{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,24]],"date-time":"2025-10-24T08:27:28Z","timestamp":1761294448175},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"14","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2022,7,25]]},"DOI":"10.1587\/elex.19.20220122","type":"journal-article","created":{"date-parts":[[2022,3,24]],"date-time":"2022-03-24T22:10:57Z","timestamp":1648159857000},"page":"20220122-20220122","source":"Crossref","is-referenced-by-count":9,"title":["Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package"],"prefix":"10.1587","volume":"19","author":[{"given":"Ying","family":"Chen","sequence":"first","affiliation":[{"name":"System Packaging and Integration Technology Center, Institute of Microelectronics of Chinese Academy of Sciences"},{"name":"School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Science"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jun","family":"Li","sequence":"additional","affiliation":[{"name":"System Packaging and Integration Technology Center, Institute of Microelectronics of Chinese Academy of Sciences"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fei","family":"Ding","sequence":"additional","affiliation":[{"name":"System Packaging and Integration Technology Center, Institute of Microelectronics of Chinese Academy of Sciences"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liqiang","family":"Cao","sequence":"additional","affiliation":[{"name":"System Packaging and Integration Technology Center, Institute of Microelectronics of Chinese Academy of Sciences"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] Y.P. Zhang and D. Liu: \u201cAntenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications,\u201d IEEE Trans. Antennas Propag. <b>57<\/b> (2009) 2830 (DOI: 10.1109\/TAP.2009.2029295).","DOI":"10.1109\/TAP.2009.2029295"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] M. Alibakhshikenari, <i>et al<\/i>.: \u201cHigh-gain on-chip antenna design on silicon layer with aperture excitation for terahertz applications,\u201d IEEE Antennas Wireless Propag. Lett. <b>19<\/b> (2020) 1576 (DOI: 10.1109\/LAWP.2020.3010865).","DOI":"10.1109\/LAWP.2020.3010865"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] S.N. Nallandhigal, <i>et al<\/i>.: \u201cDeep integration and topological cohabitation of active circuits and antennas for power amplification and radiation in standard CMOS,\u201d IEEE Trans. Microw. Theory Techn. <b>68<\/b> (2020) 4405 (DOI: 10.1109\/TMTT.2020.2997049).","DOI":"10.1109\/TMTT.2020.2997049"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] M. Nafe, <i>et al<\/i>.: \u201cGain enhanced on-chip folded dipole antenna utilizing artificial magnetic conductor at 94GHz,\u201d IEEE Antennas Wireless Propag. Lett. <b>16<\/b> (2017) 2844 (DOI: 10.1109\/LAWP.2017.2749308).","DOI":"10.1109\/LAWP.2017.2749308"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] D.G. Kam, <i>et al<\/i>.: \u201cLTCC packages with embedded phased-array antennas for 60GHz communications,\u201d IEEE Microw. Wireless Compon. Lett. <b>21<\/b> (2011) 142 (DOI: 10.1109\/LMWC.2010.2103932).","DOI":"10.1109\/LMWC.2010.2103932"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] T. Tajima, <i>et al<\/i>.: \u201c300-GHz step-profiled corrugated horn antennas integrated in LTCC,\u201d IEEE Trans. Antennas Propag. <b>62<\/b> (2014) 5437 (DOI: 10.1109\/TAP.2014.2350520).","DOI":"10.1109\/TAP.2014.2350520"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] A. Bisognin, <i>et al<\/i>.: \u201cNoncollimating MMW polyethylene lens mitigating dual-source offset from a Tx\/Rx WiGig module,\u201d IEEE Trans. Antennas Propag. <b>63<\/b> (2015) 5908 (DOI: 