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As the thermal behavior of molds is of crucial importance to the curing performance of composites, a heat-balance method is presented to reduce the heating rate on overheated areas of molds, thus providing a more homogeneous curing process. The method is based on a local-isolation structure installed under the mold plate, which is used to change the local heat transfer coefficient of the mold. In the local-isolation structure application, an optimization process combining numerical simulations with a greedy genetic algorithm is developed to find the optimal layout and geometry of local-isolation structure in molds. The optimization results suggest that more uniform heating condition and more synchronous curing process can be achieved with the optimal design of local-isolation structure. In the case of a typical mold for C spar component, the maximum temperature difference in the composite part is reduce by 45.69%, while the maximum difference in degree of cure is decreased at a rate of 40.16%.<\/jats:p>","DOI":"10.1177\/0021998318788918","type":"journal-article","created":{"date-parts":[[2018,7,17]],"date-time":"2018-07-17T03:25:51Z","timestamp":1531797951000},"page":"641-652","update-policy":"https:\/\/doi.org\/10.1177\/sage-journals-update-policy","source":"Crossref","is-referenced-by-count":22,"title":["A heat-balance method for autoclave process of composite manufacturing"],"prefix":"10.1177","volume":"53","author":[{"given":"Lingyun","family":"Wang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Fluid Power and Mechatronic System, School of Mechanical Engineering, Zhejiang University, China"},{"name":"Key Laboratory of Advanced Manufacturing Technology of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5833-5514","authenticated-orcid":false,"given":"Weidong","family":"Zhu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Fluid Power and Mechatronic System, School of Mechanical Engineering, Zhejiang University, China"},{"name":"Key Laboratory of Advanced Manufacturing Technology of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qing","family":"Wang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Fluid Power and Mechatronic System, School of Mechanical Engineering, Zhejiang University, China"},{"name":"Key Laboratory of Advanced Manufacturing Technology of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qiang","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Fluid Power and Mechatronic System, School of Mechanical Engineering, Zhejiang University, China"},{"name":"Key Laboratory of Advanced Manufacturing Technology of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yinglin","family":"Ke","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Fluid Power and Mechatronic System, School of Mechanical Engineering, Zhejiang University, China"},{"name":"Key Laboratory of Advanced Manufacturing Technology of Zhejiang Province, School of Mechanical Engineering, Zhejiang University, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"179","published-online":{"date-parts":[[2018,7,17]]},"reference":[{"key":"bibr1-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1016\/S1359-835X(00)00173-1"},{"key":"bibr2-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1007\/s11831-016-9167-2"},{"key":"bibr3-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1016\/0010-4361(86)90250-8"},{"key":"bibr4-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1177\/073168449801700402"},{"key":"bibr5-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1177\/002199839703102203"},{"key":"bibr6-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1016\/j.compscitech.2004.07.015"},{"key":"bibr7-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1002\/pc.10524"},{"key":"bibr8-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1002\/pc.10309"},{"key":"bibr9-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1007\/s12289-009-0450-8"},{"key":"bibr10-0021998318788918","doi-asserted-by":"publisher","DOI":"10.1007\/s11831-013-9080-x"},{"key":"bibr11-0021998318788918","doi-asserted-by":"crossref","unstructured":"Ghnatios C, Chinesta F, Cueto E, et\u00a0al. 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