{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,19]],"date-time":"2025-11-19T07:00:09Z","timestamp":1763535609849},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"7","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2019]]},"DOI":"10.1587\/elex.16.20190084","type":"journal-article","created":{"date-parts":[[2019,3,10]],"date-time":"2019-03-10T22:31:28Z","timestamp":1552257088000},"page":"20190084-20190084","source":"Crossref","is-referenced-by-count":3,"title":["A design of adaptive PID controller based on thermal characteristics of mobile application processors"],"prefix":"10.1587","volume":"16","author":[{"given":"Hyun Hak","family":"Cho","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, Sogang University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chang Min","family":"Eun","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Sogang University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ok Hyun","family":"Jeong","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Sogang University"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] K. Dev, <i>et al.<\/i>: \u201cPower mapping and modeling of multi-core processors,\u201d Proc. Int. Symp. Low Power Electron. Des. (ISLPED) (2013) 39 (DOI: 10.1109\/ISLPED.2013.6629264).","DOI":"10.1109\/ISLPED.2013.6629264"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] K. Sekar: \u201cPower and thermal challenges in mobile devices,\u201d Proc. 19th Annu. Int. Conf. Mob. Comput. Networking (2013) 363 (DOI: 10.1145\/2500423.2505320).","DOI":"10.1145\/2500423.2505320"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] D. Brooks and M. Martonosi: \u201cDynamic thermal management for high-performance microprocessors,\u201d Proc. 7th Int. Symp. High-Perform. Comput. Archit. (HPCA) (2001) 171 (DOI: 10.1109\/HPCA.2001.903261).","DOI":"10.1109\/HPCA.2001.903261"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] M. Pedram and S. Nazarian: \u201cThermal modeling, analysis, and management in VLSI circuits: Principles and methods,\u201d Proc. IEEE <b>94<\/b> (2006) 1487 (DOI: 10.1109\/JPROC.2006.879797).","DOI":"10.1109\/JPROC.2006.879797"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] G. Singla, <i>et al.<\/i>: \u201cPredictive dynamic thermal and power management for heterogeneous mobile platforms,\u201d Proc. 2015 Des. Autom. Test Eur. Conf. Exhibition (DATE) (2015) 960 (DOI: 10.7873\/DATE.2015.1036).","DOI":"10.7873\/DATE.2015.1036"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] K. M. Attia, <i>et al.<\/i>: \u201cDynamic power management techniques in multi-core architectures: A survey study,\u201d Ain Shams Eng. J. <b>8<\/b> (2017) 445 (DOI: 10.1016\/j.asej.2015.08.010).","DOI":"10.1016\/j.asej.2015.08.010"},{"key":"7","doi-asserted-by":"publisher","unstructured":"[7] J. Kong, <i>et al.<\/i>: \u201cRecent thermal management techniques for microprocessors,\u201d ACM Comput. Surv. <b>44<\/b> (2012) 1 (DOI: 10.1145\/2187671.2187675).","DOI":"10.1145\/2187671.2187675"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] O. Sahin and A. K. Coskun: \u201cOn the impacts of greedy thermal management in mobile devices,\u201d IEEE Embed. Syst. Lett. <b>7<\/b> (2015) 55 (DOI: 10.1109\/LES.2015.2420664).","DOI":"10.1109\/LES.2015.2420664"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] J. Zhou, <i>et al.<\/i>: \u201cThermal-aware task scheduling for energy minimization in heterogeneous real-time MPSoC systems,\u201d IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. <b>35<\/b> (2016) 1269 (DOI: 10.1109\/TCAD.2015.2501286).","DOI":"10.1109\/TCAD.2015.2501286"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] J. M. Kim, <i>et al.<\/i>: \u201cStabilizing CPU frequency and voltage for temperature-aware DVFS in mobile devices,\u201d IEEE Trans. Comput. <b>64<\/b> (2015) 286 (DOI: 10.1109\/TC.2013.188).","DOI":"10.1109\/TC.2013.188"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] M. K. Yim, <i>et al.<\/i>: \u201cSurface temperature-aware thermal management technique for mobile devices,\u201d IEICE Electron. Express <b>11<\/b> (2014) 20140944 (DOI: 10.1587\/elex.11.20140944).","DOI":"10.1587\/elex.11.20140944"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] B. M. Mohan and A. Shinha: \u201cAnalytical structure and stability analysis of a fuzzy PID controller,\u201d Appl. Soft Comput. <b>8<\/b> (2008) 749 (DOI: 10.1016\/j.asoc.2007.06.003).","DOI":"10.1016\/j.asoc.2007.06.003"},{"key":"13","unstructured":"[13] S. W. Sung and I.