{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,11]],"date-time":"2025-12-11T07:38:16Z","timestamp":1765438696734},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"4","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2021,2,25]]},"DOI":"10.1587\/elex.18.20200425","type":"journal-article","created":{"date-parts":[[2021,1,31]],"date-time":"2021-01-31T22:07:26Z","timestamp":1612130846000},"page":"20200425-20200425","source":"Crossref","is-referenced-by-count":3,"title":["Collaborative thermal- and traffic-aware adaptive routing scheme for 3D network-on-chip systems"],"prefix":"10.1587","volume":"18","author":[{"given":"Lili","family":"Shen","sequence":"first","affiliation":[{"name":"College of Electronic and Information Engineering, Nanjing University of Aeronautics and Astronautics"},{"name":"Jincheng College, Nanjing University of Aeronautics and Atronautics"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ning","family":"Wu","sequence":"additional","affiliation":[{"name":"College of Electronic and Information Engineering, Nanjing University of Aeronautics and Astronautics"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gaizhen","family":"Yan","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Anhui Science and Technology University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fen","family":"Ge","sequence":"additional","affiliation":[{"name":"College of Electronic and Information Engineering, Nanjing University of Aeronautics and Astronautics"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","unstructured":"[1] L.P. 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Jheng, <i>et al.<\/i>: \u201cTraffic-thermal mutual-coupling co- simulation platform for three-dimensional network-on-chip,\u201d IEEE Int. Symp. VLSI Des. Autom. Test (2010) 135 (DOI: 10.1109\/VDAT.2010.5496709)."},{"key":"29","unstructured":"[29] V. Cataniz, <i>et al.<\/i>: \u201cCycle-accurate network on chip simulation with noxim,\u201d ACM Trans. Modeling Comput. Simul. <b>27<\/b> (2016) 1 (DOI: 10.1145\/2953878)."},{"key":"30","unstructured":"[30] W. Huang, <i>et al.<\/i>: \u201cHotSpot: a compact thermal modeling methodology for early-stage VLSI design,\u201d IEEE Trans. Very Large Scale Integr. Syst. <b>14<\/b> (2006) 501 (DOI: 10.1109\/TVLSI.2006.876103)."}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/18\/4\/18_18.20200425\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,2,27]],"date-time":"2021-02-27T03:36:25Z","timestamp":1614396985000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/18\/4\/18_18.20200425\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,2,25]]},"references-count":30,"journal-issue":{"issue":"4","published-print":{"date-parts":[[2021]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.18.20200425","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,2,25]]}}}