{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T04:57:36Z","timestamp":1648789056631},"reference-count":12,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"14","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2015]]},"DOI":"10.1587\/elex.12.20150480","type":"journal-article","created":{"date-parts":[[2015,7,1]],"date-time":"2015-07-01T18:03:32Z","timestamp":1435773812000},"page":"20150480-20150480","source":"Crossref","is-referenced-by-count":0,"title":["Green phase difference coding with low switching activity for Network-on-Chip"],"prefix":"10.1587","volume":"12","author":[{"given":"Yi","family":"Liu","sequence":"first","affiliation":[{"name":"School of Microeletronics, Xidian University"}]},{"given":"Changqing","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Microeletronics, Xidian University"}]},{"given":"Shuai","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Microeletronics, Xidian University"}]},{"given":"YinTang","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Microeletronics, Xidian University"}]},{"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microeletronics, Xidian University"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"publisher","unstructured":"[1] M. B. Taylor, J. Kim, J. Miller, D. Wentzlaff, F. Ghodrat, B. Greenwald, H. Hoffman, P. Johnson, J.-W. Lee, W. Lee, A. Ma, A. Saraf, M. Seneski, N. Shnidman, V. Strumpen, M. Frank, S. Amarasinghe and A. Agarwal: IEEE Micro <b>22<\/b> [2] (2002) 25. DOI:10.1109\/MM.2002.997877","DOI":"10.1109\/MM.2002.997877"},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] P. Gratz, C. Kim, K. Sankaralingam, H. Hanson, P. Shivakumar, S. W. Keckler and D. Burger: IEEE Micro <b>27<\/b> [5] (2007) 41. DOI:10.1109\/MM.2007.4378782","DOI":"10.1109\/MM.2007.4378782"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] K. Lee, S.-J. Lee, S.-E. Kim, H.-M. Choi, D. Kim, S. Kim, M.-W. Lee and H.-J. Yoo: ISSCC Dig. Tech. Papers (2004) 152. DOI:10.1109\/ISSCC.2004.1332639","DOI":"10.1109\/ISSCC.2004.1332639"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] Y. Shin, S. I. Chae and K. Choi: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>9<\/b> (2001) 377. DOI:10.1109\/92.924059","DOI":"10.1109\/92.924059"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] R. B. Lin and C. M. Tsai: VLSI Dig. Tech. Papers (2002) 121. DOI:10.1109\/ASPDAC.2002.994897","DOI":"10.1109\/ASPDAC.2002.994897"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] M. Shafaei, A. Patooghy and S. G. Miremadi: DSD Dig. Tech. Papers (2011) 55. DOI:10.1109\/DSD.2011.12","DOI":"10.1109\/DSD.2011.12"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] P. T. Huang, W. L. Fang, Y. L. Wang and W. Hwang: NoCS Dig. Tech. Papers (2008) 77. DOI:10.1109\/NOCS.2008.4492727","DOI":"10.1109\/NOCS.2008.4492727"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] C. T. Chiu, W. C. Huang, C. H. Lin, W. C. Lai and Y. F. Tsao: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>21<\/b> (2013) 1797. DOI:10.1109\/TVLSI.2012.2219888","DOI":"10.1109\/TVLSI.2012.2219888"},{"key":"9","unstructured":"[9] Z. Zhang and Y. Chang: Electronics&amp;Packaging <b>7<\/b> [10] (2007) 33."},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] S. R. Sridhara and N. R. Shanbhag: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>13<\/b> (2005) 655. DOI:10.1109\/TVLSI.2005.848816","DOI":"10.1109\/TVLSI.2005.848816"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] J. Sun and A. Jiang: ICCRD Dig. Tech. Papers (2011) 452. DOI:10.1109\/ICCRD.2011.5764172","DOI":"10.1109\/ICCRD.2011.5764172"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] Y. Liu, S. Ma, Y. Yang and Z. Zhu: IEICE Electron. Express <b>11<\/b> (2014) 20140038. DOI:10.1587\/elex.11.20140038","DOI":"10.1587\/elex.11.20140038"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/12\/14\/12_12.20150480\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T10:54:19Z","timestamp":1498215259000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/12\/14\/12_12.20150480\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015]]},"references-count":12,"journal-issue":{"issue":"14","published-print":{"date-parts":[[2015]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.12.20150480","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015]]}}}