10.1109\/TAP.2015.2484420).","DOI":"10.1109\/TAP.2015.2484420"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] A. Townley, <i>et al<\/i>.: \u201cA 94-GHz 4TX-4RX phased-array FMCW radar transceiver with antenna-in-package,\u201d IEEE J. Solid-State Circuits <b>52<\/b> (2017) 1245 (DOI: 10.1109\/JSSC.2017.2675907).","DOI":"10.1109\/JSSC.2017.2675907"},{"key":"9","doi-asserted-by":"crossref","unstructured":"[9] A. Bisognin, <i>et al<\/i>.: \u201cBall grid array module with integrated shaped lens for 5G backhaul\/fronthaul communications in F-band,\u201d IEEE Trans. Antennas Propag. <b>65<\/b> (2017) 6380 (DOI: 10.1109\/TAP.2017.2755439).","DOI":"10.1109\/TAP.2017.2755439"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] C. Beck, <i>et al<\/i>.: \u201cIndustrial mmWave radar sensor in embedded wafer-level BGA packaging technology,\u201d IEEE Sensors J. <b>16<\/b> (2016) 6566 (DOI: 10.1109\/JSEN.2016.2587731).","DOI":"10.1109\/JSEN.2016.2587731"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] I. Nasr, <i>et al<\/i>.: \u201cA highly integrated 60GHz 6-channel transceiver with antenna in package for smart sensing and short-range communications,\u201d IEEE J. Solid-State Circuits <b>51<\/b> (2016) 2066 (DOI: 10.1109\/JSSC.2016.2585621).","DOI":"10.1109\/JSSC.2016.2585621"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] M. Al Henawy and M. Schneider: \u201cIntegrated antennas in eWLB packages for 77GHz and 79GHz automotive radar sensors,\u201d 2011 8th European Radar Conference (2011) 424 (DOI: 10.23919\/EuMC.2011.6102012).","DOI":"10.23919\/EuMC.2011.6102012"},{"key":"13","doi-asserted-by":"crossref","unstructured":"[13] C.-H. Tsai, <i>et al<\/i>.: \u201cArray antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications,\u201d 2013 IEEE International Electron Devices Meeting (2013) 25.1.1 (DOI: 10.1109\/IEDM.2013.6724687).","DOI":"10.1109\/IEDM.2013.6724687"},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] Z. Duan, <i>et al<\/i>.: \u201c14.6 A 76-to-81GHz 2\u00d78 FMCW MIMO radar transceiver with fast chirp generation and multi-feed antenna-in-package array,\u201d 2021 IEEE International Solid- State Circuits Conference (ISSCC) (2021) 228 (DOI: 10.1109\/ISSCC42613.2021.9365933).","DOI":"10.1109\/ISSCC42613.2021.9365933"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] B. Keser and S. Kroehnert: <i>Advances in Embedded and Fan-Out Wafer Level Packaging Technologies<\/i> (Wiley-IEEE Press, 2019) 51 (DOI: 10.1002\/9781119313991).","DOI":"10.1002\/9781119313991"},{"key":"16","doi-asserted-by":"crossref","unstructured":"[16] D. Liu and Y. Zhang: <i>Antenna-in-Package Technology and Applications<\/i> (Wiley-IEEE Press, 2020) 219 (DOI: 10.1002\/9781119556671).","DOI":"10.1002\/9781119556671"},{"key":"17","doi-asserted-by":"crossref","unstructured":"[17] J. Hasch, <i>et al<\/i>.: \u201cMillimeter-wave technology for automotive radar sensors in the 77GHz frequency band,\u201d IEEE Trans. Microw. Theory Techn. <b>60<\/b> (2012) 845 (DOI: 10.1109\/TMTT.2011.2178427).","DOI":"10.1109\/TMTT.2011.2178427"},{"key":"18","doi-asserted-by":"crossref","unstructured":"[18] J. Xu, <i>et al<\/i>.: \u201cAn array antenna for both long- and medium-range 77GHz automotive radar applications,\u201d IEEE Trans. Antennas Propag. <b>65<\/b> (2017) 7207 (DOI: 10.1109\/TAP.2017.2761549).","DOI":"10.1109\/TAP.2017.2761549"},{"key":"19","doi-asserted-by":"crossref","unstructured":"[19] J. Zhao, <i>et al<\/i>.: \u201cHybrid antenna arrays with high angular resolution for 77GHz automotive radars,\u201d IEICE Electron. Express <b>17<\/b> (2020) 20190687 (DOI: 10.1587\/elex.16.20190687).","DOI":"10.1587\/elex.16.20190687"},{"key":"20","doi-asserted-by":"crossref","unstructured":"[20] J.P. Zhang, <i>et al<\/i>.: \u201cA substrate integrated waveguide slot