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They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust.<\/jats:p>","DOI":"10.1155\/2021\/8830395","type":"journal-article","created":{"date-parts":[[2021,5,24]],"date-time":"2021-05-24T22:35:06Z","timestamp":1621895706000},"page":"1-14","source":"Crossref","is-referenced-by-count":2,"title":["Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling"],"prefix":"10.1155","volume":"2021","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-4699-9668","authenticated-orcid":true,"given":"Khaoula","family":"Ait Belaid","sequence":"first","affiliation":[{"name":"Laboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, Morocco"}]},{"given":"H.","family":"Belahrach","sequence":"additional","affiliation":[{"name":"Laboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, Morocco"},{"name":"Department of Electrical Engineering, Royal School of Aeronautics, Marrakesh, Morocco"}]},{"given":"H.","family":"Ayad","sequence":"additional","affiliation":[{"name":"Laboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, Morocco"}]}],"member":"311","reference":[{"doi-asserted-by":"publisher","key":"1","DOI":"10.1145\/342001.339691"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1147\/rd.504.0491"},{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/ICM.2010.5696135"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1155\/2008\/764942"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1109\/IITC.2009.5090331"},{"issue":"12","key":"6","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1149\/1.3501030","article-title":"Integration and frequency dependent parametric modeling of through Silicon via involved in high density 3D chip stacking","volume":"33","author":"L. 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