{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,20]],"date-time":"2025-04-20T04:43:22Z","timestamp":1745124202269,"version":"3.37.3"},"reference-count":0,"publisher":"Wiley","issue":"4","license":[{"start":{"date-parts":[[2000,1,1]],"date-time":"2000-01-01T00:00:00Z","timestamp":946684800000},"content-version":"vor","delay-in-days":18,"URL":"http:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"funder":[{"DOI":"10.13039\/100000183","name":"Army Research Office","doi-asserted-by":"publisher","award":["DAAG55-97-K-0132"],"award-info":[{"award-number":["DAAG55-97-K-0132"]}],"id":[{"id":"10.13039\/100000183","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["VLSI Design"],"published-print":{"date-parts":[[2000,1]]},"abstract":"<jats:p>The first completely physical electro\u2010thermal model is presented that is capable of\ndescribing the large signal performance of MESFET\u2010 and HEMT\u2010based, high power\nmicrowave and millimeter wave monolithic and hybrid ICs, on timescales suitable for\nCAD. The model includes the effects of self\u2010heating and mutual thermal interaction\non active device performance with full treatment of all thermal non linearities. The\nelectrical description is provided by the rapid quasi\u20102D Leeds Physical Model and the\nsteady\u2010state global thermal description is provided by a highly accurate and computationally\ninexpensive analytical thermal resistance matrix approach. The order of\nthe global thermal resistance matrix describing 3\u2010dimensional heat flow in complex\nsystems, is shown to be determined purely by the number of active device elements, not\nthe level of internal device structure. Thermal updates in the necessarily iterative, fully\ncoupled electro\u2010thermal solution, therefore reduce to small matrix multiplications\nimplying orders of magnitude speed\u2010up compared to the use of full numerical thermal\nsolutions capable of comparable levels of detail and accuracy.<\/jats:p>","DOI":"10.1155\/2000\/86517","type":"journal-article","created":{"date-parts":[[2007,9,18]],"date-time":"2007-09-18T12:58:37Z","timestamp":1190120317000},"page":"355-389","update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":14,"title":["Electro\u2010thermal Modelling of Monolithic and HybridMicrowave and Millimeter Wave IC\u2032s"],"prefix":"10.1155","volume":"10","author":[{"given":"W.","family":"Batty","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"A. J.","family":"Panks","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"R. G.","family":"Johnson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. M.","family":"Snowden","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[1999,12,14]]},"container-title":["VLSI Design"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/downloads.hindawi.com\/archive\/2000\/086517.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1155\/2000\/86517","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,8]],"date-time":"2024-08-08T13:21:28Z","timestamp":1723123288000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1155\/2000\/86517"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1999,12,14]]},"references-count":0,"journal-issue":{"issue":"4","published-print":{"date-parts":[[2000,1]]}},"alternative-id":["10.1155\/2000\/86517"],"URL":"https:\/\/doi.org\/10.1155\/2000\/86517","archive":["Portico"],"relation":{},"ISSN":["1065-514X","1563-5171"],"issn-type":[{"type":"print","value":"1065-514X"},{"type":"electronic","value":"1563-5171"}],"subject":[],"published":{"date-parts":[[1999,12,14]]},"assertion":[{"value":"1998-12-16","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"1999-12-14","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"1999-12-14","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}