{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2022,4,2]],"date-time":"2022-04-02T12:45:21Z","timestamp":1648903521262},"reference-count":10,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"12","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2017]]},"DOI":"10.1587\/elex.14.20170444","type":"journal-article","created":{"date-parts":[[2017,5,31]],"date-time":"2017-05-31T18:13:40Z","timestamp":1496254420000},"page":"20170444-20170444","source":"Crossref","is-referenced-by-count":2,"title":["A compact Ka-band antenna-in-package for system-in-package application"],"prefix":"10.1587","volume":"14","author":[{"given":"Yin","family":"Tian","sequence":"first","affiliation":[{"name":"Air Force Engineering University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Guangming","family":"Wang","sequence":"additional","affiliation":[{"name":"Air Force Engineering University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yexi","family":"Song","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jie","family":"Yang","sequence":"additional","affiliation":[{"name":"Sichuan Jiuzhou Electric Group Co., Ltd."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu","family":"Cao","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Tong","sequence":"additional","affiliation":[{"name":"ChengDu Ganide Technology Co., Ltd."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yijun","family":"Chen","sequence":"additional","affiliation":[{"name":"ChengDu Ganide Technology Co., Ltd."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shiwen","family":"Tang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"publisher","unstructured":"[1] W. W.-M. Dai: \u201cHistorical perspective of system in package (SiP),\u201d IEEE Circuits Syst. Mag. <b>16<\/b> (2016) 50 (DOI: 10.1109\/MCAS.2016.2549949).","DOI":"10.1109\/MCAS.2016.2549949"},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] N. Kingsleyet al.: \u201cReconfigurable RF MEMS phased array antenna integrated within a liquid crystal polymer (LCP) system-on-package,\u201d IEEE Trans. Antennas Propag. <b>56<\/b> (2008) 108 (DOI: 10.1109\/TAP.2007.913151).","DOI":"10.1109\/TAP.2007.913151"},{"key":"3","doi-asserted-by":"publisher","unstructured":"[3] S. Huet al.: \u201cCompact high-gain mmWave antenna for TSV-based system-in-package application,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>2<\/b> (2012) 841 (DOI: 10.1109\/TCPMT.2012.2188293).","DOI":"10.1109\/TCPMT.2012.2188293"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] T. M. Shenet al.: \u201cAntenna design of 60-GHz micro-radar system-in-package for noncontact vital sign detection,\u201d IEEE Antennas Wireless Propag. Lett. <b>11<\/b> (2012) 1702 (DOI: 10.1109\/LAWP.2013.2239957).","DOI":"10.1109\/LAWP.2013.2239957"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] J. Kuoet al.: \u201c60-GHz four-element phased-array transmit\/receive system-in-package using phase compensation techniques in 65-nm flip-chip CMOS process,\u201d IEEE Trans. Microw. Theory Techn. <b>60<\/b> (2012) 743 (DOI: 10.1109\/TMTT.2011.2176508).","DOI":"10.1109\/TMTT.2011.2176508"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] Y. P. Zhang: \u201cEnhancement of package antenna approach with dual feeds, guard ring, and fence of vias,\u201d IEEE Trans. Adv. Packag. <b>32<\/b> (2009) 612 (DOI: 10.1109\/TADVP.2008.2001769).","DOI":"10.1109\/TADVP.2008.2001769"},{"key":"7","doi-asserted-by":"publisher","unstructured":"[7] Z. Tonget al.: \u201cRadiation performance enhancement of E-band antenna in package,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>3<\/b> (2013) 1953 (DOI: 10.1109\/TCPMT.2013.2272039).","DOI":"10.1109\/TCPMT.2013.2272039"},{"key":"8","unstructured":"[8] T. Zwick and S. Beer: \u201cQFN based packaging concepts for millimeter-wave transceivers,\u201d 2012 International Workshop on Antenna Technology (iWAT) (2012) 335 (DOI: 10.1109\/IWAT.2012.6178680)."},{"key":"9","unstructured":"[9] S. Huang and J. DeLaCruz: \u201cImprovements of system-in-package integration and electrical performance using BVA wire bonding,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. (2017) 1 (DOI: 10.1109\/TCPMT.2017.2657380)."},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] M. U. Khanet al.: \u201cMicrostrip patch antenna miniaturization techniques: A review,\u201d Microw. Antennas Propag. <b>9<\/b> (2015) 913 (DOI: 10.1049\/iet-map.2014.0602).","DOI":"10.1049\/iet-map.2014.0602"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/14\/12\/14_14.20170444\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,30]],"date-time":"2017-06-30T23:35:16Z","timestamp":1498865716000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/14\/12\/14_14.20170444\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017]]},"references-count":10,"journal-issue":{"issue":"12","published-print":{"date-parts":[[2017]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.14.20170444","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017]]}}}