{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T12:47:21Z","timestamp":1780318041979,"version":"3.54.1"},"reference-count":30,"publisher":"Institute of Electronics, Information and Communications Engineers (IEICE)","issue":"10","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEICE Trans. Electron."],"published-print":{"date-parts":[[2021,10,1]]},"DOI":"10.1587\/transele.2021mmp0005","type":"journal-article","created":{"date-parts":[[2021,1,25]],"date-time":"2021-01-25T22:08:58Z","timestamp":1611612538000},"page":"576-586","source":"Crossref","is-referenced-by-count":9,"title":["300-GHz-Band OFDM Video Transmission with CMOS TX\/RX Modules and 40dBi Cassegrain Antenna toward 6G"],"prefix":"10.1587","volume":"E104.C","author":[{"given":"Yohei","family":"MORISHITA","sequence":"first","affiliation":[{"name":"Panasonic Corporation"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sangyeop","family":"LEE","sequence":"additional","affiliation":[{"name":"Hiroshima University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Toshihiro","family":"TERAOKA","sequence":"additional","affiliation":[{"name":"Panasonic Corporation"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ruibing","family":"DONG","sequence":"additional","affiliation":[{"name":"National Institute of Information and Communications Technology"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuichi","family":"KASHINO","sequence":"additional","affiliation":[{"name":"Panasonic System Networks R&D Lab. Co., Ltd."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hitoshi","family":"ASANO","sequence":"additional","affiliation":[{"name":"Panasonic System Networks R&D Lab. Co., Ltd."}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shinsuke","family":"HARA","sequence":"additional","affiliation":[{"name":"National Institute of Information and Communications Technology"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kyoya","family":"TAKANO","sequence":"additional","affiliation":[{"name":"Hiroshima University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kosuke","family":"KATAYAMA","sequence":"additional","affiliation":[{"name":"Hiroshima University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Takenori","family":"SAKAMOTO","sequence":"additional","affiliation":[{"name":"Panasonic Corporation"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Naganori","family":"SHIRAKATA","sequence":"additional","affiliation":[{"name":"Panasonic Corporation"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Koji","family":"TAKINAMI","sequence":"additional","affiliation":[{"name":"Panasonic Corporation"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kazuaki","family":"TAKAHASHI","sequence":"additional","affiliation":[{"name":"Panasonic Corporation"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Akifumi","family":"KASAMATSU","sequence":"additional","affiliation":[{"name":"National Institute of Information and Communications Technology"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Takeshi","family":"YOSHIDA","sequence":"additional","affiliation":[{"name":"Hiroshima University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuhei","family":"AMAKAWA","sequence":"additional","affiliation":[{"name":"Hiroshima University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Minoru","family":"FUJISHIMA","sequence":"additional","affiliation":[{"name":"Hiroshima University"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"532","reference":[{"key":"1","doi-asserted-by":"crossref","unstructured":"[1] E. Dahlman, S. Parkvall, J. Peisa, and H. Tullberg, \u201c5G evolution and beyond,\u201d Int. Workshop on Signal Processing Advances in Wireless Communications, pp.1-5, July 2019. 10.1109\/spawc.2019.8815418","DOI":"10.1109\/SPAWC.2019.8815418"},{"key":"2","doi-asserted-by":"publisher","unstructured":"[2] M. Patzold, \u201c5G sets sail around the globe,\u201d IEEE Veh. Technol. Mag., vol.14, no.2, pp.5-11, June 2019. 10.1109\/mvt.2019.2902773","DOI":"10.1109\/MVT.2019.2902773"},{"key":"3","unstructured":"[3] NTT DOCOMO, \u201c6G White Paper,\u201d https:\/\/www.nttdocomo.co.jp\/binary\/pdf\/corporate\/technology\/whitepaper_6g\/DOCOMO_6G_White_PaperJP_20200820.pdf., July 2020."