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Wang, H. Hu, Y. Shen, X. Zhou, and Z. Zheng, \u201cStretchable conductors with ultrahigh tensile strain and stable metallic conductance enabled by prestrained polyelectrolyte nanoplatforms,\u201d Adv. Mater., vol.23, no.27, pp.3090-3094, 2011. 10.1002\/adma.201101120","DOI":"10.1002\/adma.201101120"},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] F.M. Wisser, B. Schumm, G. Mondin, J. Grothe, and S. Kaskel, \u201cPrecursor strategies for metallic nano- and micropatterns using soft lithography,\u201d J. Mater. Chem. C, vol.3, no.12, pp.2717-2731, 2015. 10.1039\/c4tc02418d","DOI":"10.1039\/C4TC02418D"},{"key":"3","doi-asserted-by":"publisher","unstructured":"[3] P. Shah, Y. Kevrekidis, and Jay Benziger, \u201cInk-Jet Printing of Catalyst Patterns for Electroless Metal Deposition,\u201d Langmuir, vol.15, no.4, pp.1584-1587, 1999. 10.1021\/la9809123","DOI":"10.1021\/la9809123"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] P.C. Hidber, W. Helbig, E. Kim, and G.M. Whitesides, \u201cMicrocontact printing of palladium colloids: Micron-scale patterning by electroless deposition of copper,\u201d Langmuir, vol.12, no.5, pp.1375-1380, 1996. 10.1021\/la9507500","DOI":"10.1021\/la9507500"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] A.M. Bittner, X.C. Wu, and K. Kern, \u201cElectroless metallization of dendrimer-coated micropatterns,\u201d Adv. Funct. Mater., vol.12, pp.432-436, 2002. 10.1002\/1616-3028(20020618)12:6\/7&lt;432::aid-adfm432&gt;3.0.co;2-1","DOI":"10.1002\/1616-3028(20020618)12:6\/7<432::AID-ADFM432>3.0.CO;2-1"},{"key":"6","doi-asserted-by":"publisher","unstructured":"[6] L. Xu, J. Liao, L. Huang, D. Ou, Z. Guo, H. Zhang, C. Ge, N. Gu, and J. Liu, \u201cSurface-bound nanoparticles for initiating metal deposition,\u201d Thin. Solid. Films., vol.434, no.1-2, pp.121-125, 2003. 10.1016\/s0040-6090(03)00274-8","DOI":"10.1016\/S0040-6090(03)00274-8"},{"key":"7","doi-asserted-by":"publisher","unstructured":"[7] X. Liu, X. Zhfrou, Y. Li, and Z. Zheng, \u201cSurface-grafted polymer-assisted electroless deposition of metals for flexible and stretchable electronics,\u201d Chem. Asian J., vol.7, no.5, pp.862-870, 2012. 10.1002\/asia.201100946","DOI":"10.1002\/asia.201100946"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] Y. Yu, C. Yan, and Z. Zheng, \u201cPolymer-assisted metal deposition (PAMD): A full-solution strategy for flexible, stretchable, compressible, and wearable metal conductors,\u201d Adv. Mater., vol.26, no.31, pp.5508-5516, 2014. 10.1002\/adma.201305558","DOI":"10.1002\/adma.201305558"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] Y. Lu, \u201cImprovement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition,\u201d Appl. Surf. Sci., vol.256, no.11, pp.3554-3558, 2010. 10.1016\/j.apsusc.2009.12.153","DOI":"10.1016\/j.apsusc.2009.12.153"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] J. Matsui, K. Kubota, Y. Kado, and T. Miyashita, \u201cElectroless copper plating onto polyimide using polymer nanosheet as a nano-adhesive,\u201d Polym. J., vol.39, no.1, pp.41-47, 2007. 10.1295\/polymj.pj2006099","DOI":"10.1295\/polymj.PJ2006099"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] X. Wang, T. Zhang, B. Kobe, W.M. Lau, and J. Yang, \u201cGrafting of polyelectrolytes onto hydrocarbon surfaces by high-energy hydrogen induced cross-linking for making metallized polymer films,\u201d Chem. Commun., vol.47, no.41, pp.4658-4660, 2013. 10.1039\/c3cc41644e","DOI":"10.1039\/c3cc41644e"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] S. Ma, L. Liu, V. Bromberg, and T.J. Singler, \u201cElectroless copper plating of inkjet-printed polydopamine nanoparticles: A facile method to fabricate highly conductive patterns at near room temperature,\u201d ACS Appl. Mater. 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