{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,4]],"date-time":"2025-06-04T15:31:19Z","timestamp":1749051079017,"version":"3.40.5"},"reference-count":23,"publisher":"SAGE Publications","issue":"5","license":[{"start":{"date-parts":[[2021,5,1]],"date-time":"2021-05-01T00:00:00Z","timestamp":1619827200000},"content-version":"unspecified","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100008843","name":"zhejiang ocean university","doi-asserted-by":"publisher","award":["2019JZ00004"],"award-info":[{"award-number":["2019JZ00004"]}],"id":[{"id":"10.13039\/501100008843","id-type":"DOI","asserted-by":"publisher"}]},{"name":"young and middle-aged discipline leaders of Zhejiang Province"},{"DOI":"10.13039\/501100011491","name":"bureau of science and technology of zhoushan","doi-asserted-by":"publisher","award":["2018C21014"],"award-info":[{"award-number":["2018C21014"]}],"id":[{"id":"10.13039\/501100011491","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["journals.sagepub.com"],"crossmark-restriction":true},"short-container-title":["International Journal of Distributed Sensor Networks"],"published-print":{"date-parts":[[2021,5]]},"abstract":"<jats:p> Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time\u2013frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner\u2013Ville distribution and empirical mode decomposition methods, the features of bonding electrical signals were extracted. Then, the principal component analysis method was further used for feature selection. Finally, an artificial neural network was built to recognize and detect the quality of ultrasonic wire bonding. The results showed that the average recognition accuracy of Wigner\u2013Ville distribution and empirical mode decomposition was 78% and 93%, respectively. The recognition accuracy of empirical mode decomposition is obviously higher than that of the Wigner\u2013Ville distribution method. In general, using the time\u2013frequency analysis method to classify and identify the fault bonds improved the quality of the wire-bonding products. <\/jats:p>","DOI":"10.1177\/15501477211018346","type":"journal-article","created":{"date-parts":[[2021,5,21]],"date-time":"2021-05-21T06:32:19Z","timestamp":1621578739000},"page":"155014772110183","update-policy":"https:\/\/doi.org\/10.1177\/sage-journals-update-policy","source":"Crossref","is-referenced-by-count":9,"title":["Application research on the time\u2013frequency analysis method in the quality detection of ultrasonic wire bonding"],"prefix":"10.1177","volume":"17","author":[{"given":"Wuwei","family":"Feng","sequence":"first","affiliation":[{"name":"School of Marine Engineer Equipment, Zhejiang Ocean University, Zhoushan, China"},{"name":"Dong hai Institute of Science and Technology, Zhejiang Ocean University, Zhoushan, 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