{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,4]],"date-time":"2026-05-04T13:48:41Z","timestamp":1777902521667,"version":"3.51.4"},"reference-count":38,"publisher":"SAGE Publications","issue":"8","license":[{"start":{"date-parts":[[2022,1,16]],"date-time":"2022-01-16T00:00:00Z","timestamp":1642291200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/journals.sagepub.com\/page\/policies\/text-and-data-mining-license"}],"funder":[{"DOI":"10.13039\/501100003593","name":"Conselho Nacional de Desenvolvimento Cient\u00edfico e Tecnol\u00f3gico","doi-asserted-by":"publisher","award":["302938\/2015-0, 430986\/2016-5 and 443823\/2018-9"],"award-info":[{"award-number":["302938\/2015-0, 430986\/2016-5 and 443823\/2018-9"]}],"id":[{"id":"10.13039\/501100003593","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003593","name":"Conselho Nacional de Desenvolvimento Cient\u00edfico e Tecnol\u00f3gico","doi-asserted-by":"publisher","award":["407198\/2013-0, 403560\/2013-6, and 407204\/2013-0"],"award-info":[{"award-number":["407198\/2013-0, 403560\/2013-6, and 407204\/2013-0"]}],"id":[{"id":"10.13039\/501100003593","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Araucaria Foundation of Parana, Brazil","award":["115\/2018, no. 50.579 \u2013 PRONEX"],"award-info":[{"award-number":["115\/2018, no. 50.579 \u2013 PRONEX"]}]},{"DOI":"10.13039\/501100002322","name":"Coordena\u00e7\u00e3o de Aperfei\u00e7oamento de Pessoal de N\u00edvel Superior","doi-asserted-by":"publisher","award":["062\/14 and CAPES-PRINT-UFPR-88881.311981\/2018-01"],"award-info":[{"award-number":["062\/14 and CAPES-PRINT-UFPR-88881.311981\/2018-01"]}],"id":[{"id":"10.13039\/501100002322","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["journals.sagepub.com"],"crossmark-restriction":true},"short-container-title":["SIMULATION"],"published-print":{"date-parts":[[2022,8]]},"abstract":"<jats:p>\n                    A simplified three-dimensional mathematical model for electronic packaging cabinets was derived from physical laws. Tridimensionality resulted from the domain division in volume elements (VEs) with uniform properties, each with one temperature, and empirical and theoretical correlations allowed for modeling their energetic interaction, thus producing ordinary differential equations (ODEs) temperatures versus time system. The cabinet (2048\u2009mm\u2009\u00d7\u20091974\u2009mm\u2009\u00d7\u2009850\u2009mm) thermal response with one heat source was measured. Data set 1 with a 1.6-kW power source was used for model adjustment by solving an inverse problem of parameter estimation (IPPE) having the cabinet internal average air velocities as adjustment parameters. Data set 2 obtained with a 3-kW power source validated model results. The converged mesh had a total of 7500 VE. The steady-state solution took between 16 and 19\u2009s of CPU time to reach convergence and less than 3\u2009min to obtain the 6500-s cabinet dynamic response under variable loading conditions, in an Intel CORE i7 computer. After validation, the model was used to study the impact of heat source height on system thermal response. Fundamentally, a sharp minimum junction temperature T\n                    <jats:sub>jct,min<\/jats:sub>\n                    \u2009=\u200998.5\u2009\u00b0C was obtained in the system hot spot at an optimal heat source height, which was 25.7\u2009\u00b0C less than the highest calculated value within the investigated range (0.1\u2009m\u2009&lt;\u2009z\n                    <jats:sub>jct<\/jats:sub>\n                    \u2009&lt;\u20091.66\u2009m) for the 1.6-kW power setting, which characterizes the novelty of the research, and is worth to be pursued, no matter how complex the actual cabinet design may be.\n                  <\/jats:p>","DOI":"10.1177\/00375497211069979","type":"journal-article","created":{"date-parts":[[2022,1,16]],"date-time":"2022-01-16T13:12:15Z","timestamp":1642338735000},"page":"711-725","update-policy":"https:\/\/doi.org\/10.1177\/sage-journals-update-policy","source":"Crossref","is-referenced-by-count":1,"title":["Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering"],"prefix":"10.1177","volume":"98","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1458-2908","authenticated-orcid":false,"given":"Jos\u00e9 V C","family":"Vargas","sequence":"first","affiliation":[{"name":"Graduate Program in Mechanical Engineering, PGMEC, Department of Mechanical Engineering, and Sustainable Energy Research and Development Center, NPDEAS, Universidade Federal do Paran\u00e1 (UFPR), Brazil"},{"name":"Department