{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,2]],"date-time":"2022-04-02T20:42:10Z","timestamp":1648932130957},"reference-count":12,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"1","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2016]]},"DOI":"10.1587\/elex.12.20150872","type":"journal-article","created":{"date-parts":[[2015,12,13]],"date-time":"2015-12-13T22:13:52Z","timestamp":1450044832000},"page":"20150872-20150872","source":"Crossref","is-referenced-by-count":0,"title":["Embedded current amplifier compensation for three-stage amplifiers with large capacitive loads"],"prefix":"10.1587","volume":"13","author":[{"given":"Pengfei","family":"Liao","sequence":"first","affiliation":[{"name":"Analog IC Design Department, Acoustoelectric and Optoelectronic Corp., China Electronics Technology Group Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weizhong","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Electronic Engineering, Chongqing University of Posts and Telecommunications"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ping","family":"Luo","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luncai","family":"Liu","sequence":"additional","affiliation":[{"name":"Analog IC Design Department, Acoustoelectric and Optoelectronic Corp., China Electronics Technology Group Corporation"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"publisher","unstructured":"[1] Z. Yan, P. I. Mak, M. K. Law and R. P. Martins: IEEE J. Solid-State Circuits <b>48<\/b> (2013) 527. DOI:10.1109\/JSSC.2012.2229070","DOI":"10.1109\/JSSC.2012.2229070"},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] B. Rumberg and D. W. Graham: IEEE Trans. Circuits Syst. II, Exp. Briefs <b>59<\/b> (2012) 234. DOI:10.1109\/TCSII.2012.2188460","DOI":"10.1109\/TCSII.2012.2188460"},{"key":"3","doi-asserted-by":"publisher","unstructured":"[3] S. Guo and H. Lee: IEEE J. Solid-State Circuits <b>46<\/b> (2011) 452. DOI:10.1109\/JSSC.2010.2092994","DOI":"10.1109\/JSSC.2010.2092994"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] W. Qu, J. P. Im, H. S. Kim and G. H. Cho: ISSCC Dig. Tech. Papers (2014) 290. DOI:10.1109\/ISSCC.2014.6757438","DOI":"10.1109\/ISSCC.2014.6757438"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] Z. Yan, P. I. Mak, M. K. Law and R. P. Martins: Electron. Lett. <b>48<\/b> (2012) 624. DOI:10.1049\/el.2012.0711","DOI":"10.1049\/el.2012.0711"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] S. S. Chong and P. K. Chan: IEEE J. Solid-State Circuits <b>47<\/b> (2012) 2227. DOI:10.1109\/JSSC.2012.2194090","DOI":"10.1109\/JSSC.2012.2194090"},{"key":"7","doi-asserted-by":"publisher","unstructured":"[7] H. Aminzadeh, M. Danaie and W. A. Serdijn: Microelectronics J. <b>44<\/b> (2013) 1201. DOI:10.1016\/j.mejo.2013.08.004","DOI":"10.1016\/j.mejo.2013.08.004"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] P. Liao, P. Luo, B. Zhang and Z. J. Li: Microelectronics J. <b>44<\/b> (2013) 712. DOI:10.1016\/j.mejo.2013.04.008","DOI":"10.1016\/j.mejo.2013.04.008"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] P. Liao, P. Luo, S. Zhen and B. Zhang: Circuits Syst. Signal Process. <b>33<\/b> (2014) 287. DOI:10.1007\/s00034-013-9626-z","DOI":"10.1007\/s00034-013-9626-z"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] L. Zhang, Z. Chang, Y. Wang and Z. Yu: Electron. Lett. <b>49<\/b> (2013) 94. DOI:10.1049\/el.2012.3674","DOI":"10.1049\/el.2012.3674"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] X. Fan, C. Mishra and E. S\u00e1nchez-Sinencio: IEEE J. Solid-State Circuits <b>40<\/b> (2005) 584. DOI:10.1109\/JSSC.2005.843602","DOI":"10.1109\/JSSC.2005.843602"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] H. Lee and P. K. T. Mok: IEEE Trans. Circuits Syst. I, Reg. Papers <b>51<\/b> (2004) 1690. DOI:10.1109\/TCSI.2004.834514","DOI":"10.1109\/TCSI.2004.834514"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/1\/13_12.20150872\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T21:31:36Z","timestamp":1498253496000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/1\/13_12.20150872\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":12,"journal-issue":{"issue":"1","published-print":{"date-parts":[[2016]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.12.20150872","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016]]}}}