{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,15]],"date-time":"2025-11-15T04:02:22Z","timestamp":1763179342739},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"3","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2022,2,10]]},"DOI":"10.1587\/elex.18.20210515","type":"journal-article","created":{"date-parts":[[2021,12,28]],"date-time":"2021-12-28T22:08:35Z","timestamp":1640729315000},"page":"20210515-20210515","source":"Crossref","is-referenced-by-count":4,"title":["A miniature TSV-based branch line coupler using \u03c0 equivalent circuit model for transmission line"],"prefix":"10.1587","volume":"19","author":[{"given":"Fengjuan","family":"Wang","sequence":"first","affiliation":[{"name":"Shannxi Key Laboratory of Complex System Control and Intelligent Information Processing, Xi\u2019an University of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sa","family":"Xiao","sequence":"additional","affiliation":[{"name":"Shannxi Key Laboratory of Complex System Control and Intelligent Information Processing, Xi\u2019an University of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiangkun","family":"Yin","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ningmei","family":"Yu","sequence":"additional","affiliation":[{"name":"Shannxi Key Laboratory of Complex System Control and Intelligent Information Processing, Xi\u2019an University of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan","family":"Yang","sequence":"additional","affiliation":[{"name":"Shannxi Key Laboratory of Complex System Control and Intelligent Information Processing, Xi\u2019an University of Technology"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] D.A. Letavin: \u201cMiniature branch-line coupler structure analysis,\u201d 2017 18th International Conference of Young Specialists on Micro\/Nanotechnologies and Electron Devices (EDM) (2017) 99 (DOI: 10.1109\/EDM.2017.7981717).","DOI":"10.1109\/EDM.2017.7981717"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] X. Yu and S. Sun: \u201cDesign of rf\/microwave planar crossovers using pure-series-connected lumped elements,\u201d 2017 IEEE International Symposium on Antennas and Propagation &amp; USNC\/URSI National Radio Science Meeting (2017) 2231 (DOI: 10.1109\/APUSNCURSINRSM.2017.8073158).","DOI":"10.1109\/APUSNCURSINRSM.2017.8073158"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] Q. Zhang, <i>et al<\/i>.: \u201cA miniaturized directional coupler with high isolation for RFID reader,\u201d 2016 IEEE International Conference on Ubiquitous Wireless Broadband (ICUWB) (2016) 1 (DOI: 10.1109\/ICUWB.2016.7790496).","DOI":"10.1109\/ICUWB.2016.7790496"},{"key":"4","unstructured":"[4] J. Jin and F. Xu: \u201cLow-loss, wideband 3dB hybrid coupler based on AMC for 5G millimeter-wave application,\u201d 2019 International Symposium on Antennas and Propagation (ISAP) (2019) 1."},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] S. Liao, <i>et al<\/i>.: \u201cA novel compact-size branch-line coupler,\u201d IEEE Microw. Wireless Compon. Lett. <b>15<\/b> (2005) 588 (DOI: 10.1109\/LMWC.2005.855378).","DOI":"10.1109\/LMWC.2005.855378"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] D. Titz, <i>et al<\/i>.: \u201cNew wideband miniature branch line coupler on IPD technology for beamforming applications,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>4<\/b> (2014) 911 (DOI: 10.1109\/TCPMT.2014.2311092).","DOI":"10.1109\/TCPMT.2014.2311092"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] F. Wang, <i>et al<\/i>.: \u201cA novel guard method of through-silicon-via (TSV),\u201d IEICE Electron. Express <b>15<\/b> (2018) 20180421 (DOI: 10.1587\/elex.15.20180421).","DOI":"10.1587\/elex.15.20180421"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] L. Qian, <i>et al<\/i>.: \u201cThrough-silicon