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Rao, <i>et al.<\/i>: \u201cA 76-81 GHz CMOS mmW quadrature down-conversion mixer for automotive radar applications,\u201d IEICE Electron. Express (2020) 1 (DOI: 10.1587\/elex.17.20190740)."},{"key":"6","unstructured":"[6] F. Vecchi, <i>et al.<\/i>: \u201cDesign of low-loss transmission lines in scaled CMOS by accurate electromagnetic simulations,\u201d IEEE J. Solid-State Circuits (2009) 2605 (DOI: 10.1109\/jssc.2009.2023277)."},{"key":"7","unstructured":"[7] K. Kang, <i>et al.<\/i>: \u201cA wideband model for on-chip interconnects with different shielding structures,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>7<\/b> (2017) 1702 (DOI: 10.1109\/TCPMT.2017.2732445)."},{"key":"8","unstructured":"[8] O. Huber, <i>et al.<\/i>: \u201cDielectric characterization of RF-printed circuit board materials by microstrip transmission lines and conductor-backed coplanar waveguides up to 110 GHz,\u201d IEEE Trans. Microw. Theory Techn. <b>66<\/b> (2018) 237 (DOI: 10.1109\/TMTT.2017.2750152)."},{"key":"9","unstructured":"[9] D. Parveg, <i>et al.<\/i>: \u201cWideband mm-wave CMOS slow wave coupler,\u201d IEEE Microw. Wireless Compon. Lett. <b>29<\/b> (2019) 210 (DOI: 10.1109\/LMWC.2019.2892845)."},{"key":"10","unstructured":"[10] C.-I. Lee, <i>et al.<\/i>: \u201cAn improved millimeter-wave general cascade de-embedding method for 110 GHz on-wafer transistor measurements,\u201d IEEE Trans. Semicond. Manuf. <b>30<\/b> (2017) 98 (DOI: 10.1109\/TSM.2017.2649943)."},{"key":"11","unstructured":"[11] J.-C.G. Santos and R. Torres-Torres: \u201cAssessing the accuracy of the open, short and open-short de-embedding methods for on-chip transmission line S-parameters measurements,\u201d 2017 International Caribbean Conference on Devices, Circuits and Systems (2017) 57 (DOI: 10.1109\/ICCDCS.2017.7959720)."},{"key":"12","unstructured":"[12] X. S. Loo, <i>et al.<\/i>: \u201cA cascade-parallel based noise de-embedding technique for RF modeling of CMOS device,\u201d IEEE Microw. Wireless Compon. Lett. <b>21<\/b> (2011) 448 (DOI: 10.1109\/LMWC.2011.2158533)."},{"key":"13","unstructured":"[13] L. Galatro, <i>et al.<\/i>: \u201cCapacitively loaded inverted CPWs for distributed TRL-based de-embedding at (sub) mm-waves,\u201d IEEE Trans. Microw. Theory Techn. <b>65<\/b> (2017) 4914 (DOI: 10.1109\/TMTT.2017.2727498)."},{"key":"14","unstructured":"[14] I. Abdo, <i>et al.<\/i>: \u201cComparison between L-2L and thru-reflect-line de-embedding methods for W-band CMOS amplifier design,\u201d 2017 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT) (2017) 34 (DOI: 10.1109\/RFIT.2017.8048281)."},{"key":"15","unstructured":"[15] J.C. Chienand and A.M. Niknejad: \u201cImpedance renormalization in CMOS-based single-element electronic de-embedding,\u201d 2015 85th Microwave Measurement Conference (2015) (DOI: 10.1109\/ARFTG.2015.7162910)."},{"key":"16","unstructured":"[16] Y.-L. Lin, <i>et al.<\/i>: \u201cAn extended de-embedding method for on-wafer components,\u201d IEEE International Conference on Microelectronic Test Structures (2012) 166 (DOI: 10.1109\/ICMTS.2012.6190638)."},{"key":"17","unstructured":"[17] H. Ito and K. Masuy: \u201cA simple through-only de-embedding method for on-wafer S-parameter measurements up to 110 GHz,\u201d 2008 IEEE MTT-S International Microwave Symposium Digest (2008) 383 (DOI: 10.1109\/MWSYM.2008.4633183)."},{"key":"18","unstructured":"[18] Q.H. Bu, <i>et al.<\/i>: \u201cEvaluation of a multi-line de-embedding technique for millimeter-wave CMOS circuit design,\u201d 2010 Asia-Pacific Microwave Conference (2010) 1901."},{"key":"19","unstructured":"[19] N. Erickson, <i>et al.<\/i>: \u201cDe-embedding techniques for transmission lines: an application to measurements of on-chip coplanar traces,\u201d IEEE International Symposium on Electromagnetic Compatibility (2014) 660 (DOI: 10.1109\/ISEMC.2014.6899052)."},{"key":"20","unstructured":"[20] N. Erickson, <i>et al.<\/i>: \u201cRevised L-2L method for on-chip de-embedding,\u201d IEEE Trans. Electromagn. Compat. <b>61<\/b> (2019) 209 (DOI: 10.1109\/TEMC.2018.2792908)."},{"key":"21","unstructured":"[21] N. Erickson, <i>et al.<\/i>: \u201cDe-embedding techniques for transmission lines: an exploration, review, and proposal,\u201d 2013 IEEE International Symposium on Electromagnetic Compatibility (2013) 840 (DOI: 10.1109\/ISEMC.2013.6670527)."},{"key":"22","unstructured":"[22] S. Amakawa, <i>et al.<\/i>: \u201cOn the choice of cascade de-embedding methods for on-wafer S-parameter measurement,\u201d 2012 IEEE International Symposium on Radio-Frequency Integration Technology (2012) 134 (DOI: 10.1109\/RFIT.2012.6401638)."},{"key":"23","unstructured":"[23] W. Shu, <i>et al.<\/i>: \u201cInvestigation of the de-embedding issue of CPWs on silicon substrates at high frequency,\u201d Texas Symposium on Wireless and Microwave Circuits and Systems (2013) (DOI: 10.1109\/WMCaS.2013.6563571)."},{"key":"24","unstructured":"[24] S. Kawai, <i>et al.<\/i>: \u201cL-2L de-embedding method with double-T-type PAD model for millimeter-wave amplifier design,\u201d 2015 IEEE 15th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (2015) 43 (DOI: 10.1109\/SIRF.2015.7119869)."},{"key":"25","unstructured":"[25] J.P. Mondal, <i>et al.<\/i>: \u201cPropagation constant determination in microwave fixture de-embedding procedure,\u201d IEEE Trans. Microw. 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Goto, <i>et al.<\/i>: \u201cNew on-chip de-embedding for accurate evaluation of symmetric devices,\u201d Japanese Journal of Applied Physics <b>47<\/b> (2008) 2812 (DOI: 10.1143\/JJAP.47.2812)."},{"key":"30","unstructured":"[30] W.R. Eisenstadt and Y. Eo: \u201cS-parameter-based IC interconnect transmission line characterization,\u201d IEEE Trans. Compon., Hybrids, Manuf. Technol. <b>15<\/b> (1992) 483 (DOI: 10.1109\/33.159877)."},{"key":"31","unstructured":"[31] S.J. Leon: <i>Linear Algebra with Applications<\/i> (Pearson Education, London, 2015) 9th ed. 214."},{"key":"32","unstructured":"[32] J.E. 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