{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T15:59:53Z","timestamp":1770911993896,"version":"3.50.1"},"reference-count":28,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"6","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2016]]},"DOI":"10.1587\/elex.13.20162001","type":"journal-article","created":{"date-parts":[[2016,3,24]],"date-time":"2016-03-24T22:08:04Z","timestamp":1458857284000},"page":"20162001-20162001","source":"Crossref","is-referenced-by-count":9,"title":["Chip-to-chip interconnect integration technologies"],"prefix":"10.1587","volume":"13","author":[{"given":"Muneeb","family":"Zia","sequence":"first","affiliation":[{"name":"Georgia Institute of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chaoqi","family":"Zhang","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hyun Suk","family":"Yang","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Li","family":"Zheng","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Muhannad","family":"Bakir","sequence":"additional","affiliation":[{"name":"Georgia Institute of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"publisher","unstructured":"[1] J. E. Cunningham, A. V. Krishnamoorthy, R. Ho, I. Shubin, H. Thacker, J. Lexau, D. C. Lee, D. Feng, E. Chow, Y. Luo, X. Zheng, G. Li, J. Yao, T. Pinguet, K. Raj, M. Asghari and J. G. Mitchell: IEEE J. Sel. Top. Quantum Electron. <b>17<\/b> (2011) 546. DOI:10.1109\/JSTQE.2010.2091674","DOI":"10.1109\/JSTQE.2010.2091674"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] N. Kim, D. Wu, D. Kim, A. Rahman and P. Wu: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (2011) 1160. DOI:10.1109\/ECTC.2011.5898657","DOI":"10.1109\/ECTC.2011.5898657"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] H. Braunisch, A. Aleksov, S. Lotz and J. Swan: 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (2011) 95. DOI:10.1109\/EPEPS.2011.6100196","DOI":"10.1109\/EPEPS.2011.6100196"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] T. Nakamura, Y. Urino, J. Fujikata, T. Usuki, M. Ishizaka, K. Yamada, T. Horikawa and Y. Arakawa: 2013 Conference on Lasers and Electro-Optics (CLEO) (2013) 1. DOI:10.1364\/CLEO_SI.2013.CTu1L.5","DOI":"10.1364\/CLEO_SI.2013.CTu1L.5"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] M. Koyanagi: IEICE Electron. Express <b>12<\/b> (2015) 20152001. DOI:10.1587\/elex.12.20152001","DOI":"10.1587\/elex.12.20152001"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] T. Kuwahara, Y. Akeboshi and S. Saito: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC) (2015) 878. DOI:10.1109\/ICEP-IAAC.2015.7111139","DOI":"10.1109\/ICEP-IAAC.2015.7111139"},{"key":"7","doi-asserted-by":"publisher","unstructured":"[7] D. G. Kam, M. B. Ritter, T. J. Beukema, J. F. Bulzacchelli, P. K. Pepeljugoski, Y. H. Kwark, L. Shan, X. Gu, C. W. Baks, R. A. John, G. Hougham, C. Schuster, R. Rimolo-Donadio and B. Wu: IEEE Trans. Adv. Packag. <b>32<\/b> (2009) 328. DOI:10.1109\/TADVP.2008.2011138","DOI":"10.1109\/TADVP.2008.2011138"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] H. Braunisch, J. E. Jaussi, J. A. Mix, M. B. Trobough, B. D. Horine, V. Prokofiev, D. Lu, R. Baskaran, P. C. H. Meier, D.