via-based capacitor and its application in LDO regulator design,\u201d IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>27<\/b> (2019) 1947 (DOI: 10.1109\/TVLSI.2019.2904200).","DOI":"10.1109\/TVLSI.2019.2904200"},{"key":"9","doi-asserted-by":"crossref","unstructured":"[9] X. Yin, <i>et al<\/i>.: \u201cAnalytical models of AC inductance and quality factor for TSV-based inductor,\u201d IEICE Electron. Express <b>18<\/b> (2021) 20210319 (DOI: 10.1587\/elex.18.20210319).","DOI":"10.1587\/elex.18.20210319"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] Q. Lu, <i>et al<\/i>.: \u201cHigh-frequency electrical model of through-silicon vias for 3-D integrated circuits considering eddy-current and proximity effects,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>7<\/b> (2017) 2036 (DOI: 10.1109\/TCPMT.2017.2741340).","DOI":"10.1109\/TCPMT.2017.2741340"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] Y. Yang, <i>et al<\/i>.: \u201cNew coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs),\u201d IEICE Electron. Express <b>13<\/b> (2016) 20160192 (DOI: 10.1587\/elex.13.20160192).","DOI":"10.1587\/elex.13.20160192"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] Y.P.R. Lamy, <i>et al<\/i>.: \u201cRF characterization and analytical modelling of through silicon vias and coplanar waveguides for 3D integration,\u201d IEEE Trans. Adv. Packag. <b>33<\/b> (2010) 1072 (DOI: 10.1109\/TADVP.2010.2046166).","DOI":"10.1109\/TADVP.2010.2046166"},{"key":"13","doi-asserted-by":"crossref","unstructured":"[13] T. Lu, <i>et al<\/i>.: \u201cThermal aware high frequency characterization of large-scale through-silicon-via structures,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>4<\/b> (2014) 1015 (DOI: 10.1109\/TCPMT.2014.2312136).","DOI":"10.1109\/TCPMT.2014.2312136"},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] F. Wang, <i>et al<\/i>.: \u201cCharacteristics of coaxial-annular through-silicon-via in microwave field,\u201d 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (2016) 1219 (DOI: 10.1109\/ICEPT.2016.7583343).","DOI":"10.1109\/ICEPT.2016.7583343"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] P.A. Thadesar, <i>et al<\/i>.: \u201cNovel through-silicon via technologies for 3D system integration,\u201d 2013 IEEE International Interconnect Technology Conference IITC (2013) 1 (DOI: 10.1109\/IITC.2013.6615595).","DOI":"10.1109\/IITC.2013.6615595"},{"key":"16","doi-asserted-by":"crossref","unstructured":"[16] Y. Liu, <i>et al<\/i>.: \u201cTemperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV),\u201d IEICE Electron. Express <b>15<\/b> (2018) 20180878 (DOI: 10.1587\/elex.15.20180878).","DOI":"10.1587\/elex.15.20180878"},{"key":"17","doi-asserted-by":"crossref","unstructured":"[17] Q. Lu, <i>et al<\/i>.: \u201c3-D compact 3-dB branch-line directional couplers based on through-silicon via technology for millimeter-wave applications,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>9<\/b> (2019) 1855 (DOI: 10.1109\/TCPMT.2019.2927553).","DOI":"10.1109\/TCPMT.2019.2927553"},{"key":"18","doi-asserted-by":"crossref","unstructured":"[18] F. Wang and N. Yu: \u201cAn ultracompact butterworth low-pass filter based on coaxial through-silicon vias,\u201d IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>25<\/b> (2017) 1164 (DOI: 10.1109\/TVLSI.2016.2620460).","DOI":"10.1109\/TVLSI.2016.2620460"},{"key":"19","doi-asserted-by":"crossref","unstructured":"[19] F. Wang, <i>et al<\/i>.: \u201cFabrication and measurement of 3D LPF based on coaxial TSV,\u201d Electronics Letters <b>55<\/b> (2019) 102 (DOI: 10.1049\/el.2018.7325).","DOI":"10.1049\/el.2018.7325"},{"key":"20","doi-asserted-by":"crossref","unstructured":"[20] X. Liu, <i>et al<\/i>.: \u201cWideband substrate integrated waveguide bandpass filter based