of Mechanical Engineering, Energy and Sustainability Center and Center for Advanced Power Systems, Florida State University, USA"},{"name":"Graduate Program in Materials Science Engineering, PIPE, and Sustainable Energy Research and Development Center, NPDEAS, Universidade Federal do Paran\u00e1 (UFPR), Brazil"}]},{"given":"Sam","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Energy and Sustainability Center and Center for Advanced Power Systems, Florida State University, USA"}]},{"given":"Juan Carlos","family":"Ordonez","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Energy and Sustainability Center and Center for Advanced Power Systems, Florida State University, USA"}]},{"given":"Luiz F","family":"Rigatti","sequence":"additional","affiliation":[{"name":"Graduate Program in Mechanical Engineering, PGMEC, Department of Mechanical Engineering, and Sustainable Energy Research and Development Center, NPDEAS, Universidade Federal do Paran\u00e1 (UFPR), Brazil"}]},{"given":"Pedro H R","family":"Peixoto","sequence":"additional","affiliation":[{"name":"Graduate Program in Mechanical Engineering, PGMEC, Department of Mechanical Engineering, and Sustainable Energy Research and Development Center, NPDEAS, Universidade Federal do Paran\u00e1 (UFPR), Brazil"}]},{"given":"Wellington","family":"Balmant","sequence":"additional","affiliation":[{"name":"Graduate Program in Mechanical Engineering, PGMEC, Department of Mechanical Engineering, and Sustainable Energy Research and Development Center, NPDEAS, Universidade Federal do Paran\u00e1 (UFPR), Brazil"}]},{"given":"Andre B","family":"Mariano","sequence":"additional","affiliation":[{"name":"Graduate Program in Materials Science Engineering, PIPE, and Sustainable Energy Research and Development Center, NPDEAS, Universidade Federal do Paran\u00e1 (UFPR), Brazil"}]}],"member":"179","published-online":{"date-parts":[[2022,1,16]]},"reference":[{"key":"e_1_3_4_2_2","doi-asserted-by":"publisher","DOI":"10.2528\/PIERC18011204"},{"key":"e_1_3_4_3_2","doi-asserted-by":"publisher","DOI":"10.1002\/2017RS006515"},{"key":"e_1_3_4_4_2","doi-asserted-by":"publisher","DOI":"10.1049\/iet-map.2016.1141"},{"key":"e_1_3_4_5_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.icte.2016.04.001"},{"key":"e_1_3_4_6_2","doi-asserted-by":"publisher","DOI":"10.1002\/mop.29328"},{"key":"e_1_3_4_7_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.aeue.2015.04.017"},{"key":"e_1_3_4_8_2","doi-asserted-by":"publisher","DOI":"10.1002\/2017RS006313"},{"key":"e_1_3_4_9_2","doi-asserted-by":"publisher","DOI":"10.1002\/mmce.20956"},{"key":"e_1_3_4_10_2","doi-asserted-by":"publisher","DOI":"10.1002\/mop.29538"},{"key":"e_1_3_4_11_2","doi-asserted-by":"publisher","DOI":"10.1002\/mop.29191"},{"key":"e_1_3_4_12_2","doi-asserted-by":"publisher","DOI":"10.3390\/electronics10091050"},{"key":"e_1_3_4_13_2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3085949"},{"key":"e_1_3_4_14_2","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2020.3043380"},{"key":"e_1_3_4_15_2","first-page":"427","article-title":"Modeling and simulation of the thermal and psychrometric transient response of all-electric ships, internal compartments and cabinets","volume":"84","author":"Ordonez JC","year":"2008","unstructured":"Ordonez JC, Vargas JVC, Hovsapian R. Modeling and simulation of the thermal and psychrometric transient response of all-electric ships, internal compartments and cabinets. Simul Trans Soc Model Simul Int 2008; 84: 427\u2013439.","journal-title":"Simul Trans Soc Model Simul Int"},{"key":"e_1_3_4_16_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2013.07.005"},{"key":"e_1_3_4_17_2","first-page":"1116","article-title":"Notional all-electric ship systems integration thermal simulation and visualization","volume":"88","author":"Vargas JVC","year":"2012","unstructured":"Vargas JVC, Souza JA, Hovsapian R, et al. Notional all-electric ship systems integration thermal simulation and visualization. Simul Trans Soc Model Simul Int 2012; 88: 1116\u20131128.","journal-title":"Simul Trans Soc Model Simul Int"},{"key":"e_1_3_4_18_2","volume-title":"Proceedings of the 20th international workshop on thermal investigations of ICs and systems (THERMINIC 2014)","author":"Shahjalal M","unstructured":"Shahjalal M, Lu H, Bailey C. A review of the computer based simulation of electro-thermal design of power electronics devices. In: Proceedings of the 20th international workshop on thermal investigations of ICs and systems (THERMINIC 2014), Greenwich, 24\u201326 September 2014."