-B. Lee: <i>PID Controllers and Automatic Tuning<\/i> (A-Jin, Seoul, 1999) 146."},{"key":"14","unstructured":"[14] Qualcomm Technologies, Inc.: DragonBoard 410c based on Qualcomm Snapdragon 410E processor thermal debugging guide (2016) https:\/\/developer.qualcomm.com."},{"key":"15","unstructured":"[15] Qualcomm Technologies, Inc.: Designing mobile devices for low power and thermal efficiency (2013) https:\/\/www.qualcomm.com\/documents."},{"key":"16","unstructured":"[16] V. Pallipadi and A. Starikovskiy: \u201cThe ondemand governor: Past, present, and future,\u201d Proc. Linux Symp. (2006) 215."},{"key":"17","unstructured":"[17] K. J. \u00c5str\u00f6m and T. H\u00e4gglund: <i>Advanced PID Control<\/i> (ISA, North Carolina, 2006) 158."},{"key":"18","unstructured":"[18] A. R. Laware, <i>et al.<\/i>: \u201cReal time temperature control system using PID controller and supervisory control and data acquisition system (SCADA),\u201d Int. J. Appl. Innovation Eng. Manage. <b>2<\/b> (2013) 88."},{"key":"19","unstructured":"[19] F. G. Shinskey: <i>Feedback Controllers for the Process Industries<\/i> (McGraw-Hill, Singapore, 1994) 90."},{"key":"20","unstructured":"[20] F. A. Salem: \u201cNew efficient model-based PID design method,\u201d Eur. Sci. J. <b>9<\/b> (2013) 181."},{"key":"21","doi-asserted-by":"crossref","unstructured":"[21] G. J. Silva, <i>et al.<\/i>: <i>PID Controllers for Time-Delay Systems<\/i> (Birkh\u00e4user, Boston, 2005) 110.","DOI":"10.1007\/b138796"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] S. W. Sung, <i>et al.<\/i>: <i>Process Identification and PID Control<\/i> (John Wiley &amp; Sons, Singapore, 2009) 129.","DOI":"10.1002\/9780470824122"},{"key":"23","doi-asserted-by":"publisher","unstructured":"[23] E. Glocker and D. Schmitt-Landsiedel: \u201cModeling of temperature scenarios in a multicore processor system,\u201d Adv. Radio Sci. <b>11<\/b> (2013) 219 (DOI: 10.5194\/ars-11-219-2013).","DOI":"10.5194\/ars-11-219-2013"},{"key":"24","doi-asserted-by":"publisher","unstructured":"[24] G. Liu, <i>et al.<\/i>: \u201cOn-line predictive thermal management under peak temperature constraints for practical multi-core platforms,\u201d J. Low Power Electron. <b>8<\/b> (2012) 565 (DOI: 10.1166\/jolpe.2012.1216).","DOI":"10.1166\/jolpe.2012.1216"},{"key":"25","doi-asserted-by":"crossref","unstructured":"[25] Q. Xie, <i>et al.<\/i>: \u201cDynamic thermal management in mobile devices considering the thermal coupling between battery and application processor,\u201d Proc. 2013 IEEE\/ACM Int. Conf. Comput.-Aided Des. (ICCAD) (2013) 242 (DOI: 10.1109\/ICCAD.2013.6691125).","DOI":"10.1109\/ICCAD.2013.6691125"},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] I. Yeo, <i>et al.<\/i>: \u201cPredictive dynamic thermal management for multicore systems,\u201d Proc. 45th ACM\/IEEE Des. Autom. Conf. (2008) 734.","DOI":"10.1145\/1391469.1391658"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[27] S. Tavakoli and M. Tavakoli: \u201cOptimal tuning of PID controllers for first order plus time delay models using dimensional analysis,\u201d 4th Int. Conf. Control Autom. Proc. (2003) 942 (DOI: 10.1109\/ICCA.2003.1595161).","DOI":"10.1109\/ICCA.2003.1595161"},{"key":"28","unstructured":"[28] D. T. Korsane, <i>et al.<\/i>: \u201cPID tuning rules for first order plus time delay system,\u201d Int. J. Innovative Res. Electr. Electron. Instrum. Control Eng. <b>2<\/b> (2014) 582."},{"key":"29","unstructured":"[29] A. Tripathi, <i>et al.<\/i>: \u201cStudy and analysis of various tuning methods of PID controller for AVR system,\u201d Int. J. Res. Electr. Electron. Eng. <b>1<\/b> (2013) 93."},{"key":"30","doi-asserted-by":"crossref","unstructured":"[30] Q. Xie, <i>et al.<\/i>: \u201cTherminator: A thermal simulator for smartphones producing accurate chip and skin temperature maps,\u201d Proc. IEEE\/ACM Int. Symp. Low Power Electron. Des. (ISLPED) (2014) 117 (DOI: 10.1145\/2627369.2627641).","DOI":"10.1145\/2627369.2627641"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/16\/7\/16_16.20190084\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,11,21]],"date-time":"2019-11-21T03:08:14Z","timestamp":1574305694000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/16\/7\/16_16.20190084\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019]]},"references-count":30,"journal-issue":{"issue":"7","published-print":{"date-parts":[[2019]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.16.20190084","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019]]}}}