},{"key":"4","doi-asserted-by":"publisher","unstructured":"[4] G. Ducournau, P. Szriftgiser, A. Beck, D. Bacquet, F. Pavaneloo, E. Peytavit, M. Zaknoune, T. Akalin, and J.-F. 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Wave, vol.36, no.2, pp.221-233, Feb. 2015. 10.1007\/s10762-014-0140-6","DOI":"10.1007\/s10762-014-0140-6"},{"key":"9","doi-asserted-by":"publisher","unstructured":"[9] K. Katayama, K. Takano, S. Amakawa, S. Hara, A. Kasamatsu, K. Mizuno, K. Takahashi, T. Yoshida, and M. Fujishima, \u201cA 300GHz CMOS transmitter with 32-QAM 17.5Gb\/s\/ch capability over six channels,\u201d IEEE J. Solid-State Circuits, vol.51, no.12, pp.3037-3048, Dec. 2016. 10.1109\/jssc.2016.2602223","DOI":"10.1109\/JSSC.2016.2602223"},{"key":"10","doi-asserted-by":"crossref","unstructured":"[10] K. Takano, S. Amakawa, K. Katayama, S. Hara, R. Dong, A. Kasamatsu, I. Hosako, K. Mizuno, K. Takahashi, T. Yoshida, and M. Fujishima, \u201cA 105Gb\/s 300GHz CMOS transmitter,\u201d Int. Solid-State Circuits Conf., pp.308-309, Feb. 2017. 10.1109\/isscc.2017.7870384","DOI":"10.1109\/ISSCC.2017.7870384"},{"key":"11","doi-asserted-by":"crossref","unstructured":"[11] S. Hara, K. Katayama, K. Takano, R. Dong, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, and M. Fujishima, \u201cA 32Gbit\/s 16QAM CMOS receiver in 300GHz band,\u201d IEEE Int. Microw. Symp., pp.1703-1706, June 2017. 10.1109\/mwsym.2017.8058969","DOI":"10.1109\/MWSYM.2017.8058969"},{"key":"12","doi-asserted-by":"publisher","unstructured":"[12] S. Hara, K. Katayama, K. Takano, R. Dong, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, and M. Fujishima, \u201cA 32Gbit\/s CMOS receiver in 300GHz band,\u201d IEICE Trans. Electronics, vol.E101-C, no.7, pp.464-471, July 2018. 10.1587\/transele.e101.c.464","DOI":"10.1587\/transele.E101.C.464"},{"key":"13","doi-asserted-by":"publisher","unstructured":"[13] S. Lee, S. Hara, T. Yoshida, S. Amakawa, R. Dong, A. Kasamatsu, J. Sato, and M. Fujishima, \u201cAn 80-Gb\/s 300-GHz-band single-chip CMOS transceiver,\u201d IEEE J. Solid-State Circuits, vol.54, no.12, pp.3577-3588, Dec. 2019. 10.1109\/jssc.2019.2944855","DOI":"10.1109\/JSSC.2019.2944855"},{"key":"14","doi-asserted-by":"crossref","unstructured":"[14] S. Lee, S. Amakawa, T. Yoshida, Y. Morishita, Y. Kashino, S. Hara, and M. Fujishima, \u201c300-GHz CMOS-Based wireless link using 40-dBi Cassegrain antenna for IEEE Standard 802.15.3d,\u201d IEEE Int. Symp. on Radio-Frequency Integrated Technology, pp.136-138, Sept. 2020. 10.1109\/rfit49453.2020.9226231","DOI":"10.1109\/RFIT49453.2020.9226231"},{"key":"15","doi-asserted-by":"crossref","unstructured":"[15] Y. Morishita, T. Teraoka, Y. Kashino, H. Asano, T. Sakamoto, N. Shirakata, K. Takinami, and K. Takahashi, \u201c300-GHz-Band self-heterodyne wireless system for real-time bideo transmission toward 6G,\u201d IEEE Int. Symp. on Radio-Frequency Integrated Technology, pp.151-153, Sept. 2020. 10.1109\/rfit49453.2020.9226182","DOI":"10.1109\/RFIT49453.2020.9226182"},{"key":"16","unstructured":"[16] K. Matsumoto, Y. Chang, G.K. Tran, and K. Araki, \u201cFrequency domain phase noise compensation employing adaptive algorithms for millimeter-wave OFDM systems,\u201d IEEE Asia-Pacific Microwave Conference, FR1G-35, pp.1262-1264 Nov. 2014."},{"key":"17","doi-asserted-by":"publisher","unstructured":"[17] A.G. Armada, \u201cUnderstanding the effects of phase noise in orthogonal frequency division multiplexing (OFDM),\u201d IEEE Trans. on Broadcasting, vol.47, no.2, pp.153-159, June 2001. 10.1109\/11.948268","DOI":"10.1109\/11.948268"},{"key":"18","unstructured":"[18] J.R. Pelliccio, H. Bachmann, and B.W. Myers, \u201cPhase noise effects on OFDM wireless LAN performance,\u201d Applied Microwave & Wireless, pp.68-81, June 2001."},{"key":"19","unstructured":"[19] Y. Morishita, T. Teraoka, Y. Kashino, H. Asano, T. Sakamoto, N. Shirakata, K. Takinami, and K. Takahashi, \u201cReal-time video transmission with 300-GHz-Band OFDM wireless communication device,\u201d IEICE Technical Report, MW2019-64, pp.49-54, Sept. 2019."},{"key":"20","doi-asserted-by":"publisher","unstructured":"[20] Y. Shoji, K. Hamaguchi, and H. Ogawa, \u201cMillimeter-wave remote self-heterodyne system for extremely stable and low-cost broad-band signal transmission,\u201d IEEE Trans. Microw. Theory Tech., vol.50, no.6, pp.1458-1468, June 2002. 