{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,13]],"date-time":"2025-12-13T03:28:09Z","timestamp":1765596489694,"version":"3.48.0"},"reference-count":34,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"23","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Electron. Express"],"published-print":{"date-parts":[[2025,12,10]]},"DOI":"10.1587\/elex.22.20250514","type":"journal-article","created":{"date-parts":[[2025,10,14]],"date-time":"2025-10-14T22:08:41Z","timestamp":1760479721000},"page":"20250514-20250514","source":"Crossref","is-referenced-by-count":0,"title":["Enhanced high-selectivity miniaturized bandpass filter using stacked glass-based IPD technology"],"prefix":"10.1587","volume":"22","author":[{"given":"Wenjuan","family":"Wu","sequence":"first","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shiwei","family":"Huang","sequence":"additional","affiliation":[{"name":"Xiamen Sky Semiconductor Technology Co., Ltd."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dong","family":"Wei","sequence":"additional","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shuang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Junjie","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yihe","family":"Liu","sequence":"additional","affiliation":[{"name":"Hebei Semiconductor Research Institute"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Hu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wenbiao","family":"Ruan","sequence":"additional","affiliation":[{"name":"Xiamen Sky Semiconductor Technology Co., Ltd."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] T.C. Lee, <i>et al<\/i>.: \u201cGlass based 3D-IPD integrated RF ASIC in WLCSP,\u201d 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (2017) 631 (DOI: 10.1109\/ectc.2017.328).","DOI":"10.1109\/ECTC.2017.328"},{"key":"2","doi-asserted-by":"crossref","unstructured":"[2] A. Schulz, <i>et al<\/i>.: \u201cLaser structured passive components and RF filter in LTCC technology with operating frequencies up to 40\u2006GHz focusing on 5G mobile applications,\u201d 2019 22nd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC) (2019) (DOI: 10.23919\/empc44848.2019.8951846).","DOI":"10.23919\/EMPC44848.2019.8951846"},{"key":"3","doi-asserted-by":"crossref","unstructured":"[3] A. Ghannam, <i>et al<\/i>.: \u201cUltra-compact, high-performance, 3D-IPD integrated using conformal 3D interconnects,\u201d 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (2018) 1082 (DOI: 10.1109\/ectc.2018.00166).","DOI":"10.1109\/ECTC.2018.00166"},{"key":"4","doi-asserted-by":"crossref","unstructured":"[4] A. Ghannam, <i>et al<\/i>.: \u201cUltra-thin QFN-like 3D package with 3D integrated passive devices,\u201d 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (2019) 1789 (DOI: 10.1109\/ectc.2019.00276).","DOI":"10.1109\/ECTC.2019.00276"},{"key":"5","doi-asserted-by":"crossref","unstructured":"[5] M. Ali, <i>et al<\/i>.: \u201cHeterogeneous integration of 5G and millimeter-wave diplexers with 3D glass substrates,\u201d 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (2020) 1376 (DOI: 10.1109\/ectc32862.2020.00218).","DOI":"10.1109\/ECTC32862.2020.00218"},{"key":"6","doi-asserted-by":"crossref","unstructured":"[6] M. Liao, <i>et al<\/i>.: \u201cEmbedded IPD integration solution for large chip module fan-out package,\u201d 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (2024) (DOI: 10.1109\/icept63120.2024.10668691).","DOI":"10.1109\/ICEPT63120.2024.10668691"},{"key":"7","doi-asserted-by":"crossref","unstructured":"[7] J. Liu, <i>et al<\/i>.: \u201cInvestigation of miniaturized differential transformer coupled configuration circuit using ipd technology in advanced package integration,\u201d 2023 IEEE 6th International Conference on Electronic Information and Communication Technology (ICEICT) (2023) 349 (DOI: 10.1109\/iceict57916.2023.10245088).","DOI":"10.1109\/ICEICT57916.2023.10245088"},{"key":"8","doi-asserted-by":"crossref","unstructured":"[8] M. Park, <i>et al<\/i>.: \u201cSilicon-based integrated passive device stack for III-V\/Si monolithic 3D circuits operating on RF band,\u201d Solid-State Electronics <b>221<\/b> (2024) 109012 (DOI: 10.1016\/j.sse.2024.109012).","DOI":"10.1016\/j.sse.2024.109012"},{"key":"9","doi-asserted-by":"crossref","unstructured":"[9] M.I. Khan, <i>et al<\/i>.: \u201cEmbedded passive components in advanced 3D