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Ni, <i>et al<\/i>.: \u201cArchitecture of cobweb-based redundant TSV for clustered faults,\u201d IEEE Trans. Very Large Scale Integr. (VLSI) Syst. <b>28<\/b> (2020) 1736 (DOI: 10.1109\/TVLSI.2020.2995094).","DOI":"10.1109\/TVLSI.2020.2995094"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] X. Liu, <i>et al<\/i>.: \u201cWideband substrate integrated waveguide bandpass filter based on 3-D ICs,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>9<\/b> (2019) 728 (DOI: 10.1109\/TCPMT.2018.2878863).","DOI":"10.1109\/TCPMT.2018.2878863"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] Q. Lu, <i>et al<\/i>.: \u201c3-D compact 3-dB branch-line directional couplers based on through-silicon via technology for millimeter-wave applications,\u201d IEEE Trans. Compon. Packag. Manuf. Technol. <b>9<\/b> (2019) 1855 (DOI: 10.1109\/TCPMT.2019.2927553).","DOI":"10.1109\/TCPMT.2019.2927553"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] Z. 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