{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T02:40:04Z","timestamp":1751078404949,"version":"3.41.0"},"reference-count":31,"publisher":"ASTM International","issue":"3","content-domain":{"domain":["asmedigitalcollection.asme.org"],"crossmark-restriction":true},"short-container-title":[],"published-print":{"date-parts":[[2016,5,1]]},"abstract":"<jats:title>Abstract<\/jats:title>\n               <jats:p>Aerospace applications have an increasing demand for strong and reliable adhesives, able to withstand large temperature gradients. The variation of the adhesive\u2019s mechanical properties with temperature is therefore one of the factors that must be well understood before safe and reliable adhesive joints can be designed for these applications. The stress\u2013strain curve and the toughness properties of an adhesive show strong dependency with temperature for most adhesives, especially near the glass transition temperature (Tg). In this work, an experimental procedure is undertaken to evaluate the effect of low temperatures on the adhesive strength and mode I fracture toughness of a room temperature vulcanizing silicone (RTV) adhesive. Firstly, the temperature at which the glass transition of the RTV occurs was obtained by means of an in-house developed measurement apparatus. Bulk specimens were manufactured and tested at temperatures above and below the Tg in order to obtain a strength envelope of the adhesive over this large temperature range. Single lap joints were also manufactured with this adhesive to assess the behaviour of the adhesive when assembled in a complete joint. For the determination of pure mode I fracture toughness, double cantilever beam specimens were also tested at negative temperatures near Tg. The results showed that the failure loads of all the tests performed have strong temperature dependence and this must be taken into account during adhesive joint design using this type of adhesives.<\/jats:p>","DOI":"10.1520\/jte20140208","type":"journal-article","created":{"date-parts":[[2015,1,21]],"date-time":"2015-01-21T06:23:34Z","timestamp":1421821414000},"page":"1284-1293","update-policy":"https:\/\/doi.org\/10.1115\/crossmarkpolicy-asme","source":"Crossref","is-referenced-by-count":5,"title":["Effect of Low Temperature on Tensile Strength and Mode I Fracture Energy of a Room Temperature Vulcanizing Silicone Adhesive"],"prefix":"10.1520","volume":"44","author":[{"given":"E. A. S.","family":"Marques","sequence":"first","affiliation":[{"name":"Instituto de Engenharia Mec\u00e2nica (IDMEC) 1 , Rua Dr. Roberto Frias, 4200-465Porto, PT ."}]},{"given":"M. D.","family":"Banea","sequence":"additional","affiliation":[{"name":"Instituto de Engenharia Mec\u00e2nica (IDMEC) 1 , Rua Dr. Roberto Frias, 4200-465Porto, PT ."}]},{"given":"Lucas F. M.","family":"da Silva","sequence":"additional","affiliation":[{"name":"Departamento de Engenharia Mec\u00e2nica, Faculdade de Engenharia, Universidade do Porto 2 , Rua Dr. Roberto Frias, 4200-465Porto, PT"}]},{"given":"R. J. C.","family":"Carbas","sequence":"additional","affiliation":[{"name":"Instituto de Engenharia Mec\u00e2nica (IDMEC) 1 , Rua Dr. Roberto Frias, 4200-465Porto, PT ."}]},{"given":"C.","family":"Sato","sequence":"additional","affiliation":[{"name":"Precision and Intelligence Laboratory, Tokyo Institute of Technology 3 , 4259 Nagatsuta, Midori-ku, Yokohama226-8503, JP ."}]}],"member":"381","published-online":{"date-parts":[[2016,7,13]]},"reference":[{"key":"2025062722073227600_c1","unstructured":"NASA Kennedy Space Center, NSTS\n          \n          1988\n          , News Reference Manual, http:\/\/science.ksc.nasa.gov\/shuttle\/technology\/sts-newsref\/stsref-toc.html#sts-tps (Last accessed 1 Jan 2014)."