chips and micro\/nano electronic systems,\u201d Microsystem Technologies <b>24<\/b> (2018) 869 (DOI: 10.1007\/s00542-017-3586-3).","DOI":"10.1007\/s00542-017-3586-3"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] M. Liao, <i>et al<\/i>.: \u201cFan-out embedded bridge solution for chiplet\/HBM integration,\u201d 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023) (DOI: 10.1109\/icept59018.2023.10492037).","DOI":"10.1109\/ICEPT59018.2023.10492037"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] F. Kao, <i>et al<\/i>.: \u201cFan-out higher layer heterogeneous solution in HPC application,\u201d 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022) 01 (DOI: 10.1109\/eptc56328.2022.10013122).","DOI":"10.1109\/EPTC56328.2022.10013122"},{"key":"12","doi-asserted-by":"crossref","unstructured":"[12] Z. Zhang, <i>et al<\/i>.: \u201cA compact chip filter for 5G communication frontend based on glass IPD technology,\u201d 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (2021) (DOI: 10.1109\/icept52650.2021.9568182).","DOI":"10.1109\/ICEPT52650.2021.9568182"},{"key":"13","unstructured":"[13] A. P\u00e4rssinen, <i>et al<\/i>.: \u201cWhite paper on RF enabling 6G: opportunities and challenges from technology to spectrum,\u201d White paper, 6G Research Visions, No. 13. University of Oulu (2021)."},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] D. Lu, <i>et al<\/i>.: \u201cMiniaturized two-pole lumped BPF with four controllable TZs using multiple coupling paths,\u201d IEEE Microw. Wireless Compon. Lett. <b>27<\/b> (2017) 563 (DOI: 10.1109\/lmwc.2017.2701301).","DOI":"10.1109\/LMWC.2017.2701301"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] S. Li and Z. Zhang: \u201cCompact multi-order bandpass filter with high stopband rejection performance,\u201d Electronics Letters <b>55<\/b> (2019) 701 (DOI: 10.1049\/el.2019.0840).","DOI":"10.1049\/el.2019.0840"},{"key":"16","doi-asserted-by":"crossref","unstructured":"[16] S. Mar\u0131\u0301n, <i>et al<\/i>.: \u201cMicrostrip filters with enhanced stopband based on lumped bisected Pi-sections with parasitics,\u201d IEEE Microw. Wireless Compon. Lett. <b>27<\/b> (2016) 19 (DOI: 10.1109\/lmwc.2016.2630841).","DOI":"10.1109\/LMWC.2016.2630841"},{"key":"17","doi-asserted-by":"crossref","unstructured":"[17] X.Y. Zhang, <i>et al<\/i>.: \u201cCompact LTCC bandpass filter with wide stopband using discriminating coupling,\u201d IEEE Trans. Compon., Packag. Manuf. Technol. <b>4<\/b> (2014) 656 (DOI: 10.1109\/tcpmt.2013.2297522).","DOI":"10.1109\/TCPMT.2013.2297522"},{"key":"18","doi-asserted-by":"crossref","unstructured":"[18] X. Huang, <i>et al<\/i>.: \u201cLow-loss self-packaged Ka-band LTCC filter using artificial multimode SIW resonator,\u201d IEEE Trans. Circuits Syst. II, Exp. Briefs <b>70<\/b> (2022) 451 (DOI: 10.1109\/tcsii.2022.3173712).","DOI":"10.1109\/TCSII.2022.3173712"},{"key":"19","doi-asserted-by":"crossref","unstructured":"[19] M. Zhang, <i>et al<\/i>.: \u201cMiniaturization design of LC filter based on LTCC,\u201d 2024 International Applied Computational Electromagnetics Society Symposium (ACES-China) (2024) (DOI: 10.1109\/aces-china62474.2024.10699945).","DOI":"10.1109\/ACES-China62474.2024.10699945"},{"key":"20","doi-asserted-by":"crossref","unstructured":"[20] Y. Yang, <i>et al<\/i>.: \u201cA low-loss bandpass filter using edge-coupled resonator with capacitive feeding in (Bi)-CMOS technology,\u201d IEEE Electron Device Lett. <b>39<\/b> (2018) 787 (DOI: 10.1109\/led.2018.2826782).","DOI":"10.1109\/LED.2018.2826782"},{"key":"21","doi-asserted-by":"crossref","unstructured":"[21] E. Fedorov and V. Issakov: \u201cDesign and measurement of a low-loss bandpass filter for Ku-band in 45\u2006nm SOI CMOS,\u201d 2025 16th German Microwave Conference (GeMiC) (2025) 172 (DOI: 10.23919\/gemic64734.2025.10979142).","DOI":"10.23919\/GeMiC64734.2025.10979142"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] Z. Wu, <i>et al<\/i>.: \u201cMiniaturized uwb filters integrated with tunable notch filters using a silicon-based integrated passive device technology,\u201d IEEE Trans. Microw. Theory Techn. <b>60<\/b> (2012) 518 (DOI: 10.1109\/tmtt.2011.2178428).","DOI":"10.1109\/TMTT.2011.2178428"},{"key":"23","doi-asserted-by":"crossref","unstructured":"[23] X. Yang, <i>et al<\/i>.: \u201cA 2nd-order bandpass filter with 1.6-dB insertion loss and 47-dB