Society. All rights reserved.<\/jats:p>","DOI":"10.1149\/1.1393900","type":"journal-article","created":{"date-parts":[[2002,7,28]],"date-time":"2002-07-28T22:22:35Z","timestamp":1027894955000},"page":"3311-3318","update-policy":"https:\/\/doi.org\/10.1088\/crossmark-policy","source":"Crossref","is-referenced-by-count":75,"title":["Preparation and Magnetoresistance Characteristics of Electrodeposited Ni\u2010Cu Alloys and Ni\u2010Cu\/Cu Multilayers"],"prefix":"10.1149","volume":"147","author":[{"given":"E.","family":"T\u00f3th\u2010K\u00e1d\u00e1r","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L.","family":"P\u00e9ter","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T.","family":"Becsei","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"J.","family":"T\u00f3th","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"L.","family":"Pog\u00e1ny","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T.","family":"Tarn\u00f3czi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"P.","family":"Kamasa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"I.","family":"Bakonyi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"L\u00e1ng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"\u00c1.","family":"Czir\u00e1ki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W.","family":"Schwarzacher","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"77","container-title":["Journal of The Electrochemical Society"],"original-title":[],"link":[{"URL":"https:\/\/iopscience.iop.org\/article\/10.1149\/1.1393900","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1149\/1.1393900\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1149\/1.1393900\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/syndication.highwire.org\/content\/doi\/10.1149\/1.1393900","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"},{"URL":"https:\/\/iopscience.iop.org\/article\/10.1149\/1.1393900\/pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,12,5]],"date-time":"2023-12-05T12:48:29Z","timestamp":1701780509000},"score":1,"resource":{"primary":{"URL":"https:\/\/iopscience.iop.org\/article\/10.1149\/1.1393900"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2000,9,1]]},"references-count":0,"journal-issue":{"issue":"9","published-print":{"date-parts":[[2000,9,1]]}},"URL":"https:\/\/doi.org\/10.1149\/1.1393900","relation":{},"ISSN":["0013-4651","1945-7111"],"issn-type":[{"value":"0013-4651","type":"print"},{"value":"1945-7111","type":"electronic"}],"subject":[],"published":{"date-parts":[[2000,9,1]]},"assertion":[{"value":"Preparation and Magnetoresistance Characteristics of Electrodeposited Ni\u2010Cu Alloys and Ni\u2010Cu\/Cu Multilayers","name":"article_title","label":"Article Title"},{"value":"Journal of The Electrochemical Society","name":"journal_title","label":"Journal Title"},{"value":"paper","name":"article_type","label":"Article Type"},{"value":"\u00a9 2000 ECS - The Electrochemical Society","name":"copyright_information","label":"Copyright Information"},{"value":"1999-06-21","name":"date_received","label":"Date Received","group":{"name":"publication_dates","label":"Publication dates"}},{"name":"date_accepted","label":"Date Accepted","group":{"name":"publication_dates","label":"Publication dates"}},{"name":"date_epub","label":"Online publication date","group":{"name":"publication_dates","label":"Publication dates"}}]}}