{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,21]],"date-time":"2025-12-21T06:25:50Z","timestamp":1766298350277},"reference-count":12,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"7","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2017]]},"DOI":"10.1587\/elex.14.20170045","type":"journal-article","created":{"date-parts":[[2017,3,6]],"date-time":"2017-03-06T22:09:17Z","timestamp":1488838157000},"page":"20170045-20170045","source":"Crossref","is-referenced-by-count":3,"title":["Dual 3-phase buck converter for multi-core CPUs power supply in mobile devices"],"prefix":"10.1587","volume":"14","author":[{"given":"Lei","family":"Wang","sequence":"first","affiliation":[{"name":"Department of Electronic Science and Technology, University of Science and Technology of China"}]},{"given":"Fujiang","family":"Lin","sequence":"additional","affiliation":[{"name":"Department of Electronic Science and Technology, University of Science and Technology of China"}]},{"given":"Qing","family":"Cui","sequence":"additional","affiliation":[{"name":"Department of Electronic Science and Technology, University of Science and Technology of China"}]}],"member":"532","reference":[{"key":"1","unstructured":"[1] A. Carroll and G. Heiser: \u201cAn analysis of power consumption in a smartphone,\u201d Proc. Usenix Ann. Tech. Conf. (2010) 21."},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] X. Zhouet al.: \u201cInvestigation of candidate VRM topologies for future microprocessors,\u201d IEEE Trans. Power Electron. <b>15<\/b> (2000) 1172 (DOI: 10.1109\/63.892832).","DOI":"10.1109\/63.892832"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] A. Pathania, <i>et al.<\/i>: \u201cIntegrated CPU-GPU power management for 3D mobile games,\u201d Proc. Ann. DAC (2014) 1 (DOI: 10.1145\/2593069.2593151).","DOI":"10.1145\/2593069.2593151"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] C. Qing and L. Fujiang: \u201cA tri-mode high light-load efficiency BUCK converter for mobile phone application,\u201d IEICE Electron. Express <b>13<\/b> (2016) 20160360 (DOI: 10.1587\/elex.13.20160360).","DOI":"10.1587\/elex.13.20160360"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] Y.-S. Rohet al.: \u201cA multiphase synchronous buck converter with a fully integrated current balancing scheme,\u201d IEEE Trans. Power Electron. <b>30<\/b> (2015) 5159 (DOI: 10.1109\/TPEL.2014.2368130).","DOI":"10.1109\/TPEL.2014.2368130"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] M. P. Varghese, <i>et al.<\/i>: \u201cPerformance analysis of multiphase buck converter for VRMs using phase shedding technique,\u201d 2016 Biennial International Conference on PESTSE (2016) 1 (DOI: 10.1109\/PESTSE.2016.7516529).","DOI":"10.1109\/PESTSE.2016.7516529"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] K. T. Hafeez, <i>et al.<\/i>: \u201cA low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range,\u201d IEEE ISCAS (2016) 1618 (DOI: 10.1109\/ISCAS.2016.7538875).","DOI":"10.1109\/ISCAS.2016.7538875"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] M. Wens, M. Steyaert: <i>Design and Implementation of Fully-Integrated Inductive DC-DC Converters in Standard CMOS<\/i> (Springer, eBook, 2011) 109.","DOI":"10.1007\/978-94-007-1436-6"},{"key":"9","unstructured":"[9] Dialog: DA9212 datasheet (2016) http:\/\/dialog-semiconductor.com."},{"key":"10","unstructured":"[10] Intersil: ISL6312A datasheet (2015) http:\/\/www.intersil.com."},{"key":"11","unstructured":"[11] Infineon Technologies: IR36021 datasheet (2013) http:\/\/www.infineon.com."},{"key":"12","unstructured":"[12] Freescale Semiconductor: \u201cWafer Level Chip Scale Package (WLCSP),\u201d Application Note (2015) AN3846."}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/14\/7\/14_14.20170045\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,19]],"date-time":"2019-09-19T10:32:13Z","timestamp":1568889133000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/14\/7\/14_14.20170045\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017]]},"references-count":12,"journal-issue":{"issue":"7","published-print":{"date-parts":[[2017]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.14.20170045","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017]]}}}