upper-stopband suppression in 45-nm SOI CMOS technology,\u201d IEEE Electron Device Lett. <b>45<\/b> (2024) 1710 (DOI: 10.1109\/led.2024.3435697).","DOI":"10.1109\/LED.2024.3435697"},{"key":"24","doi-asserted-by":"crossref","unstructured":"[24] H.R. Zhu and W.T. Wang: \u201cHigh selectivity millimeter-wave on-chip band-pass filter with semi-lumped dual-mode resonator by using GaAs technology,\u201d IEEE Electron Device Lett. <b>44<\/b> (2023) 729 (DOI: 10.1109\/led.2023.3254459).","DOI":"10.1109\/LED.2023.3254459"},{"key":"25","doi-asserted-by":"crossref","unstructured":"[25] H.R. Zhu, <i>et al<\/i>.: \u201cCompact, high power capacity, and low insertion loss millimeter-wave on-chip limiting filter with GaAs PIN technology,\u201d IEEE Trans. Circuits Syst. I, Reg. Papers <b>70<\/b> (2022) 1175 (DOI: 10.1109\/tcsi.2022.3228125).","DOI":"10.1109\/TCSI.2022.3228125"},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] Y. Jiang, <i>et al<\/i>.: \u201cBandpass filter with ultra-wide upper stopband on GaAs IPD technology,\u201d IEEE Trans. Circuits Syst. II, Exp. Briefs <b>69<\/b> (2021) 389 (DOI: 10.1109\/tcsii.2021.3096936).","DOI":"10.1109\/TCSII.2021.3096936"},{"key":"27","doi-asserted-by":"crossref","unstructured":"[27] Y. Xu, <i>et al<\/i>.: \u201cWideband high selectivity filter chips with adjustable bandwidth based on IPD technology,\u201d IEEE Trans. Circuits Syst. II, Exp. Briefs <b>69<\/b> (2022) 4273 (DOI: 10.1109\/tcsii.2022.3186182).","DOI":"10.1109\/TCSII.2022.3186182"},{"key":"28","doi-asserted-by":"crossref","unstructured":"[28] J. Onohara, <i>et al<\/i>.: \u201cDevelopment of the integrated passive device using through-glass-via substrate,\u201d 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (2018) 19 (DOI: 10.23919\/icep.2018.8374661).","DOI":"10.23919\/ICEP.2018.8374661"},{"key":"29","doi-asserted-by":"crossref","unstructured":"[29] H. Ma, <i>et al<\/i>.: \u201cA low-loss bandpass filter with stacked double-layer structure using glass-based integrated passive device technology,\u201d IEEE Electron Device Lett. <b>44<\/b> (2023) 1216 (DOI: 10.1109\/led.2023.3275197).","DOI":"10.1109\/LED.2023.3275197"},{"key":"30","doi-asserted-by":"crossref","unstructured":"[30] L. Qian, <i>et al<\/i>.: \u201cInvestigating on through glass via based RF passives for 3-D integration,\u201d IEEE J. Electron Devices Soc. <b>6<\/b> (2018) 755 (DOI: 10.1109\/jeds.2018.2849393).","DOI":"10.1109\/JEDS.2018.2849393"},{"key":"31","doi-asserted-by":"crossref","unstructured":"[31] J. Zhang, <i>et al<\/i>.: \u201cMiniaturized high-selectivity bandpass filter with wide stopband based on through-glass-via IPD technology,\u201d IEEE Electron Device Lett. <b>45<\/b> (2024) 1536 (DOI: 10.1109\/led.2024.3417708).","DOI":"10.1109\/LED.2024.3417708"},{"key":"32","doi-asserted-by":"crossref","unstructured":"[32] W. Li, <i>et al<\/i>.: \u201cGlass-based single-layer slow wave siw filter with embedded composite right-\/left-handed resonator,\u201d IEEE Trans. Microw. Theory Techn. <b>73<\/b> (2024) 1105 (DOI: 10.1109\/tmtt.2024.3440250).","DOI":"10.1109\/TMTT.2024.3440250"},{"key":"33","doi-asserted-by":"crossref","unstructured":"[33] T. Yu, <i>et al<\/i>.: \u201cW-band substrate integrated waveguide IPD bandpass filters using through glass via technology,\u201d IEEE Trans. Microw. Theory Techn. <b>73<\/b> (2025) 5929 (DOI: 10.1109\/tmtt.2025.3531370).","DOI":"10.1109\/TMTT.2025.3531370"},{"key":"34","doi-asserted-by":"crossref","unstructured":"[34] B. Ellis: \u201cThe design of CMOS radio-frequency integrated circuits,\u201d Circuit World <b>30<\/b> (2004) (DOI: 10.1108\/cw.2004.21730dae.002).","DOI":"10.1108\/cw.2004.21730dae.002"}],"container-title":["IEICE Electronics Express"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/22\/23\/22_22.20250514\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,13]],"date-time":"2025-12-13T03:26:18Z","timestamp":1765596378000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/elex\/22\/23\/22_22.20250514\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,12,10]]},"references-count":34,"journal-issue":{"issue":"23","published-print":{"date-parts":[[2025]]}},"URL":"https:\/\/doi.org\/10.1587\/elex.22.20250514","relation":{},"ISSN":["1349-2543"],"issn-type":[{"type":"electronic","value":"1349-2543"}],"subject":[],"published":{"date-parts":[[2025,12,10]]},"article-number":"22.20250514"}}