on 3-D ICs,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>9<\/b> (2019) 728 (DOI: 10.1109\/TCPMT.2018.2878863).","DOI":"10.1109\/TCPMT.2018.2878863"},{"key":"21","doi-asserted-by":"crossref","unstructured":"[21] F. Wang, <i>et al<\/i>.: \u201cTSV-based hairpin bandpass filter for 6G mobile communication applications,\u201d IEICE Electron. Express <b>18<\/b> (2021) 20210247 (DOI: 10.1587\/elex.18.20210247).","DOI":"10.1587\/elex.18.20210247"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] K.R. Shin, <i>et al<\/i>.: \u201cCompact 5G n77 band pass filter with through silicon via (TSV) IPD technology,\u201d 2019 IEEE 20th Wireless and Microwave Technology Conference (WAMICON) (2019) 1 (DOI: 10.1109\/WAMICON.2019.8765433).","DOI":"10.1109\/WAMICON.2019.8765433"},{"key":"23","doi-asserted-by":"crossref","unstructured":"[23] F. Wang, <i>et al<\/i>.: \u201cMiniaturized SIW bandpass filter based on TSV technology for THz applications,\u201d IEEE Trans. THz Sci. Technol. <b>4<\/b> (2020) 423 (DOI: 10.1109\/TTHZ.2020.2974091).","DOI":"10.1109\/TTHZ.2020.2974091"},{"key":"24","doi-asserted-by":"crossref","unstructured":"[24] S. Sharma and D. K. Sharma: \u201cDesign and simulation of quadrature branch-line coupler for S band applications,\u201d 2018 2nd International Conference on Micro-Electronics and Telecommunication Engineering (ICMETE) (2018) 240 (DOI: 10.1109\/ICMETE.2018.00060).","DOI":"10.1109\/ICMETE.2018.00060"},{"key":"25","unstructured":"[25] M.B. Tayel and H.S. Alhakami: \u201cOptimaization and design a wideband 3dB multisection quadrature coupler for 2.5GHz,\u201d International Conference on Mobile IT Convergence (2011) 9."},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] F. Wang and N. Yu: \u201cSimple and accurate inductance model of 3D inductor based on TSV,\u201d Electron. <b>52<\/b> (2016) 1815 (DOI: 10.1049\/el.2016.2241).","DOI":"10.1049\/el.2016.2241"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[27] Y. Lin and J. Lee: \u201cMiniature butler matrix design using glass-based thin-film integrated passive device technology for 2.5-GHz applications,\u201d IEEE Trans. Microw. Theory Techn. <b>61<\/b> (2013) 2594 (DOI: 10.1109\/TMTT.2013.2261540).","DOI":"10.1109\/TMTT.2013.2261540"},{"key":"28","doi-asserted-by":"crossref","unstructured":"[28] J.G. Chi and Y.J. Kim: \u201cA compact wideband millimeter-wave quadrature hybrid coupler using artificial transmission lines on a glass substrate,\u201d IEEE Microw. Wireless Compon. Lett. <b>30<\/b> (2020) 1037 (DOI: 10.1109\/LMWC.2020.3027921).","DOI":"10.1109\/LMWC.2020.3027921"},{"key":"29","doi-asserted-by":"crossref","unstructured":"[29] T.N. Kuo, <i>et al<\/i>.: \u201cA compact LTCC branch-line coupler using modified-T equivalent-circuit modelfor transmission line,\u201d IEEE Microw. Wireless Compon. Lett. <b>16<\/b> (2006) 90 (DOI: 10.1109\/LMWC.2005.863194).","DOI":"10.1109\/LMWC.2005.863194"},{"key":"30","doi-asserted-by":"crossref","unstructured":"[30] T. Djerafi and K. Wu: \u201cSuper-compact substrate integrated waveguide cruciform directional coupler,\u201d IEEE Microw. Wireless Compon. Lett. <b>17<\/b> (2007) 7577 (DOI: 10.1109\/LMWC.2007.908040).","DOI":"10.1109\/LMWC.2007.908040"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/19\/3\/19_18.20210515\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,2,12]],"date-time":"2022-02-12T04:02:34Z","timestamp":1644638554000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/19\/3\/19_18.20210515\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,2,10]]},"references-count":30,"journal-issue":{"issue":"3","published-print":{"date-parts":[[2022]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.18.20210515","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,2,10]]},"article-number":"18.20210515"}}