{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,21]],"date-time":"2026-02-21T20:08:55Z","timestamp":1771704535006,"version":"3.50.1"},"reference-count":29,"publisher":"Walter de Gruyter GmbH","issue":"6","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2020,11,18]]},"abstract":"<jats:title>Abstract<\/jats:title>\n               <jats:p>The present work proposes a novel, compact, intuitively simple and efficient structure to improve the sensitivity of a microelectromechanical system (MEMS) capacitive accelerometer using an arrangement of microlever as a displacement amplifier. The accelerometer is proposed to serve as a microphone in the fully implantable cochlear prosthetic system which can be surgically implanted at the middle ear bone structure. Therefore, the design parameters such as size, weight and resonant frequency require deliberation. The paper presents a novel analytical model considering the impact of the mechanical amplification along with the width of the microlever and the capacitive fringe effects on the performance of the sensor. The design is simulated and verified using COMSOL MULTIPHYSICS 4.2. The accelerometer is designed within a sensing area of 1\u00a0mm<jats:sup>2<\/jats:sup> and accomplishes a nominal capacitance of 4.85\u00a0pF and an excellent sensitivity of 5.91\u00a0fF\/g.<\/jats:p>","DOI":"10.1515\/bmt-2017-0183","type":"journal-article","created":{"date-parts":[[2020,7,10]],"date-time":"2020-07-10T12:33:49Z","timestamp":1594384429000},"page":"735-746","source":"Crossref","is-referenced-by-count":2,"title":["A microelectromechanical system (MEMS) capacitive accelerometer-based microphone with enhanced sensitivity for fully implantable hearing aid: a novel analytical approach"],"prefix":"10.1515","volume":"65","author":[{"given":"Apoorva","family":"Dwivedi","sequence":"first","affiliation":[{"name":"Electronics and Communications Engineering Department , NIT Hamirpur , Hamirpur , Himachal Pradesh , India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gargi","family":"Khanna","sequence":"additional","affiliation":[{"name":"Electronics and Communications Engineering Department , NIT Hamirpur , Hamirpur , Himachal Pradesh , India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"374","published-online":{"date-parts":[[2020,7,3]]},"reference":[{"key":"2023033113553610142_j_bmt-2017-0183_ref_001","doi-asserted-by":"crossref","unstructured":"Wang, D. Deep learning reinvents the hearing aid. IEEE Spect 2017;54:32\u20137. https:\/\/doi.org\/10.1109\/mspec.2017.7864754.","DOI":"10.1109\/MSPEC.2017.7864754"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_002","doi-asserted-by":"crossref","unstructured":"Varshney, S. Deafness in India. Indian J Otol 2016;22:73. https:\/\/doi.org\/10.4103\/0971-7749.182281.","DOI":"10.4103\/0971-7749.182281"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_003","doi-asserted-by":"crossref","unstructured":"Zeng, FG, Rebscher, S, Harrison, W, Sun, X, Feng, H. Cochlear implants: system design, integration, and evaluation. IEEE Rev Biomed Eng 2008;1:115\u201342. https:\/\/doi.org\/10.1109\/rbme.2008.2008250.","DOI":"10.1109\/RBME.2008.2008250"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_004","doi-asserted-by":"crossref","unstructured":"Zhao, Y, Dawant, BM, Noble, JH. Automatic selection of the active electrode set for image-guided cochlear implant programming. J Med Imaging 2016;3:035001. https:\/\/doi.org\/10.1117\/1.jmi.3.3.035001.","DOI":"10.1117\/1.JMI.3.3.035001"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_005","doi-asserted-by":"crossref","unstructured":"Haynes, DS, Young, JA, Wanna, GB, GlasscockIIIME. Middle ear implantable hearing devices: an overview. Trends Amplif 2009;13:206\u201314. https:\/\/doi.org\/10.1177\/1084713809346262.","DOI":"10.1177\/1084713809346262"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_006","doi-asserted-by":"crossref","unstructured":"Federspil, PA, Plinkert, PK. Restoring Hearing with Active Hearing Implants\/Wiederherstellung des Geh\u00f6rs mit aktiven H\u00f6rimplantaten. Biomed Tech 2004;49:78\u201382. https:\/\/doi.org\/10.1515\/bmt.2004.016.","DOI":"10.1515\/BMT.2004.016"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_007","doi-asserted-by":"crossref","unstructured":"Zenner, HP, Leysieffer, H. Total implantation of the implex TICA hearing amplifier implant for high-frequency sensorineural hearing loss: the t\u00fcbingen university experience. Otolaryng Clin N Am 2001;34:417\u201346. https:\/\/doi.org\/10.1016\/S0030-6665(05)70340-6.","DOI":"10.1016\/S0030-6665(05)70340-6"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_008","doi-asserted-by":"crossref","unstructured":"Leysieffer, H, Baumann, JW, Mayer, R, M\u00fcller, D, M\u00fcller, G, Sch\u00f6n, T, et