{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T14:35:44Z","timestamp":1740148544823,"version":"3.37.3"},"reference-count":0,"publisher":"Wiley","license":[{"start":{"date-parts":[[2016,1,1]],"date-time":"2016-01-01T00:00:00Z","timestamp":1451606400000},"content-version":"unspecified","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Journal of Sensors"],"published-print":{"date-parts":[[2016]]},"DOI":"10.1155\/2016\/2897541","type":"journal-article","created":{"date-parts":[[2016,12,22]],"date-time":"2016-12-22T20:08:39Z","timestamp":1482437319000},"page":"1-2","source":"Crossref","is-referenced-by-count":0,"title":["Embeddable Advanced Sensors for Harsh Environment Sensing Applications"],"prefix":"10.1155","volume":"2016","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0826-648X","authenticated-orcid":true,"given":"Lei","family":"Yuan","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, Clemson University, Clemson, SC 29634, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yinan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO 65409, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3479-4385","authenticated-orcid":true,"given":"Yan","family":"Lu","sequence":"additional","affiliation":[{"name":"Research Center of Nondestructive Testing & Evaluation, Beijing University of Technology, Beijing 100124, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9228-8720","authenticated-orcid":true,"given":"Xiaobei","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Communication and Information Engineering, Shanghai University, Shanghai 200072, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mengmeng","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, NE 68588-0511, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","container-title":["Journal of Sensors"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/downloads.hindawi.com\/journals\/js\/2016\/2897541.pdf","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/downloads.hindawi.com\/journals\/js\/2016\/2897541.xml","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"http:\/\/downloads.hindawi.com\/journals\/js\/2016\/2897541.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,12,22]],"date-time":"2016-12-22T20:08:40Z","timestamp":1482437320000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.hindawi.com\/journals\/js\/2016\/2897541\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":0,"alternative-id":["2897541","2897541"],"URL":"https:\/\/doi.org\/10.1155\/2016\/2897541","relation":{},"ISSN":["1687-725X","1687-7268"],"issn-type":[{"type":"print","value":"1687-725X"},{"type":"electronic","value":"1687-7268"}],"subject":[],"published":{"date-parts":[[2016]]}}}