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He, <i>et al.<\/i>: \u201cStudy on a conformal shielding structure with conductive adhesive coated on molding compound in 3-D packages,\u201d IEEE Trans. Electromagn. Compat. <b>58<\/b> (2016) 442 (DOI: 10.1109\/TEMC.2015.2503729).","DOI":"10.1109\/TEMC.2015.2503729"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] A.O. Watanabe, <i>et al.<\/i>: \u201cHighly-effective integrated EMI shields with graphene and nanomagnetic multilayered composites,\u201d IEEE 66th Electronic Components and Technology Conference (ECTC) (2016) 206 (DOI: 10.1109\/ECTC.2016.294).","DOI":"10.1109\/ECTC.2016.294"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] K. 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