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In this paper, a model for EM and TM processes is proposed and has been implemented in a general purpose finite-element code. The governing equations utilized for the model include mass conservation, force equilibrium, heat transfer and electricity conduction. A damage evolution model based on thermodynamics is introduced to evaluate the degradation in solder joints subjected to high current densities and high temperature gradients. The simulation results are compared with experimental data to validate the model.<\/jats:p>","DOI":"10.1177\/0037549708094856","type":"journal-article","created":{"date-parts":[[2008,11,6]],"date-time":"2008-11-06T09:43:43Z","timestamp":1225964623000},"page":"391-401","source":"Crossref","is-referenced-by-count":14,"title":["Simulating Damage Mechanics of Electromigration and Thermomigration"],"prefix":"10.1177","volume":"84","author":[{"family":"Shidong Li","sequence":"first","affiliation":[{"name":"Electronic Packaging Laboratory State University of New York at Buffalo, 102 Ketter Hall, Buffalo, NY, 14260"}]},{"given":"Mohd F.","family":"Abdulhamid","sequence":"additional","affiliation":[{"name":"Electronic Packaging Laboratory State University of New York at Buffalo, 102 Ketter Hall, Buffalo, NY, 14260"}]},{"given":"Cemal","family":"Basaran","sequence":"additional","affiliation":[{"name":"Electronic Packaging Laboratory State University of New York at Buffalo, 102 Ketter Hall, Buffalo, NY, 14260"}]}],"member":"179","published-online":{"date-parts":[[2008,8,1]]},"reference":[{"key":"atypb1","first-page":"156","volume":"16","author":"Skaupy, F.","year":"1914","journal-title":"Verband Deutscher Physikalischer Gesellschaften"},{"key":"atypb2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-53297-9"},{"key":"atypb3","first-page":"942","volume":"59","author":"Wever, H.","year":"1955","journal-title":"Zeitschrift f\u00fcr Elektrochemie"},{"key":"atypb4","doi-asserted-by":"publisher","DOI":"10.1063\/1.1554775"},{"key":"atypb5","doi-asserted-by":"publisher","DOI":"10.1023\/A:1004852912392"},{"issue":"4","key":"atypb6","first-page":"1","volume":"102","author":"Dan, Y.","year":"2007","journal-title":"Journal of Applied Physics"},{"key":"atypb7","doi-asserted-by":"publisher","DOI":"10.1063\/1.2200479"},{"key":"atypb8","author":"Abdulhamid, M.","journal-title":"ASME Journal of Electronic Packaging"},{"key":"atypb9","doi-asserted-by":"publisher","DOI":"10.1063\/1.355100"},{"key":"atypb10","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.45.1409"},{"key":"atypb11","doi-asserted-by":"publisher","DOI":"10.1063\/1.89024"},{"issue":"8","key":"atypb12","first-page":"325","volume":"131","author":"Blech, LA","year":"1984","journal-title":"Journal of the Electrochemical Society"},{"key":"atypb13","doi-asserted-by":"publisher","DOI":"10.1063\/1.89414"},{"key":"atypb14","doi-asserted-by":"publisher","DOI":"10.1016\/S1359-6454(97)00446-1"},{"key":"atypb15","doi-asserted-by":"publisher","DOI":"10.1016\/0956-7151(92)90305-X"},{"key":"atypb16","unstructured":"Bassman, L.C. 1999. 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