{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,13]],"date-time":"2025-04-13T04:55:43Z","timestamp":1744520143780},"reference-count":0,"publisher":"Wiley","issue":"1-4","license":[{"start":{"date-parts":[[2000,1,1]],"date-time":"2000-01-01T00:00:00Z","timestamp":946684800000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/3.0\/"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["9710463"],"award-info":[{"award-number":["9710463"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["VLSI Design"],"published-print":{"date-parts":[[2001,1]]},"abstract":"<jats:p>A new analytical expression of thermal diffusion coefficient <jats:italic>D<\/jats:italic><jats:sup><jats:italic>T<\/jats:italic><\/jats:sup> is derived. To the firstorder\napproximation, it is given by (1+<jats:italic>\u03b7<\/jats:italic>)<jats:sup>-1<\/jats:sup>(<jats:italic>D<\/jats:italic>\/<jats:italic>T<\/jats:italic><jats:sub><jats:italic>n<\/jats:italic><\/jats:sub>) rather than (1\u2013<jats:italic>\u03b7<\/jats:italic>)(<jats:italic>D<\/jats:italic>\/<jats:italic>T<\/jats:italic><jats:sub><jats:italic>n<\/jats:italic><\/jats:sub>) where\n<jats:italic>\u03b7<\/jats:italic>=\u2013(<jats:italic>T<\/jats:italic><jats:sub><jats:italic>n<\/jats:italic><\/jats:sub>\/<jats:italic>\u03b7<\/jats:italic><jats:sup>*<\/jats:sup>)(<jats:italic>\u2202<\/jats:italic><jats:italic>\u03b7<\/jats:italic><jats:sup>*<\/jats:sup>\/<jats:italic>\u2202<\/jats:italic><jats:italic>T<\/jats:italic><jats:sub><jats:italic>n<\/jats:italic><\/jats:sub>\n) and  <jats:italic>\u03b7<\/jats:italic><jats:sup>*<\/jats:sup> represents the temperature\u2010dependent bulk mobility.\nThis new transport coefficient is implemented in our 2\u2010D hydrodynamic device\nsimulator and it seems to produce more reasonable results.<\/jats:p>","DOI":"10.1155\/2001\/51736","type":"journal-article","created":{"date-parts":[[2007,9,18]],"date-time":"2007-09-18T13:00:57Z","timestamp":1190120457000},"page":"131-134","update-policy":"http:\/\/dx.doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":7,"title":["An Analytic Expression of Thermal DiffusionCoefficient for the Hydrodynamic Simulationof Semiconductor Devices"],"prefix":"10.1155","volume":"13","author":[{"given":"Ting-Wei","family":"Tang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xinlin","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Haitao","family":"Gan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Meikei","family":"Ieong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2001,1]]},"container-title":["VLSI Design"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/downloads.hindawi.com\/archive\/2001\/051736.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1155\/2001\/51736","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,9]],"date-time":"2024-08-09T13:33:42Z","timestamp":1723210422000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1155\/2001\/51736"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2001,1]]},"references-count":0,"journal-issue":{"issue":"1-4","published-print":{"date-parts":[[2001,1]]}},"alternative-id":["10.1155\/2001\/51736"],"URL":"https:\/\/doi.org\/10.1155\/2001\/51736","archive":["Portico"],"relation":{},"ISSN":["1065-514X","1563-5171"],"issn-type":[{"type":"print","value":"1065-514X"},{"type":"electronic","value":"1563-5171"}],"subject":[],"published":{"date-parts":[[2001,1]]},"assertion":[{"value":"2001-01-01","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}