al. A totally implantable hearing aid for inner ear deafness: TICA LZ 3001 HNO 1998;46:853\u201363. https:\/\/doi.org\/10.1007\/s001060050325.","DOI":"10.1007\/s001060050325"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_009","doi-asserted-by":"crossref","unstructured":"Briggs, RJ, Eder, HC, Seligman, PM, Cowan, RS, Plant, KL, Dalton, J, et al. Initial clinical experience with a totally implantable cochlear implant research device. Otol Neurotol 2008;29:114\u20139. https:\/\/doi.org\/10.1097\/mao.0b013e31814b242f.","DOI":"10.1097\/MAO.0b013e31814b242f"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_010","doi-asserted-by":"crossref","unstructured":"Bruschini, L, Forli, F, Santoro, A, Bruschini, P, Berrettini, S. Fully implantable Otologics MET CarinaTM device for the treatment of sensorineural hearing loss. Preliminary surgical and clinical results. Acta Otorhinolaryngol Ital 2009;29:79. https:\/\/doi.org\/10.3109\/00016481003671244.","DOI":"10.3109\/00016481003671244"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_011","doi-asserted-by":"crossref","unstructured":"Pulcherio, JO, Bittencourt, AG, Burke, PR, da Costa Monsanto, R, de Brito, R, Tsuji, RK, et al. Carina\u00ae and Esteem\u00ae: a systematic review of fully implantable hearing devices. PLoS One 2014;9:e110636. https:\/\/doi.org\/10.1371\/journal.pone.0110636.","DOI":"10.1371\/journal.pone.0110636"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_012","doi-asserted-by":"crossref","unstructured":"Kraus, EM, Shohet, JA, Catalano, PJ. Envoy Esteem totally implantable hearing system: phase 2 trial, 1-year hearing results. Otolaryngol Head Neck Surg 2011;145:100\u20139. https:\/\/doi.org\/10.1177\/0194599811401709.","DOI":"10.1177\/0194599811401709"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_013","doi-asserted-by":"crossref","unstructured":"Memari, F, Asghari, A, Daneshi, A, Jalali, A. Safety and patient selection of totally implantable hearing aid surgery: envoy system, esteem. Eur Arch Otorhinolaryngol 2011;268:1421\u20135. https:\/\/doi.org\/10.1007\/s00405-011-1507-0.","DOI":"10.1007\/s00405-011-1507-0"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_014","doi-asserted-by":"crossref","unstructured":"Ko, WH, Zhang, R, Huang, P, Guo, J, Ye, X, Young, DJ, et al. Studies of MEMS acoustic sensors as implantable microphones for totally implantable hearing-aid systems. IEEE Trans Biomed Circuits Syst 2009;3:277\u201385. https:\/\/doi.org\/10.1109\/tbcas.2009.2032267.","DOI":"10.1109\/TBCAS.2009.2032267"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_015","doi-asserted-by":"crossref","unstructured":"Zurcher, MA, Semaan, M, Megerian, CA, Ko, WH, Young, DJ. A MEMS capacitive accelerometer design as middle ear microphone based on ossicular chain micromechanic characterization at umbo for fully implantable cochlear prosthesis. Sensor Mater 2010;22:297\u2013312. https:\/\/doi.org\/10.18494\/SAM.2010.629.","DOI":"10.18494\/SAM.2010.629"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_016","doi-asserted-by":"crossref","unstructured":"Young, DJ, Zurcher, MA, Semaan, M, Megerian, CA, Ko, WH. MEMS capacitive accelerometer-based middle ear microphone. IEEE Trans Biomed Eng 2012;59:3283\u201392. https:\/\/doi.org\/10.1109\/tbme.2012.2195782.","DOI":"10.1109\/TBME.2012.2195782"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_017","doi-asserted-by":"crossref","unstructured":"Yip, M, Jin, R, Nakajima, HH, Stankovic, KM, Chandrakasan, AP. A fully-implantable cochlear implant SoC with piezoelectric middle-ear sensor and arbitrary waveform neural stimulation. IEEE J Solid-State Circuits 2015;50:214\u201329. https:\/\/doi.org\/10.1109\/jssc.2014.2355822.","DOI":"10.1109\/JSSC.2014.2355822"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_018","doi-asserted-by":"crossref","unstructured":"Park, WT, O\u2019Connor, KN, Chen, KL, Mallon, JR, Maetani, T, Dalal, P, et al. Ultraminiature encapsulated accelerometers as a fully implantable sensor for implantable hearing aids. Biomed Microdevices 2007;9:939\u201349. https:\/\/doi.org\/10.1007\/s10544-007-9072-4.","DOI":"10.1007\/s10544-007-9072-4"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_019","doi-asserted-by":"crossref","unstructured":"Woo, ST, Shin, DH, Lim, HG, Seong, KW, Gottlieb, P, Puria, S, et al. A new trans-tympanic microphone approach for fully implantable hearing devices. Sensors 2015;15:22798\u2013810. https:\/\/doi.org\/10.3390\/s150922798.","DOI":"10.3390\/s150922798"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_020","doi-asserted-by":"crossref","unstructured":"Koch, M, E\u00dfinger, TM, Stoppe, T, Lasurashvili, N, Bornitz, M, Zahnert, T. Fully