antenna for 79-GHz applications,\u201d 2018 International Workshop on Antenna Technology (iWAT) (2018) 1 (DOI: 10.1109\/IWAT.2018.8379184).","DOI":"10.1109\/IWAT.2018.8379184"},{"key":"21","doi-asserted-by":"crossref","unstructured":"[21] L. Giauffret and J.M. Laheurte: \u201cTheoretical and experimental characterisation of CPW-fed microstrip antennas,\u201d IEE Proceedings-Microwaves, Antennas and Propagation <b>143<\/b> (2002) 13 (DOI: 10.1049\/ip-map: 19960077).","DOI":"10.1049\/ip-map:19960077"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] L. Giauffret, <i>et al<\/i>.: \u201cStudy of various shapes of the coupling slot in CPW-fed microstrip antennas,\u201d IEEE Trans. Antennas Propag. <b>45<\/b> (1997) 642 (DOI: 10.1109\/8.564090).","DOI":"10.1109\/8.564090"},{"key":"23","doi-asserted-by":"crossref","unstructured":"[23] H. Dong, <i>et al<\/i>.: \u201cA low-loss fan-out wafer-level package with a novel redistribution layer pattern and its measurement methodology for millimeter-wave application,\u201d IEEE Trans. Compon., Packag. Manuf. Technol. <b>10<\/b> (2020) 1073 (DOI: 10.1109\/TCPMT.2020.3000279).","DOI":"10.1109\/TCPMT.2020.3000279"},{"key":"24","unstructured":"[24] \u201cIEEE recommended practice for near-field antenna measurements,\u201d IEEE Std 1720-2012 (2012) (DOI: 10.1109\/IEEESTD.2012.6375745)."},{"key":"25","doi-asserted-by":"crossref","unstructured":"[25] A.C. Newell, <i>et al<\/i>.: \u201cGain and power parameter measurements using planar near-field techniques,\u201d IEEE Trans. Antennas Propag. <b>36<\/b> (1988) 792 (DOI: 10.1109\/8.1181).","DOI":"10.1109\/8.1181"},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] G.R. Su, <i>et al<\/i>.: \u201c79-GHz wide-beam microstrip patch antenna and antenna array for millimeter-wave applications,\u201d IEEE Access <b>8<\/b> (2020) 200823 (DOI: 10.1109\/ACCESS.2020.3035750).","DOI":"10.1109\/ACCESS.2020.3035750"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[27] M. Mosalanejad, <i>et al<\/i>.: \u201cMulti-layer PCB bow-tie antenna array for (77-81) GHz radar applications,\u201d IEEE Trans. Antennas Propag. <b>68<\/b> (2020) 2379 (DOI: 10.1109\/TAP.2019.2949723).","DOI":"10.1109\/TAP.2019.2949723"},{"key":"28","doi-asserted-by":"crossref","unstructured":"[28] O. Khan, <i>et al<\/i>.: \u201cHybrid thin film antenna for automotive radar at 79GHz,\u201d IEEE Trans. Antennas Propag. <b>65<\/b> (2017) 5076 (DOI: 10.1109\/TAP.2017.2741024).","DOI":"10.1109\/TAP.2017.2741024"},{"key":"29","doi-asserted-by":"crossref","unstructured":"[29] Z. Chen and X. Zhu: \u201cIntegration of mm-wave antennas on fan-out wafer level packaging (FOWLP) for automotive radar applications,\u201d 2019 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) (2019) 168 (DOI: 10.1109\/ICTA48799.2019.9012825).","DOI":"10.1109\/ICTA48799.2019.9012825"},{"key":"30","doi-asserted-by":"crossref","unstructured":"[30] C. Zihao and L.T. Guan: \u201cMillimeter wave resonator and cavity-back slot antenna in fan-out wafer level packaging,\u201d 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (2018) 848 (DOI: 10.1109\/EPTC.2018.8654410).","DOI":"10.1109\/EPTC.2018.8654410"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/19\/14\/19_19.20220122\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,9]],"date-time":"2024-05-09T05:05:48Z","timestamp":1715231148000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/19\/14\/19_19.20220122\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,7,25]]},"references-count":30,"journal-issue":{"issue":"14","published-print":{"date-parts":[[2022]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.19.20220122","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,7,25]]},"article-number":"19.20220122"}}