},{"issue":"5","key":"2025062722073227600_c2","doi-asserted-by":"crossref","first-page":"471","DOI":"10.1002\/mawe.201100809","article-title":"Experimental Study of Silicone-Epoxy Dual Adhesive Joints for High Temperature Aerospace Applications","volume":"42","author":"Marques","year":"2011","journal-title":"Mat. Wiss u. Werkstofftech."},{"volume-title":"Development of Silicone Adhesive Formulations for Thermal Protection Systems","year":"1972","author":"Hockenridge","key":"2025062722073227600_c3"},{"key":"2025062722073227600_c4","first-page":"31","article-title":"Testing of RTV Silicone Adhesives for High Temperature Applications","volume":"21","author":"Banea","year":"2010","journal-title":"Ann. \u201cDunarea de Jos\u201d Univ. Galati Fascicle XII, Weld. Equp. Technol., Year XXI"},{"key":"2025062722073227600_c5","volume-title":"Handbook of Adhesives and Sealants","author":"Petrie","year":"2007","edition":"2nd ed."},{"issue":"5","key":"2025062722073227600_c6","doi-asserted-by":"crossref","first-page":"325","DOI":"10.1002\/mawe.201000605","article-title":"Static and Fatigue Behaviour of Room Temperature Vulcanizing Silicone Adhesives for High Temperature Aerospace Applications","volume":"41","author":"Banea","year":"2010","journal-title":"Mat. wiss. u. Werkstofftech"},{"issue":"11\u201312","key":"2025062722073227600_c7","first-page":"2011","article-title":"Temperature Dependence of the Fracture Toughness of Adhesively Bonded Joints","volume":"24","author":"Banea","year":"2011","journal-title":"J. Adhes. Sci. Technol."},{"issue":"4\u20135","key":"2025062722073227600_c8","doi-asserted-by":"crossref","first-page":"261","DOI":"10.1080\/00218460902881808","article-title":"Mechanical Characterization of Flexible Adhesives","volume":"85","author":"Banea","year":"2009","journal-title":"J. Adhes."},{"issue":"15","key":"2025062722073227600_c9","doi-asserted-by":"crossref","first-page":"1291","DOI":"10.1163\/156856105774784385","article-title":"Assessment and Prediction of Long-Term Mechanical Properties of Adhesives With High Plasticity","volume":"19","author":"Geiss","year":"2005","journal-title":"J. Adhes. Sci. 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Adhes."},{"issue":"15","key":"2025062722073227600_c13","doi-asserted-by":"crossref","first-page":"1705","DOI":"10.1163\/156856106779024436","article-title":"Stress Free Temperature in a Mixed Adhesive Joint","volume":"20","author":"da Silva","year":"2006","journal-title":"J. Adhes. Sci. Technol."},{"key":"2025062722073227600_c14","doi-asserted-by":"crossref","first-page":"415","DOI":"10.1007\/978-3-642-01169-6_18","article-title":"Thermal Properties of Adhesives","volume-title":"Handbook of Adhesion Technology","author":"Comyn","year":"2011"},{"issue":"10","key":"2025062722073227600_c15","doi-asserted-by":"crossref","first-page":"785","DOI":"10.1080\/00218464.2013.763677","article-title":"A Rapid Method for Measuring the Glass Transition Temperature Using a Novel Dynamic Mechanical Analysis Method","volume":"89","author":"Zhang","year":"2013","journal-title":"J. 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Adhes."},{"key":"2025062722073227600_c20","article-title":"Standard Test Method for Fracture Strength in Cleavage of Adhesives in Bonded Metal Joints","volume-title":"Annual Book of ASTM Standards","author":"ASTM D3433-99","year":"2012"},{"volume-title":"Adhesives\u2014Determination of the Mode I Adhesive Fracture Energy GIC of Structural Adhesive Joints Using Double Cantilever Beam and Tapered Double Beam Specimens","year":"2009","author":"ISO 25217:2009","key":"2025062722073227600_c21"},{"issue":"10\u201311","key":"2025062722073227600_c22","doi-asserted-by":"crossref","first-page":"2224","DOI":"10.1016\/j.compscitech.2008.04.003","article-title":"Crack Equivalent Concept Applied to the Fracture Characterization of Bonded Joints Under Pure Mode I Loading","volume":"68","author":"de Moura","year":"2008","journal-title":"Compos. Sci. 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