{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,5,29]],"date-time":"2022-05-29T18:10:04Z","timestamp":1653847804412},"reference-count":16,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"2","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2016]]},"DOI":"10.1587\/elex.12.20150927","type":"journal-article","created":{"date-parts":[[2015,12,17]],"date-time":"2015-12-17T22:13:44Z","timestamp":1450390424000},"page":"20150927-20150927","source":"Crossref","is-referenced-by-count":0,"title":["A DMR logic for mitigating the SET induced soft errors in combinational circuits"],"prefix":"10.1587","volume":"13","author":[{"given":"Zhang","family":"Jiajin","sequence":"first","affiliation":[{"name":"School of Science and Information Engineering, Yunnan Agricultural University"}]},{"given":"Yang","family":"Housen","sequence":"additional","affiliation":[{"name":"School of Mechanic and Electronic Engineering, Yunnan Agricultural University"}]},{"given":"Du","family":"Yankang","sequence":"additional","affiliation":[{"name":"China National Digital Switching System Engineering & Technological R&D Center"}]},{"given":"Gao","family":"Quan","sequence":"additional","affiliation":[{"name":"School of Science and Information Engineering, Yunnan Agricultural University"}]},{"given":"Peng","family":"Lin","sequence":"additional","affiliation":[{"name":"School of Science and Information Engineering, Yunnan Agricultural University"}]},{"given":"Zhang","family":"Yue","sequence":"additional","affiliation":[{"name":"School of Science and Information Engineering, Yunnan Agricultural University"}]},{"given":"Lichang","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Mechanic and Electronic Engineering, Yunnan Agricultural University"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] N. Mahatme, N. Gaspard, S. Jagannathan, T. D. Loveless, H. Abdel-Aziz, B. L. Bhuva, L. W. Massengil, S.-J. Wen and R. Wong: IRPS (2013) 3D.3.1. DOI:10.1109\/IRPS.2013.6531991","DOI":"10.1109\/IRPS.2013.6531991"},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] J. D. Black, A. L. Sternberg, M. L. Alles, A. F. Witulski, B. L. Bhuva and L. W. Massengill: IEEE Trans. Nucl. Sci. <b>52<\/b> (2005) 2536. DOI:10.1109\/TNS.2005.860718","DOI":"10.1109\/TNS.2005.860718"},{"key":"3","doi-asserted-by":"publisher","unstructured":"[3] B. Narasimham, J. W. Gambles, R. L. Shuler, B. L. Bhuva and L. W. Massengill: IEEE Trans. Nucl. Sci. <b>55<\/b> (2008) 3456. DOI:10.1109\/TNS.2008.2007119","DOI":"10.1109\/TNS.2008.2007119"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] N. M. Atkinson, A. F. Witulski, W. T. Holman, J. R. Ahlbin, B. L. Bhuva and L. W. Massengill: IEEE Trans. Nucl. Sci. <b>58<\/b> (2011) 885. DOI:10.1109\/TNS.2010.2097278","DOI":"10.1109\/TNS.2010.2097278"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] Q. Zhou and K. Mohanram: IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. <b>25<\/b> (2006) 155. DOI:10.1109\/TCAD.2005.853696","DOI":"10.1109\/TCAD.2005.853696"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] N. N. Mahatme, I. Chatterjee, A. Patki, D. B. Limbrick, B. L. Bhuva, R. D. Schrimpf and W. Robinson: Microelectron. Reliab. <b>53<\/b> (2013) 114. DOI:10.1016\/j.microrel.2012.07.030","DOI":"10.1016\/j.microrel.2012.07.030"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] A. Balasubramanian, B. L. Bhuva, J. D. Black and L. W. Massengill: IEEE Trans. Device Mater. Rel. <b>52<\/b> (2006) 2531.","DOI":"10.1109\/TNS.2005.860719"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] X. Hui and Z. Yun: IEICE Electron. Express <b>11<\/b> (2014) 20140396. DOI:10.1587\/elex.11.20140396","DOI":"10.1587\/elex.11.20140396"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] L. Bin, D. Yankang and X. Hui: IEICE Electron. Express <b>11<\/b> (2014) 20140710. DOI:10.1587\/elex.11.20140710","DOI":"10.1587\/elex.11.20140710"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] S. Chen, Y. Du, B. Liu and J. Qin: IEEE Trans. Nucl. Sci. <b>61<\/b> (2014) 646. DOI:10.1109\/TNS.2014.2298889","DOI":"10.1109\/TNS.2014.2298889"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] Q. Zhou and K. Mohanram: ICCAD (2004) 100. DOI:10.1109\/ICCAD.2004.1382551","DOI":"10.1109\/ICCAD.2004.1382551"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] D. Yankang, C. Shuming and L. Biwei: Microelectronics J. <b>44<\/b> (2013) 65. DOI:10.1016\/j.mejo.2012.11.011","DOI":"10.1016\/j.mejo.2012.11.011"},{"key":"13","doi-asserted-by":"publisher","unstructured":"[13] D. B. Limbrick, N. N. Mahatme, W. H. Robinson and B. L. Bhuva: IEEE Trans. Nucl. Sci. <b>60<\/b> (2013) 2776. DOI:10.1109\/TNS.2013.2240699","DOI":"10.1109\/TNS.2013.2240699"},{"key":"14","doi-asserted-by":"publisher","unstructured":"[14] K.-Ch. Wu and D. Marculescu: IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>21<\/b> (2012) 367. DOI:10.1109\/TVLSI.2012.2184145","DOI":"10.1109\/TVLSI.2012.2184145"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] Y. Du, S. Chen and B. Liu: IEEE Trans. Nucl. Sci. <b>14<\/b> (2014) 268.","DOI":"10.1109\/TDMR.2013.2291409"},{"key":"16","doi-asserted-by":"publisher","unstructured":"[16] L. Entrena, A. Lindoso, E. S. Millan, S. Pagliarini, F. Almeida and F. Kastensmidt: IEEE Trans. Nucl. Sci. <b>59<\/b> (2012) 811. DOI:10.1109\/TNS.2012.2191796","DOI":"10.1109\/TNS.2012.2191796"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/2\/13_12.20150927\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,29]],"date-time":"2022-05-29T17:46:01Z","timestamp":1653846361000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/2\/13_12.20150927\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":16,"journal-issue":{"issue":"2","published-print":{"date-parts":[[2016]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.12.20150927","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016]]}}}