10.1109\/tmtt.2002.1006406","DOI":"10.1109\/TMTT.2002.1006406"},{"key":"21","doi-asserted-by":"publisher","unstructured":"[21] Y. Shoji and H. Ogawa, \u201c70-GHz-band MMIC transceiver with integrated antenna diversity system: application of receiver-module-arrayed self-heterodyne technique,\u201d IEEE Trans. Microw. Theory Tech., vol.52, no.11, pp.2541-2549, Nov. 2004. 10.1109\/tmtt.2004.837160","DOI":"10.1109\/TMTT.2004.837160"},{"key":"22","doi-asserted-by":"crossref","unstructured":"[22] S. Lee, R. Dong, S. Hara, K. Takano, S. Amakawa, T. Yoshida, and M. Fujishima, \u201cA 6-mW-DC-power 300-GHz CMOS receiver for near-field wireless communications,\u201d IEEE Int. Microw. Symp., pp.504-507, June 2019. 10.1109\/mwsym.2019.8700961","DOI":"10.1109\/MWSYM.2019.8700961"},{"key":"23","unstructured":"[23] K. Takano, S. Amakawa, K. Katayama, S. Hara, T. Yoshida, and M. Fujishima, \u201c300GHz CMOS transmitter module for terahertz communicataion,\u201d IEICE Trans. Electron. (Japanese Edition), vol.J102-C, pp.348-355, Dec. 2019."},{"key":"24","doi-asserted-by":"crossref","unstructured":"[24] S. Hara, K. Takano, K. Katayama, R. Dong, K. Mizuno, K. Takahashi, I. Watanabe, N. Sekine, A. Kasamatsu, T. Yoshida, S. Amakawa, and M. Fujishima, \u201c300-GHz CMOS receiver module with WR-3.4 waveguide interface,\u201d Eur. Microw. Conf., pp.396-399, Sep. 2018. 10.23919\/eumc.2018.8541693","DOI":"10.23919\/EuMC.2018.8541693"},{"key":"25","doi-asserted-by":"crossref","unstructured":"[25] K. Takano, K. Katayama, S. Hara, R. Dong, K. Mizuno, K. Takahashi, A. Kasamatsu, T. Yoshida, S. Amakawa, and M. Fujishima, \u201c300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB,\u201d IEEE Radio and Wireless Symp., pp.154-156, Jan. 2018. 10.1109\/rws.2018.8304972","DOI":"10.1109\/RWS.2018.8304972"},{"key":"26","doi-asserted-by":"crossref","unstructured":"[26] S. Amakawa and M. Fujishima, \u201c300-GHz-band CMOS transmitter and receiver modules with WR-3.4 waveguide interface,\u201d IEEE Int. Microw. Conf. on Hardware and Systems for 5G and Beyond, pp.1-3, Aug. 2019. 10.1109\/imc-5g47857.2019.9160369","DOI":"10.1109\/IMC-5G47857.2019.9160369"},{"key":"27","doi-asserted-by":"publisher","unstructured":"[27] T. Tajima, H.-J. Song, and M. Yaita, \u201cDesign and analysis of LTCC-integrated planar microstrip-to-waveguide transition at 300 GHz,\u201d IEEE Trans. Microw. Theory Tech., vol.64, no.1, pp.106-114, Jan. 2016. 10.1109\/tmtt.2015.2504474","DOI":"10.1109\/TMTT.2015.2504474"},{"key":"28","unstructured":"[28] J. Sato, Y. Morishita, and Y. Kashino, \u201cA study of manufacturing accuracy of 300 GHz band cassegrain antenna,\u201d Proc. Society Conf. IEICE, C-2-46, Sept. 2018."},{"key":"29","doi-asserted-by":"crossref","unstructured":"[29] H. Sawada, A. Kanno.N. Yamamoto, K. Fujii, A. Kasamatsu, K. Ishizu, F. Kojima, H. Ogawa, and I. Hosako, \u201cHigh gain antenna characteristics for 300 GHz band fixed wireless communication systems,\u201d Progress in Electromagnetics Research Symp., pp.1409-1412, Nov. 2017. 10.1109\/piers-fall.2017.8293350","DOI":"10.1109\/PIERS-FALL.2017.8293350"},{"key":"30","doi-asserted-by":"publisher","unstructured":"[30] P. Rodr\u00edguez-V\u00e1zquez, J. Grzyb, B. Heinemann, and U.R. Pfeiffer, \u201cA 16-QAM 100-Gb\/s 1-m wireless link with an EVM of 17% at 230 GHz in an SiGe technology,\u201d IEEE Microwave Wireless Compon. Lett., vol.29, no.4, pp.297-299, April 2019. 10.1109\/lmwc.2019.2899487","DOI":"10.1109\/LMWC.2019.2899487"}],"container-title":["IEICE Transactions on Electronics"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transele\/E104.C\/10\/E104.C_2021MMP0005\/_pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,12,13]],"date-time":"2022-12-13T09:32:01Z","timestamp":1670923921000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.jstage.jst.go.jp\/article\/transele\/E104.C\/10\/E104.C_2021MMP0005\/_article"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,1]]},"references-count":30,"journal-issue":{"issue":"10","published-print":{"date-parts":[[2021]]}},"URL":"https:\/\/doi.org\/10.1587\/transele.2021mmp0005","relation":{},"ISSN":["0916-8524","1745-1353"],"issn-type":[{"value":"0916-8524","type":"print"},{"value":"1745-1353","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,10,1]]},"article-number":"2021MMP0005"}}