{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,13]],"date-time":"2026-01-13T22:17:47Z","timestamp":1768342667114,"version":"3.49.0"},"reference-count":32,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"17","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2022,9,10]]},"DOI":"10.1587\/elex.19.20220313","type":"journal-article","created":{"date-parts":[[2022,7,31]],"date-time":"2022-07-31T22:11:47Z","timestamp":1659305507000},"page":"20220313-20220313","source":"Crossref","is-referenced-by-count":3,"title":["Impact of ground solder ball failure in BGA package on near electric field radiation"],"prefix":"10.1587","volume":"19","author":[{"given":"Yidong","family":"Yuan","sequence":"first","affiliation":[{"name":"Beijing Smart-chip Microelectronics Technology Co., Ltd."}]},{"given":"Tianmeng","family":"Zhang","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"}]},{"given":"Ziren","family":"Wang","sequence":"additional","affiliation":[{"name":"China Telecommunication Technology Labs, China Academy of Information and Communications Technology"}]},{"given":"Kaixuan","family":"Song","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"}]},{"given":"Lingyu","family":"Bi","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"}]},{"given":"Lu","family":"Tian","sequence":"additional","affiliation":[{"name":"Beijing Smart-chip Microelectronics Technology Co., Ltd."}]},{"given":"Jinchun","family":"Gao","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] F. 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Bogatin: <i>Signal and Power Integrity: Simplified<\/i> (Pearson Education, 2015) 2nd ed."}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/19\/17\/19_19.20220313\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,9,10]],"date-time":"2022-09-10T05:11:00Z","timestamp":1662786660000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/19\/17\/19_19.20220313\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,9,10]]},"references-count":32,"journal-issue":{"issue":"17","published-print":{"date-parts":[[2022]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.19.20220313","relation":{},"ISSN":["1349-2543"],"issn-type":[{"value":"1349-2543","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,9,10]]},"article-number":"19.20220313"}}