{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,3]],"date-time":"2022-04-03T18:24:13Z","timestamp":1649010253390},"reference-count":12,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"23","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2015]]},"DOI":"10.1587\/elex.12.20150873","type":"journal-article","created":{"date-parts":[[2015,11,18]],"date-time":"2015-11-18T22:02:26Z","timestamp":1447884146000},"page":"20150873-20150873","source":"Crossref","is-referenced-by-count":0,"title":["Line voltage compensation technology for AC-direct multiple-string LED drivers"],"prefix":"10.1587","volume":"12","author":[{"given":"Cong","family":"Liu","sequence":"first","affiliation":[{"name":"Institute of Electronic CAD, Xidian University"},{"name":"Key Lab of High Speed Circuit Design and EMC, Ministry of Education"}]},{"given":"Xin-quan","family":"Lai","sequence":"additional","affiliation":[{"name":"Institute of Electronic CAD, Xidian University"},{"name":"Key Lab of High Speed Circuit Design and EMC, Ministry of Education"}]},{"given":"Han-xiao","family":"Du","sequence":"additional","affiliation":[{"name":"Institute of Electronic CAD, Xidian University"},{"name":"Key Lab of High Speed Circuit Design and EMC, Ministry of Education"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"publisher","unstructured":"[1] K. H. Loo, W. K. Lun, S. C. Tan, Y. M. Lai and C. K. Tse: IEEE Trans. Power Electron. <b>24<\/b> (2009) 2967. DOI:10.1109\/TPEL.2009.2021183","DOI":"10.1109\/TPEL.2009.2021183"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] M. R. Krames, O. B. Shchekin, R. M. Mach, G. O. Mueller, Z. Ling, G. Harbers and M. G. Craford: J. Display Technol. <b>3<\/b> (2007) 160. DOI:10.1109\/JDT.2007.895339","DOI":"10.1109\/JDT.2007.895339"},{"key":"3","doi-asserted-by":"publisher","unstructured":"[3] W. Chen and S. Y. R. Hui: IEEE Trans. Power Electron. <b>27<\/b> (2012) 1598. DOI:10.1109\/TPEL.2010.2103959","DOI":"10.1109\/TPEL.2010.2103959"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] C. Park and C. T. Rim: Proc. IEEE APEC (2013) 870. DOI:10.1109\/APEC.2013.6520313","DOI":"10.1109\/APEC.2013.6520313"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] K. I. Hwu and W. C. Tu: IEEE Trans. Ind. Informat. <b>9<\/b> (2013) 1330. DOI:10.1109\/TII.2012.2226042","DOI":"10.1109\/TII.2012.2226042"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] K. Seo, V. H. Nguyen, J. Jung, J. Park and H. Song: IEICE Electron. Express <b>11<\/b> (2014) 20140810. DOI:10.1587\/elex.11.20140810","DOI":"10.1587\/elex.11.20140810"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] R. Dayal, K. Modepalli and L. Parsa: Proc. IEEE ECCE (2012) 4230. DOI:10.1109\/ECCE.2012.6342248","DOI":"10.1109\/ECCE.2012.6342248"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] J. Kim, J. Lee and S. Park: Proc. IEEE ISSCC (2013) 376. DOI:10.1109\/ISSCC.2013.6487777","DOI":"10.1109\/ISSCC.2013.6487777"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] N. Ning, W. B. Chen, D. J. Yu, C. Y. Feng and C. B. Wang: Electron. Lett. <b>49<\/b> (2013) 1170. DOI:10.1049\/el.2013.2093","DOI":"10.1049\/el.2013.2093"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] K. Seo, V. H. Nguyen, N. Kim, J. Park and H. Song: IEICE Electron. Express <b>12<\/b> (2015) 20150445. DOI:10.1587\/elex.12.20150445","DOI":"10.1587\/elex.12.20150445"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] J. Hu, H. Chen, X. Li, Q. Wang, R. Jin, Y. Zhang and Z. Song: IEICE Electron. Express <b>11<\/b> (2014) 20141011. DOI:10.1587\/elex.11.20141011","DOI":"10.1587\/elex.11.20141011"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] F. Zhang, J. Ni and Y. Yu: IEEE Trans. Power Electron. <b>28<\/b> (2013) 4831. DOI:10.1109\/TPEL.2012.2233498","DOI":"10.1109\/TPEL.2012.2233498"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/12\/23\/12_12.20150873\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T23:56:29Z","timestamp":1498262189000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/12\/23\/12_12.20150873\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015]]},"references-count":12,"journal-issue":{"issue":"23","published-print":{"date-parts":[[2015]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.12.20150873","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2015]]}}}