{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,5,30]],"date-time":"2024-05-30T09:12:50Z","timestamp":1717060370268},"reference-count":12,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"15","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2016]]},"DOI":"10.1587\/elex.13.20160441","type":"journal-article","created":{"date-parts":[[2016,7,14]],"date-time":"2016-07-14T18:10:02Z","timestamp":1468519802000},"page":"20160441-20160441","source":"Crossref","is-referenced-by-count":6,"title":["Systematic experimental study on stitching techniques of CMOS image sensors"],"prefix":"10.1587","volume":"13","author":[{"given":"Jun","family":"Zhu","sequence":"first","affiliation":[{"name":"State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University"}]},{"given":"Donghua","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University"}]},{"given":"Wei","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University"}]},{"given":"Qing","family":"Wang","sequence":"additional","affiliation":[{"name":"Shanghai Huali Microelectronics Corporation"}]},{"given":"Wenliang","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Huali Microelectronics Corporation"}]},{"given":"Lijun","family":"Chen","sequence":"additional","affiliation":[{"name":"Shanghai Huali Microelectronics Corporation"}]},{"given":"Chen","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Integrated Circuit Research and Development Center Ltd"}]},{"given":"Yuhang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Shanghai Integrated Circuit Research and Development Center Ltd"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] A. T. Clark, <i>et al.<\/i>: \u201cA 54 mm \u00d7 54 mm-1.8 Megapixel CMOS image sensor for medical imaging,\u201d Nuclear Science Symposium Conference Record (2008) 4540 (DOI: 10.1109\/NSSMIC.2008.4774299).","DOI":"10.1109\/NSSMIC.2008.4774299"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] B. C. Burkey, <i>et al.<\/i>: \u201cThe pinned photodiode for an interline-transfer CCD image sensor,\u201d International Electron Devices Meeting <b>30<\/b> (1984) 28 (DOI: 10.1109\/IEDM.1984.190633).","DOI":"10.1109\/IEDM.1984.190633"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] S. Ay and E. R. Fossum: \u201cA 76 \u00d7 77 mm sup 2, 16.85 million pixel CMOS APS image sensor,\u201d Symposium on VlSI Circuits (2006) 19 (DOI: 10.1109\/VLSIC.2006.1705291).","DOI":"10.1109\/VLSIC.2006.1705291"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] P. J. W. Noble: \u201cSelf-scanned image detector arrays,\u201d IEEE Trans. Electron Devices <b>15<\/b> (1968) 202 (DOI: 10.1109\/T-ED.1968.16167).","DOI":"10.1109\/T-ED.1968.16167"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] E. R. Fossum: \u201cActive pixel sensors: are CCDs dinosaurs?,\u201d Proc. SPIE <b>1900<\/b> (1993) 2 (DOI: 10.1117\/12.148585).","DOI":"10.1117\/12.148585"},{"key":"6","unstructured":"[6] G. Meynants, <i>et al.<\/i>: \u201cA 35 mm 13.89 million pixel CMOS active pixel image sensor,\u201d IEEE CCD &amp; AIS (2003)."},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] G. Kreider, <i>et al.<\/i>: \u201cAn <i>mK<\/i> \u00d7 <i>nK<\/i> modular image sensor design,\u201d 1995 International Electron Devices Meeting. IEDM 95 (1995) 155 (DOI: 10.1109\/IEDM.1995.497203).","DOI":"10.1109\/IEDM.1995.497203"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] H. W. P. Koopset al.: \u201cCombined lithographies for the reduction of stitching errors in lithography,\u201d J. Vac. Sci. Technol. B <b>12<\/b> (1994) 3265 (DOI: 10.1116\/1.587609).","DOI":"10.1116\/1.587609"},{"key":"9","doi-asserted-by":"crossref","unstructured":"[9] A. Levinet al.: \u201cSeamless image stitching in the gradient domain,\u201d Lect. Notes Comput. Sci. <b>3024<\/b> (2004) 377 (DOI: 10.1007\/978-3-540-24673-2_31).","DOI":"10.1007\/978-3-540-24673-2_31"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] H. Liu and Y. Chen: \u201cBreaking through 1D layout limitations and regaining 2D design freedom part II: stitching yield modeling and optimization,\u201d Proc. SPIE <b>9427<\/b> (2015) 942714 (DOI: 10.1117\/12.2085898).","DOI":"10.1117\/12.2085898"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] Y. C. Paiet al.: \u201cHigh-order stitching overlay analysis for advanced process control,\u201d Proc. SPIE <b>7971<\/b> (2011) 797127 (DOI: 10.1117\/12.879360).","DOI":"10.1117\/12.879360"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] J. Zhou and Y. Chen: \u201cA comparative study on the yield performance of via landing and direct stitching processes for 2D pattern connection,\u201d Proc. SPIE <b>9781<\/b> (2016) 97810T (DOI: 10.1117\/12.2219336).","DOI":"10.1117\/12.2219336"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/15\/13_13.20160441\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,24]],"date-time":"2017-06-24T14:26:45Z","timestamp":1498314405000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/15\/13_13.20160441\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":12,"journal-issue":{"issue":"15","published-print":{"date-parts":[[2016]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.13.20160441","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016]]}}}