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Zhang, <i>et al.<\/i>: \u201cA flip-chip packaging design with waveguide output on single-layer alumina board for E-band applications,\u201d IEEE Trans. Microw. Theory Techn. <b>64<\/b> (2016) 1255 (DOI: 10.1109\/TMTT.2016.2536602)."},{"key":"2","unstructured":"[2] X. Xu, <i>et al.<\/i>: \u201cPlate-laminated waveguide monopulse slot array antenna with full-corporate-feed in the E-band,\u201d IEICE Trans. Commun. <b>E100-B<\/b> (2017) 575 (DOI: 10.1587\/transcom.2016EBP3271)."},{"key":"3","unstructured":"[3] V. Miraftab, <i>et al.<\/i>: \u201cA wideband low cost E-band SIW antenna array for high capacity mmWave radio,\u201d 2015 IEEE MTT-S International Microwave Symposium (2015) 1 (DOI: 10.1109\/MWSYM.2015.7167055)."},{"key":"4","unstructured":"[4] S.S.M. Chung, <i>et al.<\/i>: \u201cPreliminary design of 94 GHz E-band phase array antenna for future mobile communication,\u201d 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) (2016) 899 (DOI: 10.1109\/APEMC.2016.7522903)."},{"key":"5","unstructured":"[5] A. Bessemoulin, <i>et al.<\/i>: \u201cSoldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging,\u201d 2016 IEEE MTT-S International Microwave Symposium (IMS) (2016) 1 (DOI: 10.1109\/MWSYM.2016.7540025)."},{"key":"6","unstructured":"[6] K. Fujiwara and T. Kobayashi: \u201cLow transmission loss, simple, and broadband waveguide-to-microstrip line transducer in V-, E- and W-band,\u201d IEICE Electron. Express <b>14<\/b> (2017) 20170631 (DOI: 10.1587\/elex.14.20170631)."},{"key":"7","unstructured":"[7] S. Zihir, <i>et al.<\/i>: \u201c60-GHz 64- and 256-elements wafer-scale phased-array transmitters using full-reticle and subreticle stitching techniques,\u201d IEEE Trans. Microw. Theory Techn. <b>17<\/b> (2016) 4701 (DOI: 10.1109\/TMTT.2016.2623948)."},{"key":"8","unstructured":"[8] H. Wang: \u201cCurrent status and future trends for Si and compound MMICs in millimeter-wave regime and related issues for system on chip (SOC) and\/or system in package (SIP) applications,\u201d 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (2010) 16 (DOI: 10.1109\/SMIC.2010.5422975)."},{"key":"9","unstructured":"[9] S. Hwangbo, <i>et al.<\/i>: \u201cIntegrated compact planar inverted-F antenna (PIFA) with a shorting via wall for millimeter-wave wireless chip-to-chip (C2C) communications in 3D-SiP,\u201d 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (2019) 983 (DOI: 10.1109\/ECTC.2019.00154)."},{"key":"10","unstructured":"[10] Y. Tian, <i>et al.<\/i>: \u201cA compact Ka-band antenna-in-package for system-in-package application,\u201d IEICE Electron. Express <b>14<\/b> (2017) 20170444 (DOI: 10.1587\/elex.14.20170444)."},{"key":"11","unstructured":"[11] A. Bhutani, <i>et al.<\/i>: \u201cPartially molded antenna-in-package concept for 122 GHz SiGe radar sensor,\u201d 12th European Conference on Antennas and Propagation (EuCAP) (2018) 1 (DOI: 10.1049\/cp.2018.0938)."},{"key":"12","unstructured":"[12] Q.-Q. He, <i>et al.<\/i>: \u201cResearch on structurally integrated phased array for wireless communications,\u201d IEEE Access <b>8<\/b> (2020) 52359 (DOI: 10.1109\/ACCESS.2020.2980595)."},{"key":"13","unstructured":"[13] B. Zhang, <i>et al.<\/i>: \u201cIntegration of a 140 GHz packaged LTCC grid array antenna with an InP detector,\u201d IEEE Trans. Compon. Packag. <b>5<\/b> (2015) 1060 (DOI: 10.1109\/TCPMT.2015.2453407)."},{"key":"14","unstructured":"[14] A. Rashidian, <i>et al.<\/i>: \u201cCompact 60 GHz phased-array antennas with enhanced radiation properties in flip-chip BGA packages,\u201d IEEE Trans. Antennas Propag. <b>67<\/b> (2019) 1605 (DOI: 10.1109\/TAP.2018.2888810)."},{"key":"15","unstructured":"[15] A. Di Carlofelice, <i>et al.<\/i>: \u201cCompact and reliable T\/R module prototype for advanced space active electronically steerable antenna in 3-D LTCC technology,\u201d IEEE Trans. Microw. Theory Techn. <b>66<\/b> (2018) 2746 (DOI: 10.1109\/TMTT.2018.2816020)."},{"key":"16","doi-asserted-by":"crossref","unstructured":"[16] R. Hosono, <i>et al.<\/i>: \u201cDevelopment of millimeter-wave devices based on liquid crystal polymer (LCP) substrate,\u201d IEICE Electron. Express <b>14<\/b> (2017) 20172001 (DOI: org\/10.1587\/elex.14.20172001).","DOI":"10.1587\/elex.14.20172001"},{"key":"17","unstructured":"[17] Y. Zhang, <i>et al.