implantable hearing aid in the incudostapedial joint gap. Hear Res 2016;340:169\u201378. https:\/\/doi.org\/10.1016\/j.heares.2016.03.015.","DOI":"10.1016\/j.heares.2016.03.015"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_021","doi-asserted-by":"crossref","unstructured":"Liu, H, Cheng, J, Yang, J, Rao, Z, Cheng, G, Yang, S, et al. Concept and evaluation of a new piezoelectric transducer for an implantable middle ear hearing device. Sensors 2017;17:2515. https:\/\/doi.org\/10.3390\/s17112515.","DOI":"10.3390\/s17112515"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_022","doi-asserted-by":"crossref","unstructured":"Krishnan, G, Ananthasuresh, GK. Evaluation and design of displacement-amplifying compliant mechanisms for sensor applications. J Mech Des 2008;130:102304. https:\/\/doi.org\/10.1115\/1.2965599.","DOI":"10.1115\/1.2965599"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_023","doi-asserted-by":"crossref","unstructured":"Khan, S, Ananthasuresh, GK. Improving the sensitivity and bandwidth of in-plane capacitive microaccelerometers using compliant mechanical amplifiers. J Microelectromech Syst 2014;23:871\u201387. https:\/\/doi.org\/10.1109\/jmems.2014.2300231.","DOI":"10.1109\/JMEMS.2014.2300231"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_024","doi-asserted-by":"crossref","unstructured":"Bolzmacher, C, Bauer, K, Schmid, U, Hafez, M, Seidel, H. Displacement amplification of piezoelectric microactuators with a micromachined leverage unit. Sens Actuators A Phys 2010;157:61\u20137. https:\/\/doi.org\/10.1016\/j.sna.2009.10.014.","DOI":"10.1016\/j.sna.2009.10.014"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_025","doi-asserted-by":"crossref","unstructured":"Su, XP, Yang, HS. Single-stage microleverage mechanism optimization in a resonant accelerometer. Struct Multidiscipl Optim 2001;21:246\u201352. https:\/\/doi.org\/10.1007\/s001580050189.","DOI":"10.1007\/s001580050189"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_026","doi-asserted-by":"crossref","unstructured":"Su, XP, Yang, HS. Two-stage compliant microleverage mechanism optimization in a resonant accelerometer. Struct Multidiscipl Optim 2001;22:328\u201334. https:\/\/doi.org\/10.1007\/s00158-001-0153-3.","DOI":"10.1007\/s00158-001-0153-3"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_027","doi-asserted-by":"crossref","unstructured":"Zeimpekis, I, Sari, I, Kraft, M. Characterization of a mechanical motion amplifier applied to a MEMS accelerometer. J Microelectromech Syst 2012; 21:1032\u201342. https:\/\/doi.org\/10.1109\/jmems.2012.2196491.","DOI":"10.1109\/JMEMS.2012.2196491"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_028","doi-asserted-by":"crossref","unstructured":"Zeimpekis, I, Sari, I, Kraft, M. Deflection amplification mechanism in a capacitive accelerometer. In: 16th international solid-state sensors, actuators and microsystems conference (ICSSSAM), 2011. IEEE, Beijing, China; 2011.","DOI":"10.1109\/TRANSDUCERS.2011.5969184"},{"key":"2023033113553610142_j_bmt-2017-0183_ref_029","doi-asserted-by":"crossref","unstructured":"Catal\u00e1n Izquierdo, S, Bueno Barrachina, JM, Ca\u00f1as Pe\u00f1uelas, CS, Cavall\u00e9 Ses\u00e9, F. Capacitance evaluation on parallel-plate capacitors by means of finite element analysis. Renew Energy Power Qual J 2009;1:613\u20136. https:\/\/doi.org\/10.24084\/repqj07.451.","DOI":"10.24084\/repqj07.451"}],"container-title":["Biomedical Engineering \/ Biomedizinische Technik"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.degruyter.com\/view\/journals\/bmte\/65\/6\/article-p735.xml","content-type":"text\/html","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.degruyter.com\/document\/doi\/10.1515\/bmt-2017-0183\/xml","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/www.degruyter.com\/document\/doi\/10.1515\/bmt-2017-0183\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,3,31]],"date-time":"2023-03-31T19:45:21Z","timestamp":1680291921000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.degruyter.com\/document\/doi\/10.1515\/bmt-2017-0183\/html"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,7,3]]},"references-count":29,"journal-issue":{"issue":"6","published-online":{"date-parts":[[2020,6,29]]},"published-print":{"date-parts":[[2020,11,18]]}},"alternative-id":["10.1515\/bmt-2017-0183"],"URL":"https:\/\/doi.org\/10.1515\/bmt-2017-0183","relation":{},"ISSN":["0013-5585","1862-278X"],"issn-type":[{"value":"0013-5585","type":"print"},{"value":"1862-278X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,7,3]]}}}