-H. Han, K. E. Mallory and M. W. Leddige: IEEE Trans. Adv. Packag. <b>31<\/b> (2008) 82. DOI:10.1109\/TADVP.2007.909451","DOI":"10.1109\/TADVP.2007.909451"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] L. Schares, J. A. Kash, F. E. Doany, C. L. Schow, C. Schuster, D. M. Kuchta, P. K. Pepeljugoski, J. M. Trewhella, C. W. Baks, R. A. John, L. Shan, Y. H. Kwark, R. A. Budd, P. Chiniwalla, F. R. Libsch, J. Rosner, C. K. Tsang, G. S. Patel, J. D. Schaub, R. Dangel, F. Horst, B. J. Offrein, D. Kucharski, D. Guckenberger, S. Hegde, H. Nyikal, C.-K. Lin, A. Tandon, G. R. Trott, M. Nystrom, D. P. Bour, M. R. T. Tan and D. W. Dolfi: IEEE J. Sel. Top. Quantum Electron. <b>12<\/b> (2006) 1032. DOI:10.1109\/JSTQE.2006.881906","DOI":"10.1109\/JSTQE.2006.881906"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] F. E. Doany, C. L. Schow, B. G. Lee, R. A. Budd, C. W. Baks, C. K. Tsang, J. U. Knickerbocker, R. Dangel, B. Chan, H. Lin, C. Carver, J. Huang, J. Berry, D. Bajkowski, F. Libsch and J. A. Kash: J. Lightwave Technol. <b>30<\/b> (2012) 560. DOI:10.1109\/JLT.2011.2177244","DOI":"10.1109\/JLT.2011.2177244"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] T. O. Dickson, Y. Liu, S. V. Rylov, B. Dang, C. K. Tsang, P. S. Andry, J. F. Bulzacchelli, H. A. Ainspan, X. Gu, L. Turlapati, M. P. Beakes, B. D. Parker, J. U. Knickerbocker and D. J. Friedman: IEEE J. Solid-State Circuits <b>47<\/b> (2012) 884. DOI:10.1109\/JSSC.2012.2185184","DOI":"10.1109\/JSSC.2012.2185184"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] R. Ho, F. Liu, D. Patil, X. Zheng, G. Li, I. Shubin, E. Alon, J. Lexau, H. Schwetman, J. E. Cunningham and A. V. Krishnamoorthy: IEEE Des. Test Comput. <b>27<\/b> [4] (2010) 10. DOI:10.1109\/MDT.2010.31","DOI":"10.1109\/MDT.2010.31"},{"key":"13","doi-asserted-by":"publisher","unstructured":"[13] R. Ho, P. Amberg, E. Chang, P. Koka, J. Lexau, G. Li, F. Y. Liu, H. Schwetman, I. Shubin, H. D. Thacker, X. Zheng, J. E. Cunningham and A. V. Krishnamoorthy: IEEE Micro <b>33<\/b> [1] (2013) 68. DOI:10.1109\/MM.2012.91","DOI":"10.1109\/MM.2012.91"},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] J. Yao, X. Zheng, I. Shubin, G. Li, H. Thacker, Y. Luo, J.-H. Lee, K. Raj, J. E. Cunningham and A. V. Krishnamoorthy: 2012 IEEE Optical Interconnects Conference (2012) 27. DOI:10.1109\/OIC.2012.6224464","DOI":"10.1109\/OIC.2012.6224464"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] I. Shubin, X. Zheng, H. Thacker, S. S. Djordjevic, S. Lin, P. Amberg, J. Lexau, K. Raj, J. E. Cunningham and A. V. Krishnamoorthy: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015) 1293. DOI:10.1109\/ECTC.2015.7159764","DOI":"10.1109\/ECTC.2015.7159764"},{"key":"16","doi-asserted-by":"publisher","unstructured":"[16] H. D. Thacker, X. Zheng, J. Lexau, R. Shafiiha, I. Shubin, S. Lin, S. Djordjevic, P. Amberg, E. Chang, F. Liu, J. Simons, J.-H. Lee, A. Abed, H. Liang, Y. Luo, J. Yao, D. Feng, M. Asghari, R. Ho, K. Raj, J. E. Cunningham and A. V. Krishnamoorthy: Opt. Express <b>23<\/b> (2015) 12808. DOI:10.1364\/OE.23.012808","DOI":"10.1364\/OE.23.012808"},{"key":"17","doi-asserted-by":"crossref","unstructured":"[17] J. H. Lau: 2010 12th Electronics Packaging Technology Conference (EPTC) (2010) 560. DOI:10.1109\/EPTC.2010.5702702","DOI":"10.1109\/EPTC.2010.5702702"},{"key":"18","doi-asserted-by":"crossref","unstructured":"[18] J. H. Lau: 2011 International Symposium on Advanced Packaging Materials (APM) (2011) 