{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,2,13]],"date-time":"2024-02-13T11:21:08Z","timestamp":1707823268841},"reference-count":0,"publisher":"American Scientific Publishers","issue":"7","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["j nanosci nanotechnol"],"published-print":{"date-parts":[[2021,7,1]]},"abstract":"<jats:p>We study the effect of thermal interface material such as thermal-conductive plastic on the dissipation of generated heat from the light-emitting diodes (LEDs) based headlamp for the application of environment-friendly green energy in vehicles. The thermal distribution and the performances\n of thermal-conductive plastic with heatsink are consistently investigated by using experimental and numerical results. Various thicknesses of thermal-conductive plastics from 0.3 mm to 1.0 mm used in this research work. Basically the thermal-conductive plastic reduces the thermal interface\n resistance between the contact of two solid surfaces. As a result, High electrical power of about 15 W (1 A and 15 V) can be possible for applying to the high-power LED package without any damage. The soldering temperature of LED package without thermal-conductive plastic shows approximately\n 138.7 \u00b0C which is higher compared to the LED package with thermal-conductive plastic (124.3 \u00b0C). On the other hand, the soldering temperature increases from 124.3 to 127.6 \u00b0C with increasing the thicknesses of thermal-conductive plastic. In addition, the soldering temperature decreases\n from 138.7 to 124.3 \u00b0C with increasing the thermal conductivities of thermal-conductive plastic. Finally, a highly thermal conductive property of thermal-conductive plastic will propose for optimum dissipation of generated heat from the LEDs-based headlamp. We also successfully estimate\n the junction temperature of packaged LEDs by using soldering temperature.<\/jats:p>","DOI":"10.1166\/jnn.2021.19218","type":"journal-article","created":{"date-parts":[[2021,3,15]],"date-time":"2021-03-15T04:31:27Z","timestamp":1615782687000},"page":"3721-3728","source":"Crossref","is-referenced-by-count":4,"title":["Effect of Thermal Interface Materials on Heat Dissipation of Light-Emitting Diode Headlamps with Thermally-Conductive Plastics"],"prefix":"10.1166","volume":"21","author":[{"given":"Dong Kyu","family":"Lee","sequence":"first","affiliation":[{"name":"Department of Printed Electronics Engineering, Sunchon National University, Jeonnam, 57922, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Jung","family":"Cha","sequence":"additional","affiliation":[{"name":"Department of Printed Electronics Engineering, Sunchon National University, Jeonnam, 57922, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joon Seop","family":"Kwak","sequence":"additional","affiliation":[{"name":"Department of Printed Electronics Engineering, Sunchon National University, Jeonnam, 57922, Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"17","container-title":["Journal of Nanoscience and Nanotechnology"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.ingentaconnect.com\/content\/asp\/jnn\/2021\/00000021\/00000007\/art00014","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,7,9]],"date-time":"2021-07-09T04:41:27Z","timestamp":1625805687000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.ingentaconnect.com\/content\/10.1166\/jnn.2021.19218"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,7,1]]},"references-count":0,"journal-issue":{"issue":"7","published-print":{"date-parts":[[2021,7,1]]}},"alternative-id":["1533-4880(20210701)21:7L.3721;1-"],"URL":"https:\/\/doi.org\/10.1166\/jnn.2021.19218","relation":{},"ISSN":["1533-4880"],"issn-type":[{"value":"1533-4880","type":"print"}],"subject":[],"published":{"date-parts":[[2021,7,1]]}}}