{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,8,10]],"date-time":"2024-08-10T06:33:21Z","timestamp":1723271601393},"reference-count":17,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"11","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Trans. Electron."],"published-print":{"date-parts":[[2020,11,1]]},"DOI":"10.1587\/transele.2019esp0010","type":"journal-article","created":{"date-parts":[[2020,5,26]],"date-time":"2020-05-26T22:04:25Z","timestamp":1590530665000},"page":"597-604","source":"Crossref","is-referenced-by-count":4,"title":["Evaluation Method of Voltage and Current Distributions on Asymmetrical and Equi-Length Differential-Paired Lines"],"prefix":"10.1587","volume":"E103.C","author":[{"given":"Yoshiki","family":"KAYANO","sequence":"first","affiliation":[{"name":"The University of Electro-Communications"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yoshio","family":"KAMI","sequence":"additional","affiliation":[{"name":"The University of Electro-Communications"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fengchao","family":"XIAO","sequence":"additional","affiliation":[{"name":"The University of Electro-Communications"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"532","reference":[{"key":"1","unstructured":"[1] S. Hall, G.W. Hall, and J.A. McCall, High-speed digital system design: A handbook of interconnect theory and design practices, John Wiley &amp; Sons, INC., New York, 2000."},{"key":"2","unstructured":"[2] H. Johnson and M. Graham, High-speed signal propagation, Prentice Hall PTR, 2003."},{"key":"3","doi-asserted-by":"publisher","unstructured":"[3] B.J. Rubin and B. Singh, \u201cStudy of meander line delay in circuit boards,\u201d IEEE Trans. Microw. Thoery Techn., vol.48, no.9, pp.1452-1460, Sept. 2000. 10.1109\/22.868994","DOI":"10.1109\/22.868994"},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] T. Sudo, J. Kudo, Y. Ko, and K. Ito, \u201cElectrical properties of differential transmission line and meander delay line,\u201d Journal of Japan Institute of Electronics Packaging, vol.4, no.7, pp.562-567, 2001. 10.5104\/jiep.4.562","DOI":"10.5104\/jiep.4.562"},{"key":"5","doi-asserted-by":"publisher","unstructured":"[5] Y. Kayano, K. Mimura, and H. Inoue, \u201cEvaluation of imbalance component and EM radiation generated by an asymmetrical differential-paired lines structure,\u201d Trans. JIEP, vol.4, no.1, pp.6-16, Dec. 2011. 10.5104\/jiepeng.4.6","DOI":"10.5104\/jiepeng.4.6"},{"key":"6","unstructured":"[6] S. Kan, Y. Toyota, K. Iokibe, and T. Watanabe, \u201cSuppression of mode conversion by decreasing path difference by using an asymmetrically tapered bend in differential transmission lines,\u201d Proc. 2014 Int. Symp. EMC, pp.129-132, Tokyo, Japan, May 2014."},{"key":"7","doi-asserted-by":"publisher","unstructured":"[7] C. Gazda, D.V. Ginste, H. Rogier, R.-B. Wu, and D.D. Zutter, \u201cA wideband common-mode suppression filter for bend discontinuties in differential signaling using tightly coupled microstrips,\u201d IEEE Trans. Adv. Packag., vol.33, no.4, pp.969-978, Nov. 2010. 10.1109\/tadvp.2010.2077287","DOI":"10.1109\/TADVP.2010.2077287"},{"key":"8","doi-asserted-by":"publisher","unstructured":"[8] G.-H. Shiue, J.-H. Shiu, Y.-C. Tsai, and C.-M. Hsu, \u201cAnalysis of common-mode noise for weakly coupled differential serpentine delay microstrip Line in high-speed digital circuits,\u201d IEEE Trans. Electromagn. Compat., vol.54, no.3, pp.655-666, June 2012. 10.1109\/temc.2011.2173765","DOI":"10.1109\/TEMC.2011.2173765"},{"key":"9","unstructured":"[9] L.-S. Wu, J.-F. Mao, and W.-Y. Yin, \u201cSlow-wave structure to suppress differential-to-common mode conversion for bend discontinuity of differential signaling,\u201d Proc. 2012 IEEE EDAPS, pp.219-222, Taipei, Taiwan, Dec. 2012. 10.1109\/edaps.2012.6469381"},{"key":"10","doi-asserted-by":"publisher","unstructured":"[10] C.-H. Chang, R.-Y. Fang, and C.-L. Wang, \u201cBended differential transmission line using compensation inductance for common-mode noise suppression,\u201d IEEE Trans. Compon. Packag. Manuf. Technol., vol.2, no.9, pp.1518-1525, Sept. 2012. 10.1109\/tcpmt.2012.2192439","DOI":"10.1109\/TCPMT.2012.2192439"},{"key":"11","doi-asserted-by":"publisher","unstructured":"[11] Y. Kami, \u201cFundamentals of differential-mode transmission,\u201d Journal of Japan Institute of Electronics Packaging (in Japanese), vol.16, no.3, pp.176-180, 2013. 10.5104\/jiep.16.176","DOI":"10.5104\/jiep.16.176"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] T. Matsushima and O. Wada, \u201cReduction of common-mode excitation on a differential transmission line bend by imbalance control,\u201d IEICE Commun. Express, vol.3, no.10, pp.295-299, 2014. 10.1587\/comex.3.295","DOI":"10.1587\/comex.3.295"},{"key":"13","doi-asserted-by":"publisher","unstructured":"[13] Y. Kayano and H. Inoue, \u201cDominant factors of electromagnetic interference problems of asymmetrical and equi-distance differential-paired lines,\u201d Radio Science, vol.50, no.2, pp.111-121, Feb. 2015. 10.1002\/2014rs005507","DOI":"10.1002\/2014RS005507"},{"key":"14","unstructured":"[14] C. Wang, K. Iokibe, and Y. Toyota, \u201cDesign methodology of tightly coupled asymmetrically tapered bend for high-density mounting in differential transmission lines,\u201d Proc. APEMC2016, pp.463-465, May, 2016. 10.1109\/apemc.2016.7522769"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] J. Lou, X. Zhou, S. Li, Y Shu, A. Bhobe, and J. Yu, \u201cA novel differential serpentine delay line to reduce differential to common mode conversion and impedance discontinuity,\u201d Proc. 2017 APEMC, pp.259-261, Seoul, Korea, June 2017. 10.1109\/apemc.2017.7975478","DOI":"10.1109\/APEMC.2017.7975478"},{"key":"16","unstructured":"[16] K. Ogata, State space analysis of control systems, Prentice Hall, NJ, 1967."},{"key":"17","doi-asserted-by":"crossref","unstructured":"[17] C.R. Paul, Analysis of multiconductor transmission lines, second edition, Wiley-Interscience, NJ, 2008.","DOI":"10.1109\/9780470547212"}],"container-title":["IEICE Transactions on Electronics"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transele\/E103.C\/11\/E103.C_2019ESP0010\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,11,7]],"date-time":"2020-11-07T03:11:50Z","timestamp":1604718710000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transele\/E103.C\/11\/E103.C_2019ESP0010\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,11,1]]},"references-count":17,"journal-issue":{"issue":"11","published-print":{"date-parts":[[2020]]}},"URL":"https:\/\/doi.org\/10.1587\/transele.2019esp0010","relation":{},"ISSN":["0916-8524","1745-1353"],"issn-type":[{"value":"0916-8524","type":"print"},{"value":"1745-1353","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,11,1]]}}}