462. DOI:10.1109\/ISAPM.2011.6105753","DOI":"10.1109\/ISAPM.2011.6105753"},{"key":"19","doi-asserted-by":"crossref","unstructured":"[19] T. Mourier, C. Ribiere, G. Romero, M. Gottardi, N. Allouti, R. Eleouet, A. Roman, T. Magis, S. Minoret, C. Ratin, D. Scevola, E. Dupuy, B. Martin, L. Gabette, D. Marseilhan, T. Enot, M. Pellat, V. Loup, R. Segaud, H. Feldis, A. Charpentier, J. P. Bally, M. Assous, I. Charbonnier, C. Laviron, P. Coudrain and N. Sillon: 2013 IEEE International Interconnect Technology Conference (IITC) (2013) 1. DOI:10.1109\/IITC.2013.6615598","DOI":"10.1109\/IITC.2013.6615598"},{"key":"20","doi-asserted-by":"crossref","unstructured":"[20] C. T. Ko, Z. C. Hsiao, Y. J. Chang, P. S. Chen, J. H. Huang, H. C. Fu, Y. J. Huang, C. W. Chiang, W. L. Tsai, Y. H. Chen, W. C. Lo and K. N. Chen: 2011 IEEE International 3D Systems Integration Conference (3DIC) (2012) 1. DOI:10.1109\/3DIC.2012.6262949","DOI":"10.1109\/3DIC.2012.6262949"},{"key":"21","doi-asserted-by":"crossref","unstructured":"[21] H. S. Yang, C. Zhang, M. Zia, L. Zheng and M. S. Bakir: 2014 IEEE Optical Interconnects Conference (2014) 71. DOI:10.1109\/OIC.2014.6886084","DOI":"10.1109\/OIC.2014.6886084"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] H. S. Yang, C. Zhang and M. S. Bakir: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) (2013) 232. DOI:10.1109\/ECTC.2013.6575577","DOI":"10.1109\/ECTC.2013.6575577"},{"key":"23","doi-asserted-by":"publisher","unstructured":"[23] C. Zhang, H. S. Yang and M. S. Bakir: IEEE Trans. Compon. Packag. Manuf. Technol. <b>3<\/b> (2013) 1632. DOI:10.1109\/TCPMT.2013.2276436","DOI":"10.1109\/TCPMT.2013.2276436"},{"key":"24","doi-asserted-by":"publisher","unstructured":"[24] E. Slavcheva, W. Mokwa and U. Schnakenberg: Electrochim. Acta <b>50<\/b> (2005) 5573. DOI:10.1016\/j.electacta.2005.03.059","DOI":"10.1016\/j.electacta.2005.03.059"},{"key":"25","doi-asserted-by":"crossref","unstructured":"[25] K. B. Unchwaniwala and M. F. Caggiano: Proc. 51st Electronic Components and Technology Conference (2001) 1496. DOI:10.1109\/ECTC.2001.928034","DOI":"10.1109\/ECTC.2001.928034"},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] J. Yao, X. Zheng, G. Li, I. Shubin, H. Thacker, Y. Luo, K. Raj, J. E. Cunningham and A. V. Krishnamoorthy: 2011 8th IEEE International Conference on Group IV Photonics (GFP) (2011) 383. DOI:10.1109\/GROUP4.2011.6053824","DOI":"10.1109\/GROUP4.2011.6053824"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[27] H. Cho, P. Kapur and K. C. Saraswat: Proc. of the IEEE 2004 International Interconnect Technology Conference (2004) 116. DOI:10.1109\/IITC.2004.1345710","DOI":"10.1109\/IITC.2004.1345710"},{"key":"28","doi-asserted-by":"publisher","unstructured":"[28] A. J. Zilkie, P. Seddighian, B. J. Bijlani, W. Qian, D. C. Lee, S. Fathololoumi, J. Fong, R. Shafiiha, D. Feng, B. J. Luff, X. Zheng, J. E. Cunningham, A. V. Krishnamoorthy and M. Asghari: Opt. Express <b>20<\/b> (2012) 23456. DOI:10.1364\/OE.20.023456","DOI":"10.1364\/OE.20.023456"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/6\/13_13.20162001\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,24]],"date-time":"2017-06-24T09:16:35Z","timestamp":1498295795000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/13\/6\/13_13.20162001\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":28,"journal-issue":{"issue":"6","published-print":{"date-parts":[[2016]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.13.20162001","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016]]}}}