<\/i>: \u201cPackaging of high-gain multichip module in multilayer LCP substrates at W-band,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>7<\/b> (2017) 1655 (DOI: 10.1109\/TCPMT.2017.2737550)."},{"key":"18","unstructured":"[18] Y. Zhang, <i>et al.<\/i>: \u201cMultilayer liquid crystal polymer based RF frontend module for millimeter wave imaging,\u201d IEEE Antennas and Propagation Society International Symposium (APSURSI) (2014) 1700 (DOI: 10.1109\/APS.2014.6905176)."},{"key":"19","unstructured":"[19] T. Kamgaing, <i>et al.<\/i>: \u201cUltra-thin dual polarized millimeter-wave phased array system-in-package with embedded transceiver chip,\u201d 2015 IEEE MTT-S International Microwave Symposium (2015) 1 (DOI: 10.1109\/MWSYM.2015.7166967)."},{"key":"20","unstructured":"[20] R. Pilard, <i>et al.<\/i>: \u201cHDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution,\u201d Proceedings of the 2012 IEEE International Symposium on Antennas and Propagation (2012) 1 (DOI: 10.1109\/APS.2012.6348633)."},{"key":"21","unstructured":"[21] A. Fischer, <i>et al.<\/i>: \u201c77-GHz multi-channel radar transceiver with antenna in package,\u201d IEEE Trans. Antennas Propag. <b>62<\/b> (2014) 1386 (DOI: 10.1109\/TAP.2013.2294206)."},{"key":"22","unstructured":"[22] A. Stelzer and R. Feger: \u201cIntegrated microwave sensors in SiGe with antenna in package: from concepts to solutions,\u201d 2016 22nd International Conference on Applied Electromagnetics and Communications (ICECOM) (2016) 1 (DOI: 10.1109\/ICECom.2016.7843873)."},{"key":"23","unstructured":"[23] M. Wojnowski, <i>et al.<\/i>: \u201cEmbedded wafer level ball grid array (eWLB) technology for millimeter-wave applications,\u201d 2011 IEEE 13th Electronics Packaging Technology Conference (2011) 423 (DOI: 10.1109\/EPTC.2011.6184458)."},{"key":"24","unstructured":"[24] R. Li, <i>et al.<\/i>: \u201cEmbedded wafer level packaging for 77-GHz automotive radar front-end with through silicon via and its 3-D integration,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>3<\/b> (2013) 1481 (DOI: 10.1109\/TCPMT.2012.2236385)."},{"key":"25","unstructured":"[25] Z. Tong, <i>et al.<\/i>: \u201cRadiation performance enhancement of E-band antenna in package,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>3<\/b> (2013) 1953 (DOI: 10.1109\/TCPMT.2013.2272039)."},{"key":"26","unstructured":"[26] Y. Zhang and J. Mao: \u201cAn overview of the development of antenna-in-package technology for highly integrated wireless devices,\u201d Proc. IEEE <b>107<\/b> (2019) 2265 (DOI: 10.1109\/JPROC.2019.2933267)."},{"key":"27","unstructured":"[27] Z. Yong-zhi and W. Shao-dong: \u201cA novel 3D T\/R module with MEMS technology,\u201d 2016 International Conference on Integrated Circuits and Microsystems (ICICM) (2016) 286 (DOI: 10.1109\/ICAM.2016.7813609)."},{"key":"28","unstructured":"[28] W. Zhong, <i>et al.<\/i>: \u201cMiniaturized millimeter-wave silicon-based transceiver system-in-package for FMCW radar,\u201d 2018 11th UK-Europe-China Workshop on Millimeter Waves and Terahertz Technologies (UCMMT) (2018) 1 (DOI: 10.1109\/UCMMT45316.2018.9015921)."},{"key":"29","unstructured":"[29] C. Jin, <i>et al.<\/i>: \u201cAntenna-in-package design based on wafer-level packaging with through silicon via technology,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>3<\/b> (2013) 1498 (DOI: 10.1109\/TCPMT.2013.2261855)."},{"key":"30","unstructured":"[30] Y. Sun, <i>et al.<\/i>: \u201cDesign, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers,\u201d 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (2020) 2230 (DOI: 10.1109\/ECTC32862.2020.00347)."},{"key":"31","unstructured":"[31] O.E. Bouayadi, <i>et al.<\/i>: \u201cSilicon interposer: a versatile platform towards full-3D integration of wireless systems at millimeter-wave frequencies,\u201d 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (2015) 973 (DOI: 10.1109\/ECTC.2015.7159713)."},{"key":"32","unstructured":"[32] T. Zwick, <i>et al.<\/i>: \u201cPea-sized mmW transceivers: QFN-based packaging concepts for millimeter-wave transceivers,\u201d IEEE Microw. Mag. <b>18<\/b> (2017) 79 (DOI: 10.1109\/MMM.2017.2712020)."},{"key":"33","unstructured":"[33] H. 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