},{"key":"e_1_3_4_19_2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2793300"},{"key":"e_1_3_4_20_2","volume-title":"Proceedings of the 5th IEEE vehicle power and propulsion conference (VPPC\u201909)","author":"Nakayama W","unstructured":"Nakayama W, Suzuki O, Hara Y. Thermal management of electronic and electrical devices in automobile environment. In: Proceedings of the 5th IEEE vehicle power and propulsion conference (VPPC\u201909), Dearborn, MI, 7\u201310 September 2009."},{"key":"e_1_3_4_21_2","volume-title":"Proceedings of the IECON 2015: 41st annual conference of the IEEE industrial electronics society","author":"Abebe R","unstructured":"Abebe R, Vakil G, Lo Calzo G, et al. FEA based thermal analysis of various topologies for integrated motor drives (IMD). In: Proceedings of the IECON 2015: 41st annual conference of the IEEE industrial electronics society, Yokohama, Japan, 9\u201312 November 2015."},{"key":"e_1_3_4_22_2","doi-asserted-by":"publisher","DOI":"10.1115\/1.4043404"},{"key":"e_1_3_4_23_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.paerosci.2018.06.004"},{"key":"e_1_3_4_24_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2018.02.014"},{"key":"e_1_3_4_25_2","doi-asserted-by":"publisher","DOI":"10.1016\/j.apenergy.2018.04.072"},{"key":"e_1_3_4_26_2","doi-asserted-by":"publisher","DOI":"10.1115\/1.1348337"},{"key":"e_1_3_4_27_2","doi-asserted-by":"publisher","DOI":"10.1086\/498426"},{"key":"e_1_3_4_28_2","volume-title":"Chapter 17: handbook of numerical heat transfer","author":"Minkowycz WJ","year":"2006","unstructured":"Minkowycz WJ, Sparrow EM, Schneider GE, et al. Chapter 17: handbook of numerical heat transfer. 2nd ed. New York: Wiley, 2006.","edition":"2"},{"key":"e_1_3_4_29_2","volume-title":"Numerical analysis","author":"Kincaid D","year":"1991","unstructured":"Kincaid D, Cheney W. Numerical analysis. Belmont, CA: Wadsworth, 1991."},{"key":"e_1_3_4_30_2","doi-asserted-by":"publisher","DOI":"10.1115\/1.2911449"},{"key":"e_1_3_4_31_2","doi-asserted-by":"publisher","DOI":"10.1115\/1.2910670"},{"key":"e_1_3_4_32_2","doi-asserted-by":"publisher","DOI":"10.1002\/9780470377963"},{"key":"e_1_3_4_33_2","volume-title":"Heat transfer","author":"Bejan A","year":"1993","unstructured":"Bejan A. Heat transfer. New York: Wiley, 1993."},{"key":"e_1_3_4_34_2","volume-title":"VisIt 1.11.1 manual","author":"Lawrence Livermore National Laboratory","year":"2008","unstructured":"Lawrence Livermore National Laboratory. VisIt 1.11.1 manual. Livermore, CA: Lawrence Livermore National Laboratory, 2008."},{"key":"e_1_3_4_35_2","volume-title":"Thermal and power management of integrated circuits (integrated circuits and systems)","author":"Vassighi A","year":"2006","unstructured":"Vassighi A, Sachdev M. Thermal and power management of integrated circuits (integrated circuits and systems). New York: Springer, 2006."},{"key":"e_1_3_4_36_2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2357836"},{"key":"e_1_3_4_37_2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.807991"},{"key":"e_1_3_4_38_2","doi-asserted-by":"publisher","DOI":"10.1002\/er.3209"},{"key":"e_1_3_4_39_2","volume-title":"Proceedings of the 11th intersociety conference on thermal and thermomechanical phenomena in electronic systems","author":"Nie Q","unstructured":"Nie Q, Joshi Y. Reduced order modeling of power electronics cabinet with double-sided cooling. In: Proceedings of the 11th intersociety conference on thermal and thermomechanical phenomena in electronic systems, Orlando, FL, 28\u201331 May 2008."}],"container-title":["SIMULATION"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/journals.sagepub.com\/doi\/pdf\/10.1177\/00375497211069979","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/journals.sagepub.com\/doi\/full-xml\/10.1177\/00375497211069979","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/journals.sagepub.com\/doi\/pdf\/10.1177\/00375497211069979","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T11:31:46Z","timestamp":1777635106000},"score":1,"resource":{"primary":{"URL":"https:\/\/journals.sagepub.com\/doi\/10.1177\/00375497211069979"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,1,16]]},"references-count":38,"journal-issue":{"issue":"8","published-print":{"date-parts":[[2022,8]]}},"alternative-id":["10.1177\/00375497211069979"],"URL":"https:\/\/doi.org\/10.1177\/00375497211069979","relation":{},"ISSN":["0037-5497","1741-3133"],"issn-type":[{"value":"0037-5497","type":"print"},{"value":